Integrated circuit packaging system with stack interconnect and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: forming a connection carrier having base device pads and base interconnect pads on a carrier top side of the connection carrier; connecting a base integrated circuit to the base device pads and mounted over the carrier top side; mounting base vertical interconnects directly on the base interconnect pads; attaching a base package substrate to the base integrated circuit and directly on the base vertical interconnects; forming a base encapsulation on the base package substrate, the base device pads, and the base interconnect pads; and removing a portion of the connection carrier with the base device pads and the base interconnect pads partially exposed opposite the base package substrate.
1. An integrated circuit packaging system comprising:
base device pads having device pad surfaces coplanar to each other characteristic of being formed on a carrier top side of a connection carrier;
base interconnected pads having interconnect pad surfaces coplanar to each other characteristic of being formed on the carrier top side;
a base integrated circuit connected to the base device pads;
base vertical interconnects directly on the base interconnect pads;
a base package substrate attached to the base integrated circuit and directly on the base vertical interconnects;
a base encapsulation on the base package substrate, the base device pads, and the base interconnect pads, the base encapsulation partially exposing the base device pads and the base interconnect pads opposite the base package substrate; and
base external interconnects attached to a base substrate bottom side of the base package substrate, wherein the base encapsulation includes a step portion over the base integrated circuit, the base encapsulation partially exposing the base device pads at the step portion.
2. The system as claimed in claim 1 further comprising base device connectors connected to the base integrated circuit and the base device pads.
3. The system as claimed in claim 1 further comprising conductive traces connected to the base device pads and the base interconnect pads.
4. The system as claimed in claim 1 wherein the base interconnect pads surround the base device pads.
5. The system as claimed in claim 1 wherein the base encapsulation includes an external planar surface of the base encapsulation coplanar with device pad surfaces of the base device pads and interconnect pad surfaces of the base interconnect pads.
6. The system as claimed in claim 1 further comprising a base component connected to the base package substrate and attached to the base integrated circuit.
7. An integrated circuit packaging system comprising:
base device pads having device pad surfaces coplanar to each other characteristic of being formed on a carrier top side of a connection carrier;
base interconnect pads having interconnect pad surfaces coplanar to each other characteristic of being formed on the carrier top side;
a base integrated circuit connected to the base device pads;
base vertical interconnects mounted directly on the base interconnect pads;
a base package substrate attached to the base integrated circuit and directly on the base vertical interconnects;
a base encapsulation on the base package substrate, the base device pads, and the base interconnect pads, the base encapsulation partially exposing the base device pads and the base interconnect pads opposite the base package substrate; and
base external interconnects attached to a base substrate bottom side of the base package substrate, wherein the base encapsulation includes a recess over the base integrated circuit, the base encapsulation partially exposing the base device pads within the recess.
8. The system as claimed in claim 1 further comprising a stack component connected to the base device pads.
9. The system as claimed in claim 7 further comprising base device connectors connected to the base integrated circuit and the base device pads.
10. The system as claimed in claim 7 further comprising conductive traces connected to the base device pads and the base interconnect pads.
11. The system as claimed in claim 7 wherein the base interconnect pads surround the base device pads.
12. The system as claimed in claim 7 wherein the base encapsulation includes an external planar surface of the base encapsulation coplanar with device pad surfaces of the base device pads and interconnect pad surfaces of the base interconnect pads.
13. The system as claimed in claim 7 further comprising a base component connected to the base package substrate and attached to the base integrated circuit.
14. The system as claimed in claim 7 further comprising a stack component connected to the base device pads.