Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch
A semiconductor device has a semiconductor die with an active surface. A first conductive layer is formed over the active surface. A first insulating layer is formed over the active surface. A second insulating layer is formed over the first insulating layer and first conductive layer. A portion of the second insulating layer is removed over the first conductive layer so that no portion of the second insulating layer overlies the first conductive layer. A second conductive layer is formed over the first conductive layer and first and second insulating layers. The second conductive layer extends over the first conductive layer up to the first insulating layer. Alternatively, the second conductive layer extends across the first conductive layer up to the first insulating layer on opposite sides of the first conductive layer. A third insulating layer is formed over the second conductive layer and first and second insulating layers.
1. A method of making a semiconductor device, comprising:
providing a semiconductor die including an active surface;
forming a first conductive layer over the active surface of the semiconductor die;
forming a first insulating layer over the active surface of the semiconductor die;
forming a second insulating layer over the first insulating layer and first conductive layer;
removing a portion of the second insulating layer over the first conductive layer so that no portion of the second insulating layer overlies the first conductive layer;
forming a second conductive layer over a portion of the first conductive layer and over the first and second insulating layers and including a width over the first conductive layer that is less than a width of the first conductive layer; and
forming a third insulating layer over the second conductive layer and first and second insulating layers.
2. The method of claim 1 , wherein the second conductive layer extends over the first conductive layer up to the first insulating layer.
3. The method of claim 1 , wherein the second conductive layer extends across the first conductive layer up to the first insulating layer on opposite sides of the first conductive layer.
4. The method of claim 1 , wherein the second conductive layer extends across the first conductive layer up to the first insulating layer on opposite sides of the first conductive layer in a direction perpendicular to an adjacent first conductive layer.
5. The method of claim 1 , wherein a contact interface between the first conductive layer and second conductive layer is at least 20 micrometers.
6. The method of claim 1 , wherein a pitch of the first conductive layer ranges from 30-50 micrometers.
7. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming a first conductive layer over a surface of the semiconductor die;
forming a first insulating layer over the first conductive layer and over the semiconductor die;
forming a second insulating layer over the first conductive layer and first insulating layer;
removing a portion of the second insulating layer over the first conductive layer so that no portion of the second insulating layer overlies the first conductive layer; and
forming a second conductive layer over the first insulating layer and a portion of the first conductive layer.
8. The method of claim 7 , further including forming a third insulating layer over the second conductive layer.
9. The method of claim 7 , wherein the second conductive layer extends over the first conductive layer up to the first insulating layer.
10. The method of claim 7 , wherein the second conductive layer extends across the first conductive layer up to the first insulating layer on opposite sides of the first conductive layer.
11. The method of claim 7 , wherein the second conductive layer extends across the first conductive layer up to the second insulating layer on opposite sides of the first conductive layer in a direction perpendicular to an adjacent first conductive layer.
12. The method of claim 7 , wherein a contact interface between the first conductive layer and second conductive layer is at least 20 micrometers.
13. The method of claim 7 , wherein a pitch of the first conductive layer ranges from 30-50 micrometers.
14. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming a first conductive layer over the semiconductor die;
forming a first insulating layer over the semiconductor die;
forming an opening in the first insulating layer over the first conductive layer such that no portion of the first insulating layer overlies the first conductive layer; and
forming a second conductive layer over the first conductive layer, the second conductive layer including a width over the first conductive layer that is less than a width of the first conductive layer.
15. The method of claim 14 , further including forming a second insulating layer over the semiconductor die and the first conductive layer.
16. The method of claim 15 , wherein the second conductive layer extends over the first conductive layer up to the second insulating layer.
17. The method of claim 15 , wherein the second conductive layer extends across the first conductive layer up to the second insulating layer on opposite sides of the first conductive layer in a direction perpendicular to an adjacent first conductive layer.
18. The method of claim 14 , wherein a contact interface between the first conductive layer and second conductive layer is at least 20 micrometers.
19. The method of claim 14 , wherein a pitch of the first conductive layer ranges from 30-50 micrometers.
20. A semiconductor device, comprising:
a semiconductor die;
a first conductive layer formed over a surface of the semiconductor die;
a first insulating layer formed over the first conductive layer and over the surface of the semiconductor die; and
a second conductive layer electrically connected to and extending across the first conductive layer up to a first side of the first insulating layer without extending past the first side of the first insulating layer.
21. The semiconductor device of claim 20 , further including a second insulating layer formed over the first insulating layer, wherein no portion of the second insulating layer overlies the first conductive layer.
22. The semiconductor device of claim 20 , wherein the second conductive layer extends across the first conductive layer up to the first insulating layer on opposite sides of the first conductive layer in a direction perpendicular to an adjacent first conductive layer.
23. The semiconductor device of claim 20 , wherein a contact interface between the first conductive layer and second conductive layer is at least 20 micrometers.
24. The semiconductor device of claim 20 , wherein a pitch of the first conductive layer ranges from 30-50 micrometers.
25. A semiconductor device, comprising:
a semiconductor die;
a first conductive layer formed over the semiconductor die;
a first insulating layer formed over the semiconductor die such that no portion of the first insulating layer overlies the first conductive layer; and
a second conductive layer formed over the first conductive layer and in an opening in the first insulating layer.
26. The semiconductor device of claim 25 , further including a second insulating layer formed over the first conductive layer.
27. The semiconductor device of claim 25 , further including a second insulating layer formed over the second conductive layer.
28. The semiconductor device of claim 25 , wherein the second conductive layer includes a width over the first conductive layer that is less than a width of the first conductive layer.
29. The semiconductor device of claim 25 , further including a second insulating layer formed over the semiconductor die and first conductive layer.
30. The semiconductor device of claim 25 , wherein a pitch of the first conductive layer ranges from 30-50 micrometers.