Integrated circuit packaging system with stacking option and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

fabricating a base package substrate having a component side and a system side;

coupling a first integrated circuit die on the component side;

coupling stacking interconnects on the component side around the first integrated circuit die;

forming a package body on the component side, the first integrated circuit die, and the stacking interconnects;

forming non-horizontal insertion cavities through the package body and on the stacking interconnects; and

forming a trench, in the package body, the trench continuously surrounding a central region of the package body and adjacent to the non-horizontal insertion cavities for reducing a package warping stress.

2. The method as claimed in claim 1 wherein forming the trench includes positioning the trench between the non-horizontal insertion cavities and the first integrated circuit die.

3. The method as claimed in claim 1 wherein forming the trench includes positioning the trench around the non-horizontal insertion cavities and the first integrated circuit die.

4. The method as claimed in claim 1 wherein forming the trench includes removing a portion of the package body to a level below a surface of the first integrated circuit die.

5. The method as claimed in claim 1 further comprising dividing an integrated circuit packaging system assembly strip having a notch.

6. A method of manufacture of an integrated circuit packaging system comprising:

fabricating a base package substrate having a component side and a system side including forming a component pad on the component side and a system pad on the system side;

coupling a first integrated circuit die on the component side including coupling a chip interconnect between the first integrated circuit die and the component pad;

coupling stacking interconnects on the component side around the first integrated circuit die;

forming a package body on the component side, the first integrated circuit die, and the stacking interconnects including injection molding an epoxy molding compound;

forming non-horizontal insertion cavities through the package body and on the stacking interconnects including exposing a top of the stacking interconnect; and

forming a trench, in the package body, the trench continuously surrounding a central region of the package body and adjacent to the non-horizontal insertion cavities for reducing a package warping stress including reducing a deformation height of the base package substrate.

7. The method as claimed in claim 6 wherein forming the trench includes positioning the trench between the non-horizontal insertion cavities and the first integrated circuit die including reducing a convex warped state of the base package substrate.

8. The method as claimed in claim 6 wherein forming the trench includes positioning the trench around the non-horizontal insertion cavities and the first integrated circuit die including reducing a concave warped state of the base package substrate.

9. The method as claimed in claim 6 wherein forming the trench includes removing a portion of the package body to a level below a surface of the first integrated circuit die including exposing a portion of the component side.

10. The method as claimed in claim 6 further comprising dividing an integrated circuit packaging system assembly strip having a notch.

11. An integrated circuit packaging system comprising:

a base package substrate having a component side and a system side;

a first integrated circuit die coupled on the component side;

stacking interconnects on the component side coupled around the first integrated circuit die;

a package body formed on the component side, the first integrated circuit die, and the stacking interconnects;

non-horizontal insertion cavities through the package body and on the stacking interconnects; and

a trench, in the package body, the trench continuously surrounding a central region of the package body and adjacent to the non-horizontal insertion cavities for reducing a deformation height.

12. The system as claimed in claim 11 wherein the trench, in the package body, includes the trench positioned between the non-horizontal insertion cavities and the first integrated circuit die.

13. The system as claimed in claim 11 wherein the trench, in the package body, includes the trench around the non-horizontal insertion cavities and the first integrated circuit die.

14. The system as claimed in claim 11 wherein the trench, in the package body, includes a portion of the package body removed to a level below a surface of the first integrated circuit die.

15. The system as claimed in claim 11 further comprising an adhesive material between the component side and the first integrated circuit die to enclose chip interconnects.

16. The system as claimed in claim 11 further comprising:

component pads on the component side and system pads on the system side;

chip interconnects between the first integrated circuit die and the component pads;

epoxy molding compound is the package body; and

a top of the stacking interconnect exposed by the non-horizontal insertion cavities.

17. The system as claimed in claim 16 wherein the trench, in the package body, includes the trench positioned between the non-horizontal insertion cavities and the first integrated circuit die for reducing a convex warped state of the base package substrate.

18. The system as claimed in claim 16 wherein the trench, in the package body, includes the trench around the non-horizontal insertion cavities and the first integrated circuit die for reducing a concave warped state of the base package substrate.

19. The system as claimed in claim 16 wherein the trench, in the package body, includes a portion of the package body removed to a level below a surface of the first integrated circuit die and a portion of the component side exposed in the trench.

20. The system as claimed in claim 16 further comprising system interconnects coupled to the system pads of the base package substrate.