INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF
A method of manufacture of an integrated circuit packaging system includes: attaching an integrated circuit having a through via over a substrate with the through via coupled to the substrate; attaching a conductive support over the substrate and adjacent to the integrated circuit; forming an encapsulation over the substrate with the conductive support exposed from the encapsulation; and attaching an external interconnect under the substrate.
1 . A method of manufacture of an integrated circuit packaging system comprising:
attaching an integrated circuit having a through via over a substrate with the through via coupled to the substrate;
attaching a conductive support over the substrate and adjacent to the integrated circuit;
forming an encapsulation over the substrate with the conductive support exposed from the encapsulation; and
attaching an external interconnect under the substrate.
2 . The method as claimed in claim 1 wherein:
attaching the integrated circuit includes facing an active side of the integrated circuit to the substrate; and
forming the encapsulation includes exposing a mounting pad coupled to the through via at a non-active side of the integrated circuit.
3 . The method as claimed in claim 1 further comprising:
attaching a second device interconnect to a mounting pad coupled to the through via at a non-active side of the integrated circuit; and
wherein:
forming the encapsulation includes exposing the second device interconnect from the encapsulation.
4 . The method as claimed in claim 1 further comprising attaching a non-laminated redistribution structure over the encapsulation includes electrically coupling the conductive support and the through via, at a non-active side of the integrated circuit, to the non-laminated redistribution structure.
5 . The method as claimed in claim 1 further comprising:
attaching a second device interconnect to a mounting pad coupled to the through via at a non-active side of the integrated circuit; and
attaching a non-laminated redistribution structure over the encapsulation includes electrically coupling the conductive support and the second device interconnect.
6 . A method of manufacture of an integrated circuit packaging system comprising:
attaching an integrated circuit, having a through via and a first device interconnect, over a substrate with the first device interconnect between the through via and the substrate;
attaching a conductive support over the substrate and adjacent to the integrated circuit;
forming an encapsulation over the substrate covering the first device interconnect with the conductive support exposed from encapsulation; and
attaching an external interconnect under the substrate.
7 . The method as claimed in claim 6 further comprising attaching a non-laminated redistribution structure over the encapsulation includes:
electrically coupling the conductive support and the through via, at a non-active side of the integrated circuit, to the non-laminated redistribution structure; and
forming a redistribution edge of the non-laminated redistribution structure coplanar with a vertical side of the encapsulation and a substrate edge of the substrate.
8 . The method as claimed in claim 6 wherein:
forming the encapsulation includes exposing a second device interconnect coupled to the through via at a non-active side of the integrated circuit; and further comprising:
mounting a first device over the second device interconnect and the conductive support.
9 . The method as claimed in claim 6 wherein:
forming the encapsulation includes exposing a mounting pad coupled to the through via at a non-active side of the integrated circuit; and
further comprising:
mounting a first device having a first through channel over the mounting pad and the conductive support; and
mounting a second device having a second through channel over the first through channel.
10 . The method as claimed in claim 6 wherein attaching the integrated circuit, having the through via and the first device interconnect, over the substrate includes attaching a flip chip over the substrate.
11 . An integrated circuit packaging system comprising:
a substrate;
an integrated circuit having a through via over the substrate with the through via coupled to the substrate;
a conductive support over the substrate and adjacent to the integrated circuit;
an encapsulation over the substrate with the conductive support exposed from the encapsulation; and
an external interconnect attached under the substrate.
12 . The system as claimed in claim 11 wherein:
the integrated circuit includes an active side facing the substrate; and
the encapsulation exposes a mounting pad coupled to the through via at a non-active side of the integrated circuit.
13 . The system as claimed in claim 11 further comprising:
a second device interconnect attached to a mounting pad coupled to the through via at a non-active side of the integrated circuit; and
wherein:
the encapsulation exposes the second device interconnect.
14 . The system as claimed in claim 11 further comprising a non-laminated redistribution structure attached over the encapsulation includes the conductive support and the through via, at a non-active side of the integrated circuit, attached to the non-laminated redistribution structure.
15 . The system as claimed in claim 11 further comprising:
a second device interconnect attached to a mounting pad coupled to the through via at a non-active side of the integrated circuit; and
a non-laminated redistribution structure attached to the encapsulation includes the conductive support electrically coupled to the second device interconnect.
16 . The system as claimed in claim 11 wherein:
the integrated circuit includes a first device interconnect between the through via and the substrate; and
the encapsulation covers the first device interconnect.
17 . The system as claimed in claim 16 further comprising a non-laminated redistribution structure attached to the encapsulation includes:
the conductive support and the through via, at a non-active side of the integrated circuit, electrically coupled to the non-laminated redistribution structure; and
a redistribution edge of the non-laminated redistribution structure coplanar with a vertical side of the encapsulation and a substrate edge of the substrate.
18 . The system as claimed in claim 16 wherein:
the encapsulation exposes a second device interconnect coupled to the through via at a non-active side of the integrated circuit; and
further comprising:
a first device over the second device interconnect and the conductive support.
19 . The system as claimed in claim 16 wherein:
the encapsulation exposes a mounting pad coupled to the through via at a non-active side of the integrated circuit; and
further comprising:
a first device having a first through channel over the mounting pad and the conductive support; and
a second device having a second through channel over the first through channel.
20 . The system as claimed in claim 16 wherein the integrated circuit, having the through via and the first device interconnect, over the substrate includes a flip chip over the substrate.