Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
View Patent ↗A semiconductor device is made by forming first and interconnect structures over a first semiconductor die. A third interconnect structure is formed in proximity to the first die. A second semiconductor die is mounted over the second and third interconnect structures. An encapsulant is deposited over the first and second die and first, second, and third interconnect structures. A backside of the second die is substantially coplanar with the first interconnect structure and a backside of the first semiconductor die is substantially coplanar with the third interconnect structure. The first interconnect structure has a height which is substantially the same as a combination of a height of the second interconnect structure and a thickness of the second die. The third interconnect structure has a height which is substantially the same as a combination of a height of the second interconnect structure and a thickness of the first die.
1. A semiconductor device, comprising:
a first semiconductor component;
a second semiconductor component disposed partially over the first semiconductor component;
an encapsulant deposited over the first and second semiconductor components including a first surface of the encapsulant substantially coplanar with a surface of the first semiconductor component and a second surface of the encapsulant substantially coplanar with a surface of the second semiconductor component;
a first interconnect structure electrically connected between the first and second semiconductor components;
a second interconnect structure disposed over the first semiconductor component and exposed at the second surface of the encapsulant with the second interconnect structure being electrically connected to the first semiconductor component; and
a third interconnect structure disposed over the second semiconductor component and exposed at the first surface of the encapsulant.
2. The semiconductor device of claim 1 , further including a plurality of stacked semiconductor devices electrically connected through the second and third interconnect structures.
3. The semiconductor device of claim 1 , further including:
a third semiconductor component disposed over the first surface of the semiconductor device; and
a fourth interconnect structure electrically connected between the first and third semiconductor components.
4. The semiconductor device of claim 1 , further including:
a third semiconductor component disposed over the first surface of the semiconductor device; and
a fourth interconnect structure electrically connected between the third semiconductor component and third interconnect structure.
5. The semiconductor device of claim 1 , wherein the encapsulant is disposed around the first semiconductor component, second semiconductor component, and first interconnect structure.
6. The semiconductor device of claim 1 , further including a fourth interconnect structure electrically connected between the first and second semiconductor components.
7. A semiconductor device, comprising:
a first semiconductor component;
a second semiconductor component disposed partially over the first semiconductor component;
a first interconnect structure coupled between a first surface of the first semiconductor component and a first surface of the second semiconductor component;
a second interconnect structure disposed over the first surface of the first semiconductor component, wherein the second interconnect structure includes a surface substantially coplanar with a second surface of the second semiconductor component opposite the first surface of the second semiconductor component; and
a third interconnect structure disposed over the first surface of the second semiconductor component, wherein the third interconnect structure includes a surface substantially coplanar with a second surface of the first semiconductor component opposite the first surface of the first semiconductor component.
8. The semiconductor device of claim 7 , further including a plurality of stacked semiconductor devices electrically connected through the second and third interconnect structures.
9. The semiconductor device of claim 7 , wherein the second semiconductor component includes a conductive layer.
10. The semiconductor device of claim 7 , further including:
a substrate; and
a fourth interconnect structure electrically connected between the substrate and the first or second semiconductor component.
11. The semiconductor device of claim 7 , further including:
a substrate; and
a fourth interconnect structure electrically connected between the substrate and the second or third interconnect structure.
12. The semiconductor device of claim 7 , wherein the first, second or third interconnect structure includes a bump, conductive pillars, stud bump, or micro bump.
13. The semiconductor device of claim 7 , further including:
a first contact pad disposed on the first semiconductor component; and
a second contact pad disposed on the second semiconductor component with the first interconnect structure disposed between the first contact pad and second contact pad.
14. The semiconductor device of claim 7 , further including an encapsulant deposited over the first semiconductor component, second semiconductor component, second interconnect structure, and third interconnect structure with the second interconnect structure and third interconnect structure exposed from the encapsulant.
15. A semiconductor device, comprising:
a first semiconductor component;
a second semiconductor component disposed partially over the first semiconductor component;
an encapsulant deposited over the first and second semiconductor components and including a surface of the encapsulant substantially coplanar with a surface of the first semiconductor component;
a first interconnect structure electrically connected between the first and second semiconductor components;
a second interconnect structure disposed between the first semiconductor component and the surface of the encapsulant; and
a third interconnect structure disposed between the second semiconductor component and a second surface of the semiconductor device.
16. The semiconductor device of claim 15 , further including a plurality of stacked semiconductor devices electrically connected through the second and third interconnect structures.
17. The semiconductor device of claim 15 , further including a conductive layer disposed between the first semiconductor component and a surface of the semiconductor device.
18. The semiconductor device of claim 17 , further including:
a third semiconductor component disposed above the surface of the semiconductor device; and
a fourth interconnect structure electrically connected between the third semiconductor component and conductive layer.
19. The semiconductor device of claim 15 , further including:
a first contact pad disposed on the first semiconductor component; and
a second contact pad disposed on the second semiconductor component and substantially opposite the first contact pad.
20. The semiconductor device of claim 15 , wherein the encapsulant is disposed around the first semiconductor component, second semiconductor component, and first interconnect structure.
21. A semiconductor device, comprising:
a first semiconductor component;
a second semiconductor component disposed partially over the first semiconductor component;
a first interconnect structure coupled between a surface of the first semiconductor component and a surface of the second semiconductor component;
a second interconnect structure formed over the surface of the first semiconductor component and including a height that is the same as a combination of a height of the first interconnect structure and a thickness of the second semiconductor component; and
a third interconnect structure formed over the surface of the second semiconductor component and including a height which is substantially the same as a combination of a height of the first interconnect structure and a thickness of the first semiconductor component.
22. The semiconductor device of claim 21 , further including a plurality of stacked semiconductor devices electrically connected through the second and third interconnect structures.
23. The semiconductor device of claim 21 , further including:
a third semiconductor component; and
a fourth interconnect structure electrically connected between the third semiconductor component and the first or second interconnect structure.
24. The semiconductor device of claim 21 , further including:
a first contact pad disposed on the first semiconductor component; and
a second contact pad disposed on the second semiconductor component with the first interconnect structure disposed between the first contact pad and second contact pad.
25. The semiconductor device of claim 21 , further including an encapsulant disposed around the first semiconductor component, second semiconductor component, second interconnect structure, and third interconnect structure.
26. The semiconductor device of claim 21 , further including an encapsulant deposited over the first semiconductor component, second semiconductor component, second interconnect structure, and third interconnect structure with the second interconnect structure and third interconnect structure exposed from the encapsulant.
27. A semiconductor device, comprising:
a first semiconductor die;
a second semiconductor die overlapping the first semiconductor die;
a first interconnect structure coupled between a first surface of the first semiconductor die and a first surface of the second semiconductor die;
a second interconnect structure disposed over the first surface of the first semiconductor die, wherein the second interconnect structure includes a surface substantially coplanar with a second surface of the second semiconductor die opposite the first surface of the second semiconductor die; and
a third interconnect structure disposed over the first surface of the second semiconductor die, wherein the third interconnect structure includes a surface substantially coplanar with a second surface of the first semiconductor die opposite the first surface of the first semiconductor die.
28. The semiconductor device of claim 27 , further including a plurality of stacked semiconductor devices electrically connected through the second interconnect structure and third interconnect structure.
29. The semiconductor device of claim 27 , further including:
a first contact pad disposed on the first semiconductor die; and
a second contact pad disposed on the second semiconductor die with the first interconnect structure electrically connected to the first and second contact pads.
30. The semiconductor device of claim 27 , wherein the first semiconductor die includes a conductive layer.
31. The semiconductor device of claim 27 , wherein the first, second, or third interconnect structure includes a bump, conductive pillars, stud bump, or micro bump.
32. The semiconductor device of claim 27 , further including an encapsulant deposited over the first semiconductor die, second semiconductor die, second interconnect structure, and third interconnect structure with the second interconnect structure and third interconnect structure exposed from the encapsulant.