INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHOD OF MANUFACTURE THEREOF
An integrated circuit packaging system and method of manufacture thereof includes: a substrate; a first module attached to the substrate; a conductive connection built on the first module and conductively connected thereto; an adhesive spacer on the first module with the conductive connection exposed; and a second module on the adhesive spacer in conductive contact with the conductive connection and partially supported thereby.
1 . A method of manufacture of an integrated circuit packaging system comprising:
attaching a first module to a substrate;
building a conductive connection on the first module and conductively connected thereto;
placing an adhesive spacer on the first module with the conductive connection exposed; and
placing a second module on the adhesive spacer in conductive contact with the conductive connection and partially supported thereby.
2 . The method as claimed in claim 1 wherein building the conductive connection conductively connects the first module to the substrate.
3 . The method as claimed in claim 1 wherein building the conductive connection conductively connects the conductive connection to the substrate closer to the first module than to the second module.
4 . The method as claimed in claim 1 further comprising cutting the adhesive spacer from a film.
5 . The method as claimed in claim 1 further comprising encapsulating the first and second modules and the conductive connection.
6 . A method of manufacture of an integrated circuit packaging system comprising:
attaching a first module to a substrate, the first module and the substrate each having bond pads;
building conductive connections of bumps and bonds on the bond pads of the first module and conductively connected thereto;
placing an adhesive spacer on the first module between two of the bond pads with the conductive connections exposed; and
placing a second module on the adhesive spacer in conductive contact with the conductive connections and partially supported thereby.
7 . The method as claimed in claim 6 wherein building the conductive connection includes a bond wire conductively connecting the first module and the second module to the substrate.
8 . The method as claimed in claim 6 wherein building the conductive connection includes a bond wire conductively connecting the conductive connection to the substrate closer to the first module than to the second module.
9 . The method as claimed in claim 6 further comprising cutting the adhesive spacer from an adhesive material or adhesive-coated film.
10 . The method as claimed in claim 6 further comprising encapsulating the first and second modules, the conductive connections, and the bond pads.
11 . An integrated circuit packaging system comprising:
a substrate;
a first module attached to the substrate;
a conductive connection built on the first module and conductively connected thereto;
an adhesive spacer on the first module with the conductive connection exposed; and
a second module on the adhesive spacer in conductive contact with the conductive connection and partially supported thereby.
12 . The system as claimed in claim 11 wherein the conductive connection conductively connects the first module to the substrate.
13 . The system as claimed in claim 11 wherein the conductive connection conductively connects the conductive connection to the substrate closer to the first module than to the second module.
14 . The system as claimed in claim 11 further comprising the adhesive spacer having characteristics of being cut from a film.
15 . The system as claimed in claim 11 further comprising an encapsulation encapsulating the first and second modules and the conductive connection.
16 . The system as claimed in claim 11 wherein:
the first module and the substrate each have bond pads;
the conductive connections are built of bumps and bonds on the bond pads of the first module and are conductively connected thereto; and
the adhesive spacer is on the first module between two of the bond pads with the conductive connections exposed.
17 . The system as claimed in claim 16 wherein the conductive connection includes a bond wire conductively connecting the first module and the second module to the substrate.
18 . The system as claimed in claim 16 wherein the conductive connection includes a bond wire conductively connecting the conductive connection to the substrate closer to the first module than to the second module.
19 . The system as claimed in claim 16 further comprising the adhesive spacer has characteristics of being cut from an adhesive material or adhesive-coated film.
20 . The system as claimed in claim 16 further comprising an encapsulant encapsulating the first and second modules, the conductive connections, and the bond pads.