Method for manufacture of inline integrated circuit system
View Patent ↗A method for manufacture of an integrated circuit package system includes: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.
1. A method for manufacture of an integrated circuit package system comprising:
providing an integrated circuit;
encapsulating the integrated circuit with an encapsulation;
providing a leadframe having a central portion and side rails,
mounting the integrated circuit above the central portion of the leadframe;
mounting an etch barrier below the leadframe with the etch barrier protecting the side rails; and
etching the central portion of the leadframe leaving the side rails substantially intact.
2. The method as claimed in claim 1 wherein:
mounting the etch barrier below the leadframe includes mounting a tape below the leadframe.
3. The method as claimed in claim 1 wherein:
mounting the etch barrier below the leadframe includes mounting photoresist below the leadframe.
4. The method as claimed in claim 1 wherein:
mounting the etch barrier below the leadframe includes mounting a guide rail below the leadframe.
5. The method as claimed in claim 1 wherein:
mounting the etch barrier below the leadframe includes mounting a mold part below the leadframe.