Leadframe design for QFN package with top terminal leads
A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top portion. The top portion forms a top terminal lead structure. A second lead finger is electrically connected to the first lead finger. A portion of the second lead finger forms a bottom terminal lead structure. A portion of the second lead finger corresponds to a bottom surface of the semiconductor package. A surface of the substantially flat, top portion corresponds to a top surface of the semiconductor package.
1. A leadframe for a semiconductor package, comprising:
a first lead finger including,
a lower portion,
a connecting portion that extends vertically upward from the lower portion, and
a top terminal coupled to the connecting portion and configured to be coplanar with a top surface of the semiconductor package, the top terminal extending over the lower portion of the first lead finger; and
a second lead finger electrically connected to the first lead finger, a portion of the second lead finger forming a bottom terminal configured to be coplanar with a bottom surface of the semiconductor package opposite the top surface of the semiconductor package, a maximum package height existing between the top and bottom surfaces of the semiconductor package, and a portion of the bottom terminal etched to reduce an area of the bottom terminal.
2. The leadframe of claim 1 , further including a dambar structure coupled to the first lead finger which is singulated during a manufacturing step.
3. The leadframe of claim 1 , further including a wire bond coupled between the first and second lead fingers to provide electrical connectivity.
4. The leadframe of claim 1 , wherein the first lead finger is bent in a manufacturing step to form a pivot in the first lead finger.
5. The leadframe of claim 1 , wherein the first lead finger further includes an offset tab structure integrated into the first lead finger at a first end, the offset tab structure configured to align the top terminal with the bottom terminal.
6. A leadframe for a semiconductor package, comprising:
a first lead finger having a lower portion, a connecting portion extending vertically upward from the lower portion, and a top portion forming a top terminal configured to be coplanar with a top surface of the semiconductor package; and
a second lead finger electrically connected to the first lead finger, a portion of the second lead finger forming a bottom terminal configured to be coplanar with a bottom surface of the semiconductor package opposite the top surface of the semiconductor package, a maximum package height existing between the top and bottom surfaces of the semiconductor package, wherein a portion of the second lead finger is etched to reduce an area of the bottom terminal.
7. The leadframe of claim 6 , further including a dambar structure coupled to the first lead finger which is singulated during a manufacturing step.
8. The leadframe of claim 6 , further including a wire bond coupled between the first and second lead fingers to provide electrical connectivity.
9. The leadframe of claim 6 , wherein the first lead finger is bent in a manufacturing step to form a pivot in the first lead finger.
10. The leadframe of claim 6 , wherein the first lead finger further includes an offset tab structure integrated into the top portion, the offset tab structure configured to align the top terminal with the bottom terminal.
11. The leadframe of claim 6 , wherein the top lead structure extends over the lower portion of the first lead finger.
12. A leadframe for a semiconductor package, comprising:
a first lead finger electrically connected to a conductive bar, the first lead finger having a lower portion, a connecting portion, and a top lead structure, the top lead structure extending over the lower portion of the first lead finger; and
a second lead finger connected to the first lead finger and the conductive bar to serve as a lower lead structure for the semiconductor package.
13. The leadframe of claim 12 , wherein a portion of the second lead finger is etched to reduce an exposed surface of the second lead finger.
14. The leadframe of claim 12 , wherein the lower lead structure corresponds to a bottom surface of the semiconductor package.
15. The leadframe of claim 12 , wherein the first and second lead fingers are wire bonded to provide electrical connectivity.
16. The leadframe of claim 12 , wherein the top lead structure corresponds to a top surface of the semiconductor package.
17. The leadframe of claim 12 , further including a dambar structure coupled to the first lead finger which is singulated during a manufacturing step.
18. A leadframe for a semiconductor package, comprising:
a first lead finger having a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat top portion, the top portion forming a top lead structure exposed at a top surface of the semiconductor package, the top surface being substantially flat and disposed over a semiconductor die; and
a second lead finger electrically connected to the first lead finger, a portion of the second lead finger forming a bottom lead structure exposed at a bottom surface of the semiconductor package, the bottom surface being substantially flat and disposed under the semiconductor die.
19. The leadframe of claim 12 , wherein the first lead finger further includes an offset tab structure integrated into the first lead finger at a first end, the offset tab structure configured to align the top lead structure with the lower lead structure.
20. The leadframe of claim 18 , wherein the first lead finger further includes an offset tab structure integrated into the first lead finger at a first end, the offset tab structure configured to align the top lead structure with the bottom lead structure.
21. The leadframe of claim 18 , wherein a portion of the second lead finger is etched to reduce an exposed surface of the second lead finger.
22. The leadframe of claim 18 , wherein the first and second lead fingers are wire bonded to provide electrical connectivity.
23. The leadframe of claim 18 , further including a dambar structure coupled to the first lead finger which is singulated during a manufacturing step.
24. The leadframe of claim 18 , wherein the top lead structure extends over the lower portion of the first lead finger.
25. The leadframe of claim 18 , wherein the first lead finger is bent in a manufacturing step to form a pivot in the first lead finger.