Wire bonding machine having a rotatable capillary to secure a bond wire to a connection point
A wire bonder has a rotatable capillary for forming a stitch bond on a bonding surface of a connection point. When the stitch bond is formed, a bond head of the wire bonder causes the capillary to rotate in a XY plane. Rotation of the capillary causes at least a portion of the stitch bond to contact one or more side walls of the connection point. As a result, an entire surface area of the stitch bond contacts one or more surfaces of the connection point.
1 . A wire bonder, comprising:
a controller executing one or more instructions and causing:
a bond head to move a capillary from a first position to a second position that is lower than the first position when forming a bond on a first surface of a connection point; and
a rotation mechanism to rotate at least one of the bond head and the capillary about an axis when the capillary is in the second position, the rotation of the at least one of the bond head and the capillary securing at least a portion of the bond to a second surface of the connection point.
2 . The wire bonder of claim 1 , wherein the second surface is a side wall of the connection point.
3 . The wire bonder of claim 1 , wherein a surface area of the bond is greater than a surface area of the first surface.
4 . The wire bonder of claim 1 , wherein the rotation about the axis occurs in both a first direction and a second direction.
5 . The wire bonder of claim 4 , wherein the rotation about the axis in the first direction causes the at least the portion of the bond to be secured to the second surface of the connection point and wherein rotation about the axis in the second direction causes at least another portion of the bond to be secured to a third surface of the connection point.
6 . The wire bonder of claim 5 , wherein the third surface is a side wall of the connection point.
7 . The wire bonder of claim 1 , wherein the bond is a stitch bond.
8 . A method of forming a bond on a connection point of a printed circuit board (PCB), comprising:
causing, in response to a first instruction executed by a controller of a wire bonding machine, a bond head of the wire bonding machine to move a capillary of the wire bonding machine from a first position to a second position that is below the first position;
forming a first portion of a bond on a first surface of the connection point of the PCB when the capillary is in the second position; and
causing, in response to a second instruction executed by the controller of the wire bonding machine, a rotation mechanism of the wire bonding machine to rotate the capillary about an axis to form a second portion of the bond on a second surface of the connection point.
9 . The method of claim 8 , wherein the second surface is a side wall of the connection point.
10 . The method of claim 8 , wherein the rotation about the axis is in a first direction and a second direction.
11 . The method of claim 10 , wherein the rotation about the axis causes a third portion of the bond to be coupled to a third surface of the connection point.
12 . The method of claim 11 , wherein the third surface is a side wall of the connection point.
13 . The method of claim 8 , wherein the bond is a stitch bond.
14 . A wire bonding means, comprising:
a bond wire dispensing means; and
a control means that executes one or more instructions, the execution of which:
causes movement of the bond wire dispensing means from a first position to a second position that is lower than the first position to form a bond on a first surface of a connection means; and
causes a rotation means to rotate the bond wire dispensing means in a XY plane when the bond wire dispensing means is in the second position, wherein the rotation of the bond wire dispensing means in the XY plane secures at least a portion of the bond to a second surface of the connection means.
15 . The wire bonding means of claim 14 , wherein a surface area of the bond is greater than a surface area of the first surface of the connection means.
16 . The wire bonding means of claim 14 , wherein the rotation in the XY plane is in a first direction and a second direction.
17 . The wire bonding means of claim 16 , wherein the rotation in the XY plane in the first direction causes the at least the first portion of the bond to be coupled to the second surface of the connection means and wherein rotation in the XY plane in the second direction causes at least a second portion of the bond to be coupled to a third surface of the connection means.
18 . The wire bonding means of claim 14 , wherein the bond is a stitch bond.
19 . The wire bonding means of claim 14 , wherein the bond on the first surface of the connection means comprises an overhang.
20 . The wire bonding means of claim 14 , wherein after rotation in the XY plane, the control means is further configured to return the bond wire dispensing means to its original orientation prior to moving the bond wire dispensing means away from the connection means.