High voltage high package pressure semiconductor package
View Patent ↗A hermetically sealed integrated circuit package that includes a cavity housing a semiconductor die, whereby the cavity is pressurized during assembly and when formed. The invention prevents the stress on a package created when the package is subject to high temperatures at atmospheric pressure and then cooled from reducing the performance of the die at high voltages. By packaging a die at a high pressure, such as up to 50 PSIG, in an atmosphere with an inert gas, and providing a large pressure in the completed package, the dies are significantly less likely to arc at higher voltages, allowing the realization of single die packages operable up to at least 1200 volts. Moreover, the present invention is configured to employ brazed elements compatible with Silicon Carbide dies which can be processed at higher temperatures.
1. A packaged microelectronic high power device for reducing arcing between a package and a die, comprising:
the die including a high power device, wherein the die has a top major surface and a bottom major surface;
a package including a cavity defined by a first pad and a second pad and having the die disposed therebewteen, wherein the bottom major surface of the die is coupled to the second pad; and
a spacer coupled between the first pad and the top major surface of the die;
wherein the cavity is filled with an inert gas and pressurized above 0 PSIG.
2. The packaged microelectronic device as specified in claim 1 wherein the cavity is hermetically sealed.
3. The packaged microelectronic device as specified in claim 1 wherein the die is silicon.
4. The packaged microelectronic device as specified in claim 1 wherein the die is Silicon Carbide, further comprising at least one braze material coupled to the die.
5. The packaged microelectronic device as specified in claim 1 , wherein a first braze material is brazed to the top major surface and a second braze material is brazed to the bottom major surface.
6. The packaged microelectronic device as specified in claim 1 wherein the die is configured to operate at a voltage of at least 500 V.
7. The packaged microelectronic device as specified in claim 1 , wherein the die is comprised of a transient voltage suppressor.
8. The packaged microelectronic device as specified in claim 2 wherein the cavity is pressurized at 10 PSIG or above.
9. The packaged microelectronic device as specified in claim 2 , wherein the cavity is pressurized at 50 PSIG.
10. The packaged microelectronic device as specified in claim 6 wherein the die is configured to operate at a voltage of at least 800 V.
11. The packaged microelectronic device as specified in claim 6 wherein the die is configured to operate at a voltage of at least 1200 V.
12. The packaged microelectronic device as specified in claim 6 , wherein a first braze material is brazed to the top major surface and a second braze material is brazed to the bottom major surface.
13. A packaged microelectronic high power device for reducing arcing between a package and a die, comprising:
the die including a high power device, wherein the die has a top major surface and a bottom major surface;
a package including a cavity defined by a first pad that includes molybdenum and a second pad that includes molybdenum and having the die disposed therebetween, wherein the bottom major surface of the die is coupled to the second pad; and
a spacer that includes tungsten coupled to the first pad and the top major surface of the die;
wherein the cavity is hermetically sealed, filled with an inert gas, and pressurized within a range between 10 and 50 PSIG.
14. The packaged microelectronic high power device of claim 13 , wherein the die is silicon.
15. The packaged microelectronic high power device of claim 13 , wherein the die is silicon carbide, further comprising at least one braze material coupled to the die.
16. The packaged microelectronic high power device of claim 13 , wherein a first braze material is brazed to the top major surface and a second braze material is brazed to the bottom major surface.
17. The packaged microelectronic high power device of claim 13 , wherein the die is configured to operate at a voltage of at least 500 V.
18. The packaged microelectronic high power device of claim 13 , wherein the die is configured to operate at a voltage of at least 800 V.
19. The packaged microelectronic high power device of claim 13 , wherein the die is configured to operate at a voltage of at least 1200 V.