Semiconductor package with embedded die
A semiconductor package having an embedded die and solid vertical interconnections, such as stud bump interconnections, for increased integration in the direction of the z-axis (i.e., in a direction normal to the circuit side of the die). The semiconductor package can include a die mounted in a face-up configuration (similar to a wire bond package) or in a face-down or flip chip configuration.
1. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming a conductive layer in a peripheral region around the semiconductor die; and
forming a first stud bump over the conductive layer by pressing a wire over the conductive layer under temperature to flatten an end of the wire and form an enlarged base portion covering a top surface and side surface of the conductive layer.
2. The method of claim 1 , further including depositing an encapsulant over the semiconductor die and first stud bump.
3. The method of claim 2 , further including forming a conductive trace over the encapsulant and electrically connected to the first stud bump.
4. The method of claim 2 , wherein the semiconductor die includes an active surface, a back surface opposite the active surface, and a side surface disposed between the active surface and the back surface with the side surface of the semiconductor die exposed from the encapsulant.
5. The method of claim 1 , further including forming a second stud bump over the semiconductor die.
6. The method of claim 1 , further including:
providing a substrate; and
disposing the semiconductor die over the substrate.
7. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming a conductive layer in a peripheral region around the semiconductor die;
forming a first stud bump over the conductive layer to include an enlarged base portion covering a side surface of the conductive layer and a stem portion extending from the enlarged base portion using a wire bonding tool; and
depositing an encapsulant over the semiconductor die and first stud bump.
8. The method of claim 7 , further including forming a second stud bump over the semiconductor die.
9. The method of claim 7 , further including planarizing the encapsulant and the stem portion of the first stud bump.
10. The method of claim 7 , further including:
providing a substrate; and
disposing the semiconductor die over the substrate.
11. The method of claim 7 , wherein forming the first stud bump includes:
providing a bond wire;
rounding an end of the bond wire to form the enlarged base portion; and
trimming the bond wire to form the stem portion.
12. The method of claim 7 , wherein a side surface of the semiconductor die is exposed from the encapsulant.
13. The method of claim 7 , further including forming a conductive trace over the encapsulant and electrically connected to the first stud bump.
14. A semiconductor device, comprising:
a semiconductor die;
a first conductive layer formed in a peripheral region around the semiconductor die; and
a first stud bump formed over the first conductive layer, the first stud bump including an enlarged base portion to cover a top surface and side surface of the first conductive layer and a stem portion extending from the enlarged base portion, wherein the stem portion includes a truncated cone shape.
15. The semiconductor device of claim 14 , further including an encapsulant deposited over the semiconductor die and first stud bump.
16. The semiconductor device of claim 15 , further including a second conductive layer formed over the encapsulant.
17. The semiconductor device of claim 14 , further including a second stud bump formed over the semiconductor die.
18. The semiconductor device of claim 14 , further including a substrate, wherein the semiconductor die is disposed over the substrate.
19. A semiconductor device, comprising:
a semiconductor die including an active surface, a back surface opposite the active surface and a side surface disposed between the active surface and the back surface;
a first conductive layer formed in a peripheral region around the semiconductor die;
a first stud bump formed over the first conductive layer, the first stud bump including a base width greater than a width of the first conductive layer; and
an encapsulant deposited over the semiconductor die and first stud bump, wherein the side surface of the semiconductor die is exposed from the encapsulant.
20. The semiconductor device of claim 19 , further including a second stud bump formed over the semiconductor die.
21. A semiconductor device, comprising:
a semiconductor die;
a first conductive layer formed in a peripheral region around the semiconductor die;
a first stud bump formed over the first conductive layer, the first stud bump including an enlarged base portion to cover a side surface of the first conductive layer and a stem portion extending from the enlarged base portion; and
an encapsulant deposited over the semiconductor die and first stud bump.
22. The semiconductor device of claim 21 , further including a second conductive layer formed over the encapsulant and electrically connected to the first stud bump.
23. The semiconductor device of claim 21 , further including a second stud bump formed over the semiconductor die.
24. The semiconductor device of claim 21 , wherein the encapsulant is planarized with the stem portion of the first stud bump.
25. The semiconductor device of claim 21 , wherein the first stud bump includes a bond wire with a rounded end to form the enlarged base portion.
26. The semiconductor device of claim 21 , further including a substrate, wherein the semiconductor die is disposed over the substrate.