Package stacking system with mold contamination prevention and method for manufacturing thereof

1. A method for manufacturing a package stacking system comprising:

providing a package substrate;

mounting an integrated circuit over the package substrate;

forming a step-down interposer over the integrated circuit, the step-down interposer including a pattern of external component contacts originating from a center of the step-down interposer; and

molding a stack package body, having a step profile, on the package substrate and the step-down interposer.

2. The method as claimed in claim 1 further comprising coupling an electrical interconnect between the package substrate and the step-down interposer.

3. The method as claimed in claim 1 further comprising coupling a flip chip integrated circuit to the step-down interposer.

4. The method as claimed in claim 1 further comprising coupling a first integrated circuit package to the step-down interposer.

5. The method as claimed in claim 1 further comprising coupling an oversized integrated circuit package to the step-down interposer.

6. A package stacking system comprising:

a package substrate;

an integrated circuit over the package substrate;

a step-down interposer over the integrated circuit, the step-down interposer including a pattern of external component contacts originating from a center of the step-down interposer; and

a stack package body, having a step profile, molded on the package substrate and the step-down interposer.

7. The system as claimed in claim 6 further comprising an electrical interconnect between the package substrate and the step-down interposer.

8. The system as claimed in claim 6 further comprising a flip chip integrated circuit coupled to the step-down interposer.

9. The system as claimed in claim 6 further comprising a first integrated circuit package coupled to the step-down interposer.

10. The system as claimed in claim 6 further comprising an oversized integrated circuit package coupled to the step-down interposer.