Integrated circuit package system employing mold flash prevention technology
An integrated circuit package system that includes: a support structure including an electrical contact; a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface; an integrated circuit over the support structure; and encapsulant over the integrated circuit and in contact with the solder mask flange. A mold system that includes a first mold having a projection along a first mold bottom surface, the projection between a first cavity and a recess.
1. An integrated circuit package system comprising:
a support structure including an electrical contact;
a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface;
an integrated circuit over the support structure; and
encapsulant over the integrated circuit and in contact with the solder mask flange.
2. The system as claimed in claim 1 further comprising an encapsulant flash adjacent the encapsulant and on the solder mask.
3. The system as claimed in claim 1 wherein the solder mask is around the integrated circuit and the electrical contact.
4. The system as claimed in claim 1 wherein the solder mask flange faces the encapsulant.
5. The system as claimed in claim 1 wherein the solder mask flange is in contact with the encapsulant.