Integrated circuit packaging system with foldable substrate and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a package substrate having a foldable segment, a base segment, and a stack segment;

connecting a base substrate connector directly on the base segment;

connecting a stack substrate connector directly on the stack segment;

mounting a base integrated circuit over the base segment with the base substrate connector outside a perimeter of the base integrated circuit;

forming an encapsulation over the base integrated circuit including forming the encapsulation having a recess partially exposing the base substrate connector; and

folding the package substrate with the stack segment over the base segment and the stack substrate connector directly on the base substrate connector and package substrate within the recess.

2. The method as claimed in claim 1 further comprising attaching a substrate attach layer to the stack segment and the encapsulation.

3. The method as claimed in claim 1 wherein providing the package substrate includes providing the package substrate having the base segment with a length equal to a length of the stack segment, the package substrate having the foldable segment with a length greater than a length equal to a combination of a base height of the base substrate connector and a stack height of the stack substrate connector.

4. The method as claimed in claim 1 further comprising forming the base substrate connector having a base height greater than a stack height of the stack substrate connector, the base height greater than half of an inward surface distance of the package substrate.

5. An integrated circuit packaging system comprising:

a package substrate having a foldable segment, a base segment, and a stack segment;

a base substrate connector directly on the base segment;

a stack substrate connector directly on the stack segment;

a base integrated circuit over the base segment with the base substrate connector outside a perimeter of the base integrated circuit, the stack segment folded over the base segment, and the stack substrate connector directly on the base substrate connector;

an encapsulation over the base integrated circuit, the encapsulation includes a recess partially exposing the base substrate connector; and

the stack substrate connector is directly on the base substrate connector within the recess.

6. The system as claimed in claim 5 further comprising a substrate attach layer attached to the stack segment.

7. The system as claimed in claim 5 wherein the package substrate includes the base segment having a length equal to a length of the stack segment.

8. The system as claimed in claim 5 wherein the base substrate connector includes a base height greater than a stack height of the stack substrate connector.

9. The system as claimed in claim 5 further comprising a substrate attach layer attached to the stack segment and the encapsulation.

10. The system as claimed in claim 5 wherein the package substrate includes the base segment with a length equal to a length of the stack segment, the package substrate having the foldable segment with a length greater than a length equal to a combination of a base height of the base substrate connector and a stack height of the stack substrate connector.

11. The system as claimed in claim 5 wherein the base substrate connector includes a base height greater than a stack height of the stack substrate connector, the base height greater than half of an inward surface distance of the package substrate.