Integrated circuit packaging system with substrate mold gate and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a mold gate on an upper surface of the substrate; mounting an integrated circuit to the substrate; and forming an encapsulant encapsulating the integrated circuit, the encapsulant having disruption patterns emanating from the mold gate and underneath a bottom plane of the integrated circuit.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate;
forming a mold gate on an upper surface of the substrate;
mounting an integrated circuit to the substrate; and
forming an encapsulant horizontally encapsulating the integrated circuit, the encapsulant having disruption patterns emanating from the mold gate and underneath a bottom plane of the integrated circuit, the disruption patterns having progressively larger diameters expanding from the mold gate toward the integrated circuit.
2. The method as claimed in claim 1 wherein forming the encapsulant includes forming the encapsulant with the mold gate encompassing a corner of the encapsulant and extending beyond the encapsulant in two axes.
3. The method as claimed in claim 1 wherein forming the encapsulant includes forming the encapsulant with the mold gate in direct contact with only a single side of the encapsulant and extending past a corner of the encapsulant.
4. The method as claimed in claim 1 wherein forming the encapsulant includes forming the encapsulant with the mold gate in direct contact with a side of the encapsulant and not extending past a corner of the encapsulant.
5. The method as claimed in claim 1 wherein forming the encapsulant includes forming the encapsulant with the mold gate extending past multiple corners of the encapsulant.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate;
forming a mold gate on an upper surface of the substrate;
mounting an integrated circuit to the substrate;
forming an encapsulant horizontally encapsulating the integrated circuit, the encapsulant having disruption patterns emanating from the mold gate and underneath a bottom plane of the integrated circuit, the disruption patterns having progressively larger diameters expanding from the mold gate toward the integrated circuit, and a flat side in direct contact with the mold gate; and
connecting external interconnects below the substrate.
7. The method as claimed in claim 6 further comprising attaching a heat spreader to a top side of the encapsulant.
8. The method as claimed in claim 6 further comprising forming an under-fill between the integrated circuit and the substrate.
9. The method as claimed in claim 6 wherein forming the encapsulant includes forming the encapsulant having the disruption patterns overlapping.
10. The method as claimed in claim 6 further comprising attaching a heat spreader to the integrated circuit with a thermal interference material.