INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF
A method of manufacture of an integrated circuit packaging system includes: forming a base package having a base integrated circuit over a base substrate; stacking a mountable device over the base package with a flow channel between the mountable device and the base package; and forming an external lead having a lead platform and a lead leg, the lead platform extending from the mountable device and the lead leg parallel to the base package.
1 . A method of manufacture of an integrated circuit packaging system comprising:
forming a base package having a base integrated circuit over a base substrate;
stacking a mountable device over the base package with a flow channel between the mountable device and the base package; and
forming an external lead having a lead platform and a lead leg, the lead platform extending from the mountable device and the lead leg parallel to the base package.
2 . The method as claimed in claim 1 wherein:
forming the base package includes forming a base encapsulation having a base recess; and
stacking the mountable device includes stacking the mountable device over the base encapsulation and in the base recess.
3 . The method as claimed in claim 1 wherein stacking the mountable device includes stacking the mountable device having a mountable integrated circuit and a mountable paddle, the mountable integrated circuit mounted over the mountable paddle.
4 . The method as claimed in claim 1 wherein stacking the mountable device includes stacking the mountable device with the external lead extending below a horizontal plane of the base substrate.
5 . The method as claimed in claim 1 wherein stacking the mountable device includes stacking the mountable device having a mountable paddle exposed along a side of the mountable encapsulation facing away from the base package.
6 . A method of manufacture of an integrated circuit packaging system comprising:
forming a base package having a base integrated circuit over a base substrate;
stacking a mountable device, having a mountable encapsulation, over the base package with a flow channel between the mountable encapsulation and the base package; and
forming an external lead having a lead platform and a lead leg, the lead platform extending from the mountable device and over the base package and the lead leg parallel to the base package.
7 . The method as claimed in claim 6 further comprising stacking a top package over the mountable device and connected to the lead platform.
8 . The method as claimed in claim 6 wherein stacking the mountable device includes stacking the mountable device with the external lead connected to the base substrate.
9 . The method as claimed in claim 6 wherein forming the base package includes forming the base package having a base encapsulation including a base recess bounded by a base shoulder.
10 . The method as claimed in claim 6 further comprising:
a base circuit device mounted over the base substrate; and
wherein:
the base integrated circuit is mounted over the base circuit device.
11 . An integrated circuit packaging system comprising:
a base package having a base integrated circuit over a base substrate;
a mountable device stacked over the base package with a flow channel between the mountable device and the base package; and
an external lead having a lead platform and a lead leg, the lead platform extending from the mountable device and the lead leg parallel to the base package.
12 . The system as claimed in claim 11 wherein:
the base package includes a base encapsulation having a base recess; and
the mountable device includes the mountable device over the base encapsulation and in the base recess.
13 . The system as claimed in claim 11 wherein the mountable device includes a mountable integrated circuit and a mountable paddle, the mountable integrated circuit mounted over the mountable paddle.
14 . The system as claimed in claim 11 wherein the lead leg of the external lead extends below a horizontal plane of the base substrate.
15 . The system as claimed in claim 11 wherein the mountable device includes a mountable paddle exposed along a side of the mountable encapsulation facing away from the base package.
16 . The system as claimed in claim 11 wherein:
the mountable device includes a mountable encapsulation with the flow channel between the mountable encapsulation and the base package; and
the lead platform of the external lead is over the base package.
17 . The system as claimed in claim 16 further comprising a top package stacked over the mountable device and connected to the lead platform.
18 . The system as claimed in claim 16 wherein the external lead is connected to the base substrate.
19 . The system as claimed in claim 16 wherein the base package includes a base encapsulation having a base recess bounded by a base shoulder.
20 . The system as claimed in claim 16 further comprising:
a base circuit device mounted over the base substrate; and
wherein:
the base integrated circuit is mounted over the base circuit device.