Method for manufacturing wafer scale heat slug system
View Patent ↗A method for manufacturing a wafer scale heat slug system includes: dicing an integrated circuit from a semiconductor wafer; forming a heat slug blank equivalent in size to the semiconductor wafer; dicing the heat slug blank to produce a heat slug equivalent in size to the integrated circuit; attaching the integrated circuit to a substrate; attaching the heat slug to the integrated circuit; and encapsulating the integrated circuit.
1. A method for manufacturing a wafer scale heat slug system comprising:
dicing an integrated circuit from a semiconductor wafer;
forming a heat slug blank equivalent in size to the semiconductor wafer;
dicing the heat slug blank to produce a heat slug equivalent in size to the integrated circuit;
attaching the integrated circuit to a substrate;
attaching the heat slug to the integrated circuit; and
encapsulating the integrated circuit.
2. The method as claimed in claim 1 further comprising using a thermal interface material between the heat slug and the integrated circuit.
3. The method as claimed in claim 1 wherein forming the heat slug blank equivalent in size to the semiconductor wafer comprises cold forging or chemically etching a blank sheet of thermally conductive material.
4. The method as claimed in claim 1 further comprising:
forming the heat slug blank included forming a heat slug with a heat slug pedestal; and
attaching the heat slug by the heat slug pedestal to the integrated circuit.
5. The method as claimed in claim 1 further comprising attaching a heat spreader to the integrated circuit, mounted as a flip chip on the substrate.
6. The method as claimed in claim 1 wherein dicing the heat slug blank includes mounting the heat slug blank on a wafer frame.
7. The method as claimed in claim 1 further comprising providing a dicing tape bonded between the wafer frame and the heat slug blank.