Integrated circuit packaging system with stack interconnect and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a substrate base side and a substrate stack side; mounting an integrated circuit over the substrate stack side; attaching a stack connector to the substrate stack side; forming an encapsulation over the stack connector and the integrated circuit; attaching an external connector to the substrate base side; attaching an adhesive tape to the external connector having spacing between the adhesive tape and the substrate base side; cutting a step portion in the encapsulation to expose the stack connector; cutting a singulation kerf in the package substrate having exit damage on the substrate base side; and removing the adhesive tape.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a package substrate having a substrate base side and a substrate stack side;
mounting an integrated circuit over the substrate stack side;
attaching a stack connector to the substrate stack side;
forming an encapsulation over the stack connector and the integrated circuit;
attaching external connectors to the substrate base side;
attaching an adhesive tape to the external connectors having spacing between the adhesive tape and the substrate base side;
cutting a step portion in the encapsulation to expose the stack connector after attaching the adhesive tape to the external connectors;
cutting a singulation kerf in the package substrate; and
removing the adhesive tape.
2. The method as claimed in claim 1 wherein cutting the step portion includes cutting the step portion in the encapsulation having a protrusion surrounded by the step portion.
3. The method as claimed in claim 1 wherein cutting the step portion includes cutting the step portion in the encapsulation to expose the stack connector having a stack end coplanar with a step top side of the step portion.
4. The method as claimed in claim 1 wherein cutting the step portion includes cutting the step portion in the encapsulation having a protrusion extending from a step top side of the step portion.
5. The method as claimed in claim 1 wherein attaching the stack connector includes attaching stack connectors to the substrate stack side.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a package substrate having a substrate base side and a substrate stack side;
mounting an integrated circuit over the substrate stack side;
connecting a device connector to the integrated circuit and the substrate stack side;
attaching a stack connector to the substrate stack side;
forming an encapsulation over the stack connector and the integrated circuit;
attaching external connectors to the substrate base side;
attaching an adhesive tape to the external connectors having spacing between the adhesive tape and the substrate base side;
cutting a step portion in the encapsulation to expose the stack connector after attaching the adhesive tape to the external connectors;
cutting a singulation kerf in the package substrate; and
removing the adhesive tape.
7. The method as claimed in claim 6 wherein cutting the step portion includes cutting the step portion in the encapsulation having a protrusion surrounded by the step portion and over the device connector.
8. The method as claimed in claim 6 wherein cutting the step portion includes cutting the step portion in the encapsulation to expose the stack connector having a stack end coplanar with a step top side of the step portion, the stack connector adjacent the device connector.
9. The method as claimed in claim 6 wherein cutting the step portion includes cutting the step portion in the encapsulation having a protrusion covering the integrated circuit and extending from a step top side of the step portion.
10. The method as claimed in claim 6 wherein:
attaching the stack connector includes attaching stack connectors to the substrate stack side; and
cutting the step portion includes cutting the step portion in the encapsulation having a protrusion surrounded by the stack connectors.