Integrated circuit package system with stacked die
View Patent ↗An integrated circuit package system includes a trace frame includes: an encapsulant; a first series of bonding pads along a length of the encapsulant; a second series of the bonding pads along a width of the encapsulant; conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and a first integrated circuit die on the encapsulant and on the conductive traces that extend beyond the first integrated circuit die.
1. An integrated circuit package system comprising:
an encapsulant;
a first series of bonding pads, exposed from the encapsulant, along a length of a first of two adjacent sides of the encapsulant;
a second series of the bonding pads, exposed from the encapsulant, along a width of a second of the two adjacent sides of the encapsulant;
conductive traces having an inner section abutted between outward ends of the conductive traces connected to the bonding pads for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and
a first integrated circuit die over the inner section exposed from and surrounded by the encapsulant, all the bonding pads of the first series and the second series individually connected to the outward ends of the conductive traces are exposed on portions of the encapsulant extended laterally beyond only two adjacent sides of the first integrated circuit die.
2. The system as claimed in claim 1 further comprising:
a second integrated circuit die over the first integrated circuit die; and
a first electrical interconnect between the first integrated circuit die and the first series of the bonding pads; a second electrical interconnect between the second integrated circuit die and the first series of the bonding pads or the first integrated circuit die.
3. The system as claimed in claim 1 wherein the conductive traces include:
the conductive traces are generally parallel to each other.
4. The system as claimed in claim 2 further comprising a package substrate includes a rectangular digital package or a square digital package formed for mounting the first integrated circuit die and the second integrated circuit die.
5. The system as claimed in claim 1 wherein the encapsulant is over the conductive traces for forming a stacked die package.
6. The system as claimed in claim 1 further comprising:
a first stacked die package includes:
the conductive traces having the first integrated circuit die thereover, and
a second integrated circuit die over the first integrated circuit die, with the bonding pads of the first series either electrically coupled to the first integrated circuit die or electrically coupled to the second integrated circuit die;
a package substrate having a system bonding pad;
the first stacked die package mounted over the package substrate; and
a second stacked die package mounted over the first stacked die package.
7. The system as claimed in claim 6 further comprising an electrical interconnect coupled between the first stacked die package and the system bonding pad or an electrical interconnect coupled between the second stacked die package and the system bonding pad.
8. The system as claimed in claim 6 further comprising a system contact on the package substrate and a via between the system bonding pad and the system contact.
9. The system as claimed in claim 6 wherein the package substrate includes a rectangular digital package or a square digital package having the first stacked die package over the package substrate and the package substrate coupled to the first series of the bonding pads or the second series of the bonding pads.
10. The system as claimed in claim 6 further comprising an adhesive layer between the inner section of the conductive traces and the first integrated circuit die.