IP Library Granted Patent US 9,817,531
Granted Patent B2
US 9,817,531 · App. 14/882,170 · Granted Nov 14, 2017

Interleaved scanning for capacitive touch sensors

Inventor: Feargal Cleary (Dunshaughlin, IE)
Assignee: Atmel Corporation
G06F3/044G06F3/0416
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,817,531
App. No.
14/882,170
Granted
Nov 14, 2017
Kind
B2
Abstract

A touch sensing circuit includes: a plurality of sensor channels; a controller coupled to the plurality of sensor channels, the controller configured to: map the sensor channels to sensor nodes, the sensor nodes forming a plurality of interleaved lumped sensors, where at least two of the interleaved lumped sensors include a common sensor node; scan, during a scan period, the interleaved lumped sensors to detect one or more touch inputs; and responsive to detecting one or more touch inputs, determining a location of at least one touch input.

Claims (43)

1. A touch sensing circuit comprising:

a plurality of sensor channels;

a controller coupled to the plurality of sensor channels, the controller configured to:

map the sensor channels to sensor nodes, the sensor nodes forming a plurality of interleaved lumped sensors, where at least two of the interleaved lumped sensors include a common sensor node;

scan, during a scan period, the interleaved lumped sensors to detect one or more touch inputs; and responsive to detecting one or more touch inputs,

determining a location of at least one touch input.

2. The touch sensing circuit of claim 1 , wherein the controller is further configured to:

scan a sensor node in an interleaved lumped sensor to resolve a detection ambiguity between two or more interleaved lumped sensors that are touched.

3. The touch sensing circuit of claim 1 , wherein the controller is further configured to:

compare changes in capacitance measured on two or more interleaved lumped sensors to resolve a detection ambiguity between the two or more interleaved lumped sensors.

4. The touch sensing circuit of claim 1 , wherein the controller is further configured to map the interleaved lumped sensors to rows and columns of a two-dimensional (2D) surface to thereby form a one-dimensional (1D) lumped sensor.

5. The touch sensing circuit of claim 4 , wherein the 1D lumped sensor is a slider.

6. The touch sensing circuit of claim 4 , wherein the controller is further configured to determine a location of a single touch input on the 2D surface based on which 1D lumped sensors are touched.

7. The touch sensing circuit of claim 4 , wherein the controller is further configured to scan individual sensor nodes in the 1D lumped sensors to resolve a location ambiguity on the 2D surface.

8. A method of touch sensing comprising:

mapping, by a controller of a touch sense circuit, sensor channels to sensor nodes, the sensor nodes forming a plurality of interleaved lumped sensors, where at least two of the interleaved lumped sensors include a common sensor node;

scanning, during a scan period, the interleaved lumped sensors to detect one or more touch inputs; and responsive to detecting one or more touch inputs,

determining a location of at least one touch input.

9. The method of claim 8 , further comprising:

scanning, by the controller, a sensor node in an interleaved lumped sensor to resolve a detection ambiguity between two or more interleaved lumped sensors that are touched.

10. The method of claim 8 , further comprising:

comparing, by the controller, changes in capacitance measured on two or more interleaved lumped sensors to resolve a detection ambiguity between the two or more interleaved lumped sensors.

11. The method of claim 8 , wherein the controller is further configured to map the interleaved lumped sensors to rows and columns of a two-dimensional (2D) surface to thereby form a one-dimensional (1D) lumped sensor.

12. The method of claim 11 , wherein the 1D lumped sensor is a slider.

13. The method of claim 11 , further comprising:

determining, by the controller, a location of a single touch input on the 2D surface based on which 1D lumped sensors are touched.

14. The method of claim 11 , further comprising:

scanning, by the controller, individual sensor nodes in the 1D lumped sensors to resolve a location ambiguity on the 2D surface.

15. A touch sensing system comprising:

sensor nodes;

a microcontroller;

a controller coupled to the microcontroller and the sensor nodes, the controller configured to:

map the sensor channels to the sensor nodes, the sensor nodes forming a plurality of interleaved lumped sensors, where at least two of the interleaved lumped sensors include a common sensor node;

scan, during a scan period, the interleaved lumped sensors to detect one or more touch inputs; responsive to detecting one or more touch inputs,

determining a location of at least one touch input; and

reporting the location to the microcontroller.

16. The touch sensing system of claim 15 , wherein the controller is configured to:

scan a sensor node in an interleaved lumped sensor to resolve a detection ambiguity between two or more interleaved lumped sensors that are touched.

17. The touch sensing system of claim 15 , wherein the controller is configured to:

compare changes in capacitance measured on two or more interleaved lumped sensors to resolve a detection ambiguity between the two or more interleaved lumped sensors.

18. The touch sensing system of claim 15 , wherein the controller is further configured to map the interleaved lumped sensors to rows and columns of a two-dimensional (2D) surface to thereby form a one-dimensional (1D) lumped sensor.

19. The touch sensing system of claim 18 , wherein the controller is configured to determine a location of a single touch input on the 2D surface based on which 1D lumped sensors are touched.

20. The touch sensing system of claim 18 , wherein the controller is configured to scan individual sensor nodes in the 1D lumped sensors to resolve a location ambiguity on the 2D surface.

Assignments (18)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
CORRECTIVE ASSIGNMENT TO CORRECT THE PATENTS ERRONEOUSLY EXCLUDED FROM TERMINATION PREVIOUSLY RECORDED ON REEL 038375 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL. Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 040575/0567 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2016
From: ATMEL TECHNOLOGIES IRELAND LIMITED
To: ATMEL CORPORATION
Reel/Frame 039880/0391 →
PATENT SECURITY AGREEMENT Recorded Nov 20, 2015
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037150/0363 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2015
From: CLEARY, FEARGAL
To: ATMEL TECHNOLOGIES IRELAND LIMITED
Reel/Frame 036837/0329 →
Continuity (1)
Related Publication 20170102799A1 · Apr 13, 2017