Integrated circuit package system flip chip
An integrated circuit package system includes: providing a substrate having a top side with a trace conductor connected to a bottom side with a system interconnect; forming a bump ring on the substrate, the bump ring having an inner cavity area over the trace conductor and an outer bump area; applying a substrate mask layer adjacent a perimeter of the outer bump area; connecting a device to the trace conductor below the bump ring; and applying a compound between the device and the substrate.
1. A method for manufacturing an integrated circuit package system comprising:
providing a substrate having a top side with a trace conductor connected to a bottom side with a system interconnect;
forming a bump ring, composed of non-conductive material, having an inner cavity area on the substrate with an outer bump area exposed and the trace conductor exposed through the inner cavity area;
applying a substrate mask layer adjacent a perimeter of the outer bump area;
connecting a device with a device interconnect in the inner cavity area surrounded by the non-conductive material of the bump ring; and
applying a compound between the device and the substrate, the compound conformally encloses the bump ring.
2. The method as claimed in claim 1 further comprising attaching the device interconnect of the device to the trace conductor below the bump ring.
3. The method as claimed in claim 1 further comprising attaching the device interconnect connected to the trace conductor below the bump ring to the device.
4. The method as claimed in claim 1 wherein applying the compound consists of applying an underfill between the device and the substrate.
5. The method as claimed in claim 1 wherein providing a substrate having a top side with a trace conductor formed having non-restrictive layout orientations connected to a bottom side with a system interconnect.
6. A method for manufacturing an integrated circuit package system comprising:
providing a substrate having a top side with a trace conductor connected to a bottom side with a system interconnect adjacent a base mask layer;
forming a bump ring, composed of non-conductive material, having an inner cavity area on the top side of the substrate with an outer bump area exposed and portions of the trace conductor exposed through the inner cavity area;
applying a substrate mask layer adjacent a perimeter of the outer bump area over the trace conductor or a prepreg layer located outside the outer bump area on the top side of the substrate;
connecting a device with a device interconnect in the inner cavity area surrounded by the non-conductive material of the bump ring; and
applying a compound between the device and the outer bump area on the top side of the substrate, the compound conformally encloses the bump ring.
7. The method as claimed in claim 6 further comprising attaching the device interconnect of the device to the trace conductor within the inner cavity area of the bump ring.
8. The method as claimed in claim 6 further comprising attaching the device interconnect connected to the trace conductor on to the device, the device interconnect is located within the inner cavity area of the bump ring.
9. The method as claimed in claim 6 wherein applying the compound consists of applying an underfill between the device and the substrate surrounding the outer bump area formed by the bump ring.
10. The method as claimed in claim 6 wherein providing a substrate having a top side with a trace conductor formed having non-restrictive layout orientations within a plane parallel to the top planar surface of the substrate connected to a bottom side with a system interconnect adjacent a base mask layer.
11. An integrated circuit package system comprising:
a substrate having a top side with a trace conductor connected to a bottom side with a system interconnect;
a bump ring of non-conductive material formed having an inner cavity area on the substrate with an outer bump and the trace conductor exposed through the inner cavity area;
a substrate mask layer applied adjacent the perimeter of the outer bump area;
a device over the substrate mask layer;
a device interconnected in the inner cavity surrounded by the non-conductive material of the bump ring and connected to the device; and
a compound applied between the device and the substrate, the compound conformally encloses the bump ring.
12. The system as claimed in claim 11 wherein the device interconnect of the device is attached to the trace conductor below the bump ring.
13. The system as claimed in claim 11 wherein the device interconnect is connected to the trace conductor below the bump ring attached to the device.
14. The system as claimed in claim 11 wherein the compound consists of an underfill applied between the device and the substrate.
15. The system as claimed in claim 11 wherein the trace conductor of the top side of the substrate is formed having non-restrictive layout orientations connected to the bottom side with a system interconnect.
16. The system as claimed in claim 11 wherein:
the substrate having the top side with the trace conductor connected to the bottom side with the system interconnect formed adjacent a base mask layer;
the bump ring formed having the outer bump area and the inner cavity area on the top side of the substrate, portions of the trace conductor exposed through the inner cavity area of the bump ring;
the substrate mask layer applied adjacent the perimeter of the outer bump area over the trace conductor or a prepreg layer located outside the outer bump area on the top side of the substrate;
the device connected over the substrate to the trace conductor below the inner core area of the bump ring; and
the compound applied between the device and the outer bump area on the top side of the substrate.
17. The system as claimed in claim 16 wherein the device interconnect of the device is attached to the trace conductor within the inner cavity area of the bump ring.
18. The system as claimed in claim 16 wherein the device interconnect connected to the trace conductor is attached on to the device, the device interconnect is located within the inner cavity area of the bump ring.
19. The system as claimed in claim 16 wherein the compound consists of an underfill applied between the device and the substrate surrounding the outer bump area formed by the bump ring.
20. The system as claimed in claim 16 wherein trace conductor of the top side of the substrate is formed having non-restrictive layout orientations within a plane parallel to the top planar surface of the substrate connected to the bottom side with a system interconnect.