Integrated circuit package system and method of package stacking
View Patent ↗A method of manufacturing an integrated circuit package system including: providing a circuit board having an interconnect thereon; mounting a first device offset on the circuit board; and applying a first encapsulant of a first thickness over the first device, the first encapsulant of a second thickness thinner than the first thickness over the remainder of the circuit board with the interconnect exposed, or a second encapsulant of a third thickness over a second device on an opposite surface of the circuit board and differently offset from the first device.
1. A method of manufacturing for an integrated circuit package system comprising:
providing a circuit board having an interconnect thereon;
mounting device between a central cross-section of and a far edge of the circuit board; and
applying an encapsulant having a thickness over the device and another thickness offset from the device, the thickness directly covers the central cross-section and extends to the far edge, the another thickness directly covers the circuit board from the central cross-section to an edge of the circuit board opposite and facing away from the far edge.
2. The method as claimed in claim 1 wherein:
mounting the device includes mounting the device having connectivity with the circuit board.
3. The method as claimed in claim 1 further comprising:
connecting a stacking interconnect to the opposite surface of the circuit board between a central cross-section of the circuit board and an end of the circuit board.
4. The method as claimed in claim 1 further comprising:
connecting a stacking interconnect to any location on the opposite surface of the circuit board.
5. The method as claimed in claim 1 wherein connecting the interconnect between a central cross-section of the circuit board and an end of the circuit board.
6. A method of manufacturing for an integrated circuit package system comprising:
providing a circuit board with a contact having an interconnect thereon;
mounting a device between a central cross-section of and a far edge of a surface of the circuit board; and
applying an encapsulant having a thickness over the device and another thickness offset from the device, the thickness directly covers the surface of the central cross-section and extends to the far edge, the another thickness directly covers the circuit board from the central cross-section to an edge of the circuit board opposite and facing away from the far edge.
7. The method as claimed in claim 6 wherein:
mounting the device includes connecting the device to the circuit board.
8. The method as claimed in claim 6 further comprising:
connecting a stacking interconnect to the contact adjacent the second surface located between a plane perpendicular and bisecting the central cross-section of the circuit board and the end of the circuit board.
9. The method as claimed in claim 6 further comprising:
connecting a stacking interconnect to any of the contact located adjacent the second surface.
10. The method as claimed in claim 6 wherein connecting the interconnect to the contact adjacent the circuit board between a plane perpendicular and bisecting a central cross-section of the circuit board and an end of the circuit board.
11. An integrated circuit package system comprising:
a circuit board having an interconnect thereon;
a device mounted between a central cross-section of and a far edge of the circuit board; and
an encapsulant applied having a thickness over the device and another thickness offset from the device, the thickness directly covers the central cross-section and extends to the far edge, the another thickness directly covers the circuit board from the central cross-section to an edge of the circuit board opposite and facing away from the far edge.
12. The system as claimed in claim 11 wherein:
the device mounted includes the device having connectivity with the circuit board.
13. The system as claimed in claim 11 further comprising:
a stacking interconnect connected to the opposite surface of the circuit board between a central cross-section of the circuit board and an end of the circuit board.
14. The system as claimed in claim 11 further comprising:
a stacking interconnect connected to any location on the opposite surface of the circuit board.
15. The system as claimed in claim 11 wherein the interconnect connected between a central cross-section of the circuit board and an end of the circuit board.
16. The system as claimed in claim 11 wherein:
the device mounted between a central cross-section of and a far edge of a surface of the circuit board; and
an encapsulant applied having a thickness over the device and another thickness offset from the device, the thickness directly covers the surface of the central cross-section and extends to the far edge, the another thickness directly covers the circuit board from the central cross-section to an edge of the circuit board opposite and facing away from the far edge.
17. The system as claimed in claim 16 wherein:
the device mounted includes the device connected to the circuit board.
18. The system as claimed in claim 16 further comprising:
a stacking interconnect connected to the contact adjacent the second surface located between a plane perpendicular and bisecting the central cross-section of the circuit board and the end of the circuit board.
19. The system as claimed in claim 16 further comprising:
a stacking interconnect connected to any of the contact located adjacent the second surface of the circuit board.
20. The system as claimed in claim 16 wherein the interconnect connected to the contact adjacent the circuit board between a plane perpendicular and bisecting a central cross-section of the circuit board and an end of the circuit board.