Drop-mold conformable material as an encapsulation for an integrated circuit package system

1. An integrated circuit package system comprising:

providing an integrated circuit;

mounting a lead on the periphery of the integrated circuit;

connecting the integrated circuit to the lead with an interconnect;

forming a conformable material by pressing the conformable material on the integrated circuit, the lead, and the interconnect;

attaching a stiffener to a buffer layer with an adhesive layer; and

attaching the buffer layer to the conformable material.

2. The system as claimed in claim 1 further comprising:

attaching a stiffener to the conformable material.

3. The system as claimed in claim 1 further comprising:

attaching a stiffener to the conformable material with an adhesive layer.

4. The system as claimed in claim 1 further comprising:

attaching a stiffener having a protrusion to the conformable material and having the protrusion in contact with the integrated circuit.

5. The system as claimed in claim 1 further comprising:

mounting the integrated circuit to a die pad having a half-etched portion.

6. The system as claimed in claim 1 wherein:

mounting a lead includes forming the half-etched portion along a side and bottom of the lead, along a side and upper surface of the lead, or a combination thereof.

7. The system as claimed in claim 1 further comprising:

mounting an external interconnect to the lead.

8. The system as claimed in claim 1 further comprising:

connecting the lead to the stiffener with a conductive interconnection.

9. An integrated circuit package system comprising:

an integrated circuit;

a lead mounted on the periphery of the integrated circuit;

an interconnect connecting the integrated circuit to the lead;

a conformable material pressed on the integrated circuit, the lead, and the interconnect;

a stiffener attached to a buffer layer with an adhesive layer; and

wherein:

the buffer layer is attached to the conformable material.

10. The system as claimed in claim 9 further comprising:

a stiffener attached to the conformable material.

11. The system as claimed in claim 9 further comprising:

a stiffener attached to the conformable material with an adhesive layer.

12. The system as claimed in claim 9 further comprising:

a stiffener having a protrusion attached to the conformable material and having the protrusion in contact with the integrated circuit.

13. The system as claimed in claim 9 wherein:

the lead has a half-etched portion; and

the interconnect connecting the integrated circuit to the lead is a bond wire, a solder ball, or a combination thereof.

14. The system as claimed in claim 13 further comprising:

a die pad having a half-etched portion mounted to the integrated circuit.

15. The system as claimed in claim 13 wherein:

the half-etched portion is formed along a side and bottom of the lead, along a side and upper surface of the lead, or a combination thereof.

16. The system as claimed in claim 13 further comprising:

an external interconnect mounted to the lead.

17. The system as claimed in claim 13 further comprising:

a conductive interconnection connecting the lead to the stiffener.