IP Library Granted Patent US 10,122,568
Granted Patent B2
US 10,122,568 · App. 15/642,347 · Granted Nov 6, 2018

Digital compensation of IQ coupling in communication receivers

Inventors: Hamid Shafiee (Irvine, CA); Mohsen Pourkhaatoun (Laguna Niguel, CA); Kiran Gowda (Irvine, CA); Siddharth Shetty (Irvine, CA); Esmael Heidari (Mission Viejo, CA); Ali Fard (Irvine, CA); Rahim Bagheri (Poway, CA); Masoud Djafari (Laguna Hills, CA)
Assignee: MICROCHIP TECHNOLOGY INCORPORATED
H04L27/3863H04L1/0045H04L27/22H04L2027/003H04L2027/0038
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Quick Facts
Patent No.
US 10,122,568
App. No.
15/642,347
Granted
Nov 6, 2018
Kind
B2
Abstract

A receiver circuit includes a conversion circuit configured to down-convert a received radio-frequency signal to a baseband signal, an analog-to-digital converter configured to sample the baseband signal into a sampled signal, a Fast Fourier transform (FFT) circuit configured to perform an FFT on the sampled signal, and a digital compensation circuit configured to compensate for IQ distortion in a frequency domain.

Claims (222)

1. A receiver circuit, comprising:

a conversion circuit configured to down-convert a received radio-frequency signal to a baseband signal;

an analog-to-digital converter configured to sample the baseband signal into a sampled complex time-domain signal;

and

a digital compensation circuit configured to compensate for in-phase and quadrature-phase (IQ) distortion in a frequency domain, wherein:

in a first branch:

the digital compensation circuit is further configured to multiply using a first multiplier circuit, the sampled complex time-domain signal by a first correction for carrier frequency offset to generate a first multiplied signal;

perform a first Fast Fourier transform (FFT) on the first multiplied signal through a first FFT circuit; and

the digital compensation circuit is further configured to multiply using a second multiplier circuit, a result from the first FFT with a first factor to form a first output data;

in a second branch:

the digital compensation circuit is further configured to multiply using a third multiplier circuit, a complex baseband the sampled complex time-domain signal by a second correction for carrier frequency offset to generate a second multiplied signal;

perform a second FFT on the second multiplied signal through a second FFT circuit;

perform using an inversion and conjugation circuit, conjugation by inverting and conjugating an output of the second FFT; and

the digital compensation circuit is further configured to multiply using a fourth multiplier circuit, the inverted and conjugated output of the second FFT with a second factor to form a second output data;

wherein, the first factor is λ 1 (ω)/δ and the second factor is λ 2 (ω)/δ, wherein

λ

1

(

ω

)

=

[

1

+

ω

+

Δω

2

(

β

1

-

β

2

)

]

,

λ

2

(

ω

)

=

[

-

ω

+

Δω

2

(

β

1

-

β

2

)

]

,

δ

=

λ

1

(

ω

)

λ

1

(

-

ω

-

2

Δω

)

-

λ

2

(

ω

)

λ

2

(

-

ω

-

2

Δω

)

,

and wherein ωΔ corresponds to a frequency offset, co corresponds to a frequency, Ts is a sampling period, and β 1 and β 2 are coupling coefficients; and

the digital compensation circuit is further configured to add, by a summer circuit, the first output data and the second output data.

2. The receiver circuit of claim 1 , wherein the first correction and the second correction are dependent upon frequency.

3. The receiver circuit of claim 1 , further comprising an equalizer circuit configured to equalize a sum of the first output data and the second output data.

4. The receiver circuit of claim 1 , wherein the first correction is e −Δω c nT s , and the second correction is e Δω c nT s , wherein Δω c corresponds to a frequency offset, n is a sample index, and Ts is a sampling period.

5. The receiver circuit of claim 1 , wherein the digital compensation circuit is configured to compensate for IQ distortion arising from IQ coupling after down-conversion.

6. The receiver circuit of claim 1 , wherein the radio-frequency signal includes orthogonal-frequency-domain multiplexing (OFDM) packets.

7. A system, comprising:

a conversion circuit configured to down-convert a received radio-frequency signal to a baseband signal;

an analog-to-digital converter configured to sample the baseband signal into a sampled complex time-domain signal;

and

a digital compensation circuit configured to compensate for in-phase and quadrature-phase (IQ) distortion in a frequency domain, wherein:

in a first branch:

the digital compensation circuit is further configured to multiply using a first multiplier circuit, the sampled complex time-domain signal by a first correction for carrier frequency offset to generate a first multiplied signal;

perform a first Fast Fourier transform (FFT) on the first multiplied signal through a first FFT circuit; and

the digital compensation circuit is further configured to multiply using a second multiplier circuit, a result from the first FFT with a first factor to form a first output data;

in a second branch:

the digital compensation circuit is further configured to multiply using a third multiplier circuit, a complex baseband the sampled complex time-domain signal by a second correction for carrier frequency offset to generate a second multiplied signal;

perform a second FFT on the second multiplied signal through a second FFT circuit;

perform using an inversion and conjugation circuit, conjugation by inverting and conjugating an output of the second FFT; and

the digital compensation circuit is further configured to multiply using a fourth multiplier circuit, the inverted and conjugated output of the second FFT with a second factor to form a second output data;

wherein, the first factor is λ 1 (ω) /δ and the second factor is λ 2 (ω)/δ, wherein

λ

1

(

ω

)

=

[

1

+

ω

+

Δω

2

(

β

1

-

β

2

)

]

,

λ

2

(

ω

)

=

[

-

ω

+

Δω

2

(

β

1

-

β

2

)

]

,

δ

=

λ

1

(

ω

)

λ

1

(

-

ω

-

2

Δω

)

-

λ

2

(

ω

)

λ

2

(

-

ω

-

2

Δω

)

,

and wherein ωΔ corresponds to a frequency offset, ω corresponds to a frequency, Ts is a sampling period, and β 1 and β 2 are coupling coefficients; and

the digital compensation circuit is further configured to add, by a summer circuit, the first output data and the second output data.

8. The system of claim 7 , wherein the first correction and the second correction are dependent upon frequency.

9. The system of claim 7 , further comprising an equalizer circuit configured to equalize a sum of the first output data and the second output data.

10. The system of circuit of claim 7 , wherein the first correction is e −Δω c nT s , and the second correction is e Δω c nT s , wherein Δω c corresponds to a frequency offset, n is a sample index, and Ts is a sampling period.

11. The system of claim 7 , wherein the digital compensation circuit is configured to compensate for IQ distortion arising from IQ coupling after down-conversion.

12. The system of claim 7 , wherein the radio-frequency signal includes orthogonal-frequency-domain multiplexing (OFDM) packets.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2018
From: SHAFIEE, HAMID; POURKHAATOUN, MOHSEN; GOWDA, KIRAN T.; SHETTY, SIDDHARTH; HEIDARI, ESMAEL; FARD, ALI; BAGHERI, RAHIM; DJAFARI, MASOUD
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 046912/0242 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
Continuity (2)
Provisional Application 62359372 · Jul 7, 2016
Related Publication 20180013605A1 · Jan 11, 2018
Cited By (2)
US 12,463,651 US 12,512,863