Package-on-package using through-hole via die on saw streets
A semiconductor package-on-package (PoP) device includes a first die incorporating a through-hole via (THV) disposed along a peripheral surface of the first die. The first die is disposed over a substrate or leadframe structure. A first semiconductor package is electrically connected to the THV of the first die, or electrically connected to the substrate or leadframe structure. An encapsulant is formed over a portion of the first die and the first semiconductor package.
1. A semiconductor device, comprising:
a first semiconductor die singulated from a semiconductor wafer as a first singulated semiconductor die, the first singulated semiconductor die including a plurality of first contact pads;
a first organic material deposited in a peripheral region outside a footprint of the first singulated semiconductor die over a side surface remaining from singulation and extending from a first surface of the first singulated semiconductor die to a second surface of the first singulated semiconductor die opposite the first surface;
a plurality of first conductive vias formed through the first organic material in the peripheral region outside the footprint of the first singulated semiconductor die;
a plurality of conductive traces formed over the first singulated semiconductor die respectively between the first conductive vias and first contact pads;
a plurality of first bumps formed over the first conductive vias or the first singulated semiconductor die; and
a second semiconductor die disposed over the first singulated semiconductor die and electrically connected to the first bumps.
2. The semiconductor device of claim 1 , further including a plurality of bond wires connected between second contact pads formed over the first singulated semiconductor die and second conductive vias formed through the first organic material.
3. The semiconductor device of claim 1 , wherein the second semiconductor die includes:
a second organic material deposited in a peripheral region of the second semiconductor die; and
a plurality of second conductive vias formed through the second organic material.
4. The semiconductor device of claim 3 , wherein the second semiconductor die further includes:
a plurality of second bumps formed over the second conductive vias or the second semiconductor die; and
an encapsulant deposited over a portion of the second bumps.
5. The semiconductor device of claim 1 , further including a third semiconductor die disposed over the first singulated semiconductor die.
6. The semiconductor device of claim 1 , further including an encapsulant deposited over the first singulated semiconductor die while a portion of the first singulated semiconductor die remains exposed.
7. A semiconductor device, comprising:
a first semiconductor die including an opening in a peripheral region adjacent to the first semiconductor die;
an organic material deposited in the opening in the peripheral region to cover a side surface of the first semiconductor die;
a plurality of first conductive vias formed through the organic material in the peripheral region adjacent to the first semiconductor die;
a first interconnect structure formed over the first conductive vias or the first semiconductor die; and
a first encapsulant deposited over the first interconnect structure.
8. The semiconductor device of claim 7 , further including:
a contact pad formed over the first semiconductor die; and
a conductive trace formed over the first semiconductor die.
9. The semiconductor device of claim 7 , further including
a second semiconductor die disposed adjacent to the first semiconductor die, the organic material deposited in the peripheral region adjacent to the second semiconductor die.
10. The semiconductor device of claim 9 , wherein the second semiconductor die further includes
a second interconnect structure formed over the second semiconductor die.
11. The semiconductor device of claim 7 , wherein the first conductive vias adjacent to the first semiconductor die include half vias.
12. The semiconductor device of claim 7 , wherein a portion of the first semiconductor die is exposed from the first encapsulant.
13. The semiconductor device of claim 7 , wherein the first interconnect structure includes a plurality of bumps.
14. A semiconductor device, comprising:
a first semiconductor die singulated from a semiconductor wafer;
a first organic material deposited in a peripheral region of the first semiconductor die;
a first conductive via formed through the first organic material in the peripheral region of the first semiconductor die;
a first interconnect structure formed over the first conductive via or the first semiconductor die; and
a second semiconductor die disposed over the first semiconductor die.
15. The semiconductor device of claim 14 , further including an encapsulant deposited over the first interconnect structure.
16. The semiconductor device of claim 15 , wherein a portion of the first semiconductor die is exposed from the encapsulant.
17. The semiconductor device of claim 14 , further including:
a contact pad formed over the first semiconductor die; and
a conductive trace formed over the first semiconductor die.
18. The semiconductor device of claim 14 , wherein the second semiconductor die includes:
a second organic material deposited in a peripheral region of the second semiconductor die; and
a second conductive via formed through the second organic material.
19. The semiconductor device of claim 18 , wherein the second semiconductor die further includes:
a second interconnect structure formed over the second conductive via or the second semiconductor die; and
an encapsulant deposited over the second interconnect structure.
20. The semiconductor device of claim 14 , wherein the first interconnect structure includes a plurality of bumps.
21. A semiconductor device, comprising a plurality of stacked semiconductor die each including:
an organic material deposited around a peripheral region of the semiconductor die;
a plurality of conductive vias formed through the organic material; and
an interconnect structure formed over the conductive vias or the semiconductor die.
22. The semiconductor device of claim 21 , further including an encapsulant deposited over the interconnect structure.
23. The semiconductor device of claim 22 , wherein a portion of the semiconductor die is exposed from the encapsulant.
24. The semiconductor device of claim 21 , further including:
a contact pad formed over the semiconductor die; and
a conductive trace formed over the semiconductor die.
25. The semiconductor device of claim 21 , wherein the interconnect structure includes a plurality of bumps.
26. A semiconductor device, comprising:
a first semiconductor die;
a first organic material deposited in a peripheral region of the first semiconductor die;
a first conductive via formed through the first organic material; and
a first interconnect structure formed over the first conductive via.
27. The semiconductor device of claim 26 , further including a second semiconductor die disposed over the first semiconductor die.
28. The semiconductor device of claim 27 , wherein the second semiconductor die includes:
a second organic material deposited in a peripheral region of the second semiconductor die; and
a second conductive via formed through the second organic material.
29. The semiconductor device of claim 26 , further including an encapsulant deposited over the first interconnect structure.
30. The semiconductor device of claim 29 , wherein a portion of the first semiconductor die is exposed from the encapsulant.