Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a package substrate having a package substrate bottom side, a package substrate top side, and a package substrate window;

mounting a base integrated circuit over the package substrate, the base integrated circuit having a base inactive side and a base active side facing the package substrate top side;

attaching a lower internal connector to the base active side and the package substrate bottom side, the lower internal connector through the package substrate window;

forming an upper insulation conformal to the base integrated circuit and the package substrate top side, the upper insulation having an upper insulation top side above the base integrated circuit, the upper insulation having an upper insulation cavity at the upper insulation top side and in the upper insulation, wherein the upper insulation cavity provides spacing for mounting a top package within the upper insulation cavity and over the base integrated circuit;

forming a peripheral through-insulation connector through the upper insulation, the peripheral through-insulation connector having a straight non-horizontal side within the upper insulation, a peripheral connector bottom side directly on the package substrate top side, and a peripheral connector top side coplanar with the upper insulation top side, wherein the base integrated circuit is below the peripheral connector top side and exposed from the upper insulation within the upper insulation cavity; and

mounting a top structure, having a top substrate, on the peripheral through-insulation connector, a top component attached to a top substrate bottom side of the top structure and partially within the upper insulation cavity.

2. The method as claimed in claim 1 wherein forming the upper insulation includes forming the upper insulation having the upper insulation cavity exposing the base inactive side.

3. The method as claimed in claim 1 further comprising forming a central through-insulation connector through the upper insulation and over the base inactive side.

4. The method as claimed in claim 1 wherein forming the upper insulation includes forming the upper insulation with the base inactive side fully exposed from the upper insulation.

5. The method as claimed in claim 1 further comprising attaching a stack structure to the peripheral connector top side.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a package substrate having a package substrate bottom side, a package substrate top side, and a package substrate window;

mounting a base integrated circuit over the package substrate, the base integrated circuit having a base inactive side and a base active side facing the package substrate top side;

attaching a lower internal connector to the base active side and the package substrate bottom side;

forming a lower insulation over the lower internal connector and the base integrated circuit;

forming an upper insulation conformal to the base integrated circuit and the package substrate top side, the upper insulation having an upper insulation top side above the base integrated circuit, the upper insulation having an upper insulation cavity at the upper insulation top side and in the upper insulation, wherein the upper insulation cavity provides spacing for mounting a top package within the upper insulation cavity and over the base integrated circuit;

forming a peripheral through-insulation connector through the upper insulation, the peripheral through-insulation connector having a straight non-horizontal side within the upper insulation, a peripheral connector bottom side directly on the package substrate top side, and a peripheral connector top side coplanar with the upper insulation top side, wherein the base integrated circuit is below the peripheral connector top side and exposed from the upper insulation within the upper insulation cavity; and

mounting a top structure, having a top substrate, on the peripheral through-insulation connector, a top component attached to a top substrate bottom side of the top structure and partially within the upper insulation cavity.

7. The method as claimed in claim 6 further comprising connecting a stack integrated circuit to the base integrated circuit.

8. The method as claimed in claim 6 wherein mounting the top structure having the top component includes mounting the to structure over the upper insulation cavity.

9. The method as claimed in claim 6 wherein mounting the top structure having the top substrate bottom side on the peripheral through-insulation connector includes mounting the top structure with a top component active side connected to the top substrate bottom side, and a top component inactive side facing the base integrated circuit.

10. The method as claimed in claim 6 wherein mounting the top structure having the top substrate bottom side on the peripheral through-insulation connector includes mounting the top structure with a top component inactive side attached to the top substrate bottom side, and a top component active side facing the base integrated circuit.

11. An integrated circuit packaging system comprising:

a package substrate having a package substrate bottom side, a package substrate top side, and a package substrate window;

a base integrated circuit over the package substrate, the base integrated circuit having a base inactive side and a base active side facing the package substrate top side;

a lower internal connector attached to the base active side and the package substrate bottom side, the lower internal connector through the package substrate window;

an upper insulation conformal to the base integrated circuit and the package substrate top side, the upper insulation having an upper insulation top side above the base integrated circuit, the upper insulation having an upper insulation cavity at the upper insulation top side and in the upper insulation, wherein the upper insulation cavity provides spacing for mounting a top package within the upper insulation cavity and over the base integrated circuit;

a peripheral through-insulation connector through the upper insulation, the peripheral through-insulation connector having a straight non-horizontal side within the upper insulation, a peripheral connector bottom side directly on the package substrate top side, and a peripheral connector top side coplanar with the upper insulation top side, wherein the base integrated circuit is below the peripheral connector top side and exposed from the upper insulation within the upper insulation cavity;

a top structure, having a top substrate, connected to the peripheral through-insulation connector; and

a top component attached to a to substrate bottom side of the top structure and partially within the upper insulation cavity.

12. The system as claimed in claim 11 wherein the upper insulation includes the upper insulation cavity exposing the base inactive side.

13. The system as claimed in claim 11 further comprising a central through-insulation connector through the upper insulation and over the base inactive side.

14. The system as claimed in claim 11 wherein the upper insulation fully exposes the base inactive side.

15. The system as claimed in claim 11 further comprising a stack structure attached to the peripheral connector top side.

16. The system as claimed in claim 11 further comprising a lower insulation over the lower internal connector and the base integrated circuit.

17. The system as claimed in claim 16 further comprising a stack integrated circuit connected to the base integrated circuit.

18. The system as claimed in claim 16 wherein the top structure and the top component are over the upper insulation cavity.

19. The system as claimed in claim 16 wherein:

the top substrate has the top substrate bottom side over the peripheral through-insulation connector;

a top component active side of the top component is connected to the top substrate bottom side; and

a top component inactive side of the top component is facing the base integrated circuit.

20. The system as claimed in claim 16 wherein:

the top substrate has the top substrate bottom side over the peripheral through-insulation connector;

a top component inactive side of the top component is attached to the top substrate bottom side; and

a top component active side of the top component is facing the base integrated circuit.