Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material
A semiconductor device has a flipchip or PoP semiconductor die mounted to a die attach area interior to a substrate. The substrate has a contact pad area around the die attach area and flow control area between the die attach area and contact pad area. A first channel is formed in a surface of the substrate within the flow control area. The first channel extends around a periphery of the die attach area. A first dam material is formed adjacent to the first channel within the flow control area. An underfill material is deposited between the die and substrate. The first channel and first dam material control outward flow of the underfill material to prevent excess underfill material from covering the contact pad area. A second channel can be formed adjacent to the first dam material. A second dam material can be formed adjacent to the first channel.
1. A method of making a semiconductor device, comprising:
providing a substrate including a die attach area interior to the substrate and contact pad area around the die attach area and flow control area between the die attach area and contact pad area on a surface of the substrate;
forming a first channel extending into the surface of the substrate within the flow control area;
forming a first dam material above the surface of the substrate adjacent to the first channel within the flow control area;
disposing a semiconductor die over the die attach area of the substrate; and
depositing an underfill material between the semiconductor die and substrate, wherein the first channel and first dam material control outward flow of the underfill material to prevent excess underfill material from covering the contact pad area.
2. The method of claim 1 , further including forming the first dam material between the first channel and die attach area.
3. The method of claim 1 , further including forming the first dam material between the first channel and contact pad area.
4. The method of claim 1 , further including forming a second channel adjacent to the first dam material within the flow control area.
5. The method of claim 1 , further including forming a second dam material adjacent to the first channel within the flow control area.
6. The method of claim 1 , wherein the semiconductor die is a flipchip type semiconductor die or package-on-package semiconductor device.
7. A method of making a semiconductor device, comprising:
providing a substrate including a die attach area interior to the substrate and contact pad area around the die attach area and flow control area between the die attach area and contact pad area;
forming a first channel in the substrate within the flow control area;
forming a first dam material over the substrate adjacent to the first channel within the flow control area;
disposing a semiconductor die over the die attach area of the substrate; and
depositing an underfill material between the semiconductor die and substrate, wherein the first channel and first dam material control outward flow of excess underfill material.
8. The method of claim 7 , further including forming the first dam material between the first channel and die attach area.
9. The method of claim 7 , further including forming the first dam material between the first channel and contact pad area.
10. The method of claim 7 , further including forming a second dam material adjacent to the first channel within the flow control area.
11. The method of claim 7 , wherein the first channel extends around a periphery of the die attach area.
12. The method of claim 7 , wherein the semiconductor die is a flipchip type semiconductor die or package-on-package semiconductor device.
13. The method of claim 7 , further including forming a second channel adjacent to the first dam material within the flow control area.
14. A method of making a semiconductor device, comprising:
providing a substrate including a die attach area interior to the substrate and contact pad area around the die attach area and flow control area between the die attach area and contact pad area;
forming a first channel in the substrate within the flow control area;
forming first dam material adjacent to the first channel within the flow control area;
forming a second channel adjacent to the first dam material within the flow control area;
disposing a semiconductor die over the die attach area of the substrate; and
depositing an underfill material between the semiconductor die and substrate, wherein the first channel and first dam material control outward flow of excess underfill material to prevent the underfill material from covering the contact pad area.
15. A method of making a semiconductor device, comprising:
providing a substrate including a die attach area;
forming a first channel in the substrate around the die attach area;
forming a first dam material over the substrate adjacent to the first channel;
disposing a semiconductor die over the die attach area of the substrate; and
depositing an underfill material between the semiconductor die and substrate, wherein the first channel and first dam material control outward flow of excess underfill material.
16. The method of claim 15 , further including forming the first dam material between the first channel and die attach area.
17. The method of claim 15 , wherein the substrate includes a contact pad area around the die attach area.
18. The method of claim 17 , further including forming the first dam material between the first channel and contact pad area.
19. The method of claim 15 , further including forming a second channel adjacent to the first dam material.
20. The method of claim 15 , wherein the first channel extends around a periphery of the die attach area.
21. The method of claim 15 , further including forming a second dam material adjacent to the first channel.
22. A method of making a semiconductor device, comprising:
providing a substrate including a die attach area;
forming a first channel in the substrate around the die attach area;
forming first dam material adjacent to the first channel;
forming second dam material adjacent to the first channel;
disposing a semiconductor die over the die attach area of the substrate; and
depositing an underfill material between the semiconductor die and substrate, wherein the first channel and first dam material control outward flow of excess underfill material.
23. A semiconductor device, comprising:
a substrate including a die attach area and contact pad area around the die attach area;
a first channel formed in the substrate between the die attach area and contact pad area;
a first dam material formed over the substrate adjacent to the first channel between the die attach area and contact pad area;
a semiconductor die disposed over the die attach area of the substrate; and
an underfill material deposited between the semiconductor die and substrate, wherein the first channel and first dam material control outward flow of excess underfill material.
24. The semiconductor device of claim 23 , wherein the first dam material is formed between the first channel and die attach area.
25. The semiconductor device of claim 23 , wherein the first dam material is formed between the first channel and contact pad area.
26. The semiconductor device of claim 23 , further including a second channel formed adjacent to the first dam material.
27. The semiconductor device of claim 23 , further including a second dam material formed adjacent to the first channel.