Integrated circuit packaging system with package-on-package and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a component over the base substrate; attaching a component interconnect to the base substrate and a perimeter of the component; mounting a stack device over the component; attaching a base exposed interconnect directly on the component and next to the component interconnect; and forming a base encapsulation over the base substrate, the component, and the component interconnect, the base exposed interconnect partially exposed from the base encapsulation.
1. An integrated circuit packaging system comprising:
a base substrate;
a component attached to the base substrate;
a component interconnect attached to the base substrate and a perimeter of the component;
a stack device interconnect attached to the component;
a stack device over the component, the stack device having a stack device active surface including active circuitry and attached to the stack device interconnect;
a base exposed interconnect directly on the component and next to the component interconnect, the base exposed interconnect being a different material than the stack device interconnect;
a base encapsulation over the base substrate, the component, and the component interconnect, the base exposed interconnect partially exposed from the base encapsulation; and
a stack integrated circuit package on the base exposed interconnect, the stack integrated circuit package not in contact with the base encapsulation.
2. The system as claimed in claim 1 wherein the base exposed interconnect includes the base exposed interconnect adjacent the stack device.
3. The system as claimed in claim 1 wherein the base exposed interconnect includes the base exposed interconnect along the perimeter of the component.
4. The system as claimed in claim 1 wherein the base exposed interconnect includes a metal post on the component.
5. The system as claimed in claim 1 further comprising another of the stack device over the component and adjacent the stack device.
6. The system as claimed in claim 1 further comprising a discrete component over the component.
7. The system as claimed in claim 1 further comprising a base device over the base substrate, the component over the base device.
8. The system as claimed in claim 1 wherein:
the base encapsulation includes a cavity, the component partially exposed from the base encapsulation in the cavity; and
the stack device includes the stack device in the cavity and over the component.
9. The system as claimed in claim 1 further comprising a stack external interconnect on the stack device, the stack integrated circuit package electrically connected to the stack device by the stack external interconnect.