Heat harvesting in data storage devices
A data storage device includes TE elements thermally connected between IC chips thereof and a lid assembly. An electronic controller of the data storage device is configured to receive voltages generated by the TE elements in response to the heat generated in the IC chips and is further configured to use the voltages to provide electrical power to an electrical fan of the lid assembly. The fan generates an airflow for keeping the lid assembly at approximately ambient temperature, thereby facilitating heat removal from the IC chips by way of the TE elements.
1 . A device, comprising:
a first plate having a first main surface and an opposite second main surface;
a second plate disposed at a nonzero offset distance from the first plate along the first main surface;
an electrical fan having a set of blades arranged within a gap between the first plate and the second plate, the electrical fan being operable to rotate the set of blades about a rotation axis that is approximately orthogonal to the first main surface;
a plurality of thermoelectric (TE) elements disposed along the opposite second main surface in thermal contact with the first plate; and
a heat-management (HM) controller connected to receive a plurality of voltages generated by the plurality of TE elements in response to respective temperature differences across individual ones of the plurality of TE elements, the HM controller being configured to use the plurality of voltages to provide electrical power to the electrical fan.
2 . The device of claim 1 , wherein the HM controller is implemented using an integrated-circuit (IC) chip attached to the first plate.
3 . The device of claim 2 , further comprising:
a first set of electrical lines connecting the HM controller and the plurality of TE elements; and
a second set of electrical lines connecting the HM controller and the electrical fan.
4 . The device of claim 3 , further comprising a third set of electrical lines connecting the HM controller to an electrical connector disposed along the opposite second main surface for providing wireline connections between the HM controller and a second controller.
5 . The device of claim 1 , further comprising a plurality of spacer columns attached between the first plate and the second plate and arranged for an external air flow to enter the gap between the first plate and the second plate along any direction substantially parallel to the first main surface.
6 . The device of claim 5 , wherein the plurality of spacer columns comprises copper.
7 . The device of claim 1 , wherein the HM controller is configured to manage the electrical power by selectively switching electrical connections of the plurality of TE elements.
8 . The device of claim 1 , further comprising a printed-circuit-board (PCB) assembly including a printed circuit board and a plurality of integrated-circuit (IC) chips attached and electrically connected to the printed circuit board,
wherein the individual ones of the TE elements are attached to corresponding ones of the IC chips; and
wherein the respective temperature differences across the individual ones of the TE elements are caused by heat generated in the corresponding ones of the IC chips.
9 . The device of claim 8 , wherein the plurality of IC chips includes a plurality of storage dies of a data storage device.
10 . The device of claim 9 ,
wherein the plurality of IC chips includes an IC chip implementing an electronic controller of the data storage device; and
wherein the electronic controller includes the HM controller.
11 . The device of claim 8 , wherein the plurality of IC chips includes an IC chip implementing the HM controller.
12 . The device of claim 11 , wherein the PCB assembly and the first plate have matching electrical connectors to connect the HM controller and the electrical fan.
13 . The device of claim 11 , further comprising:
a first set of electrical lines connecting the HM controller and the plurality of TE elements; and
a second set of electrical lines connecting the HM controller and a corresponding one of the matching electrical connectors.
14 . The device of claim 1 , wherein a TE element of the plurality of TE elements comprises a plurality of Peltier modules connected to be thermally in parallel and electrically in series with one another.
15 . A heat-management method, comprising:
sensing one or more temperatures in one or more locations within a device assembly; and
electrically connecting a plurality of thermoelectric (TE) elements to provide electrical power to an electrical fan when a temperature metric is greater than a first threshold value, the temperature metric being based on the one or more temperatures,
wherein the device assembly comprises:
a printed-circuit-board (PCB) assembly including a printed circuit board and a plurality of integrated-circuit (IC) chips attached and electrically connected to the printed circuit board;
the plurality of TE elements having individual ones of the TE elements thermally connected between corresponding ones of the IC chips and an adjacent part of a device case of the device assembly; and
a heat-management (HM) controller connected to receive a plurality of voltages generated by the plurality of TE elements in response to heat generated in the corresponding ones of the IC chips, the HM controller being configured to use the plurality of voltages to provide the electrical power to the electrical fan; and
wherein the electrical fan is configured to generate an airflow that removes heat from the device case.
16 . The heat-management method of claim 15 , further comprising electrically disconnecting the plurality of TE elements from the electrical fan when the temperature metric is smaller than a second threshold value.
17 . The heat-management method of claim 15 , further comprising supplementing the electrical power with an additional electrical power to meet a power budget of the electrical fan.
18 . The heat-management method of claim 15 , further comprising selecting a speed for the electrical fan based on a difference between the temperature metric and the first threshold value.
19 . The heat-management method of claim 15 ,
wherein the plurality of IC chips includes a plurality of storage dies of a data storage device and an electronic controller of the data storage device; and
wherein the electronic controller includes the HM controller.
20 . A data storage device, comprising:
a device case including a bottom casing and a lid assembly attached to each other, the lid assembly including an electrical fan;
a printed-circuit-board assembly disposed in the device case and including a printed circuit board and a plurality of integrated-circuit (IC) chips attached and electrically connected to the printed circuit board, the plurality of IC chips including a plurality of storage dies and an electronic controller; and
a plurality of thermoelectric (TE) elements having individual ones of the TE elements thermally connected between corresponding ones of the IC chips and the lid assembly,
wherein the electronic controller is configured to receive a plurality of voltages generated by the plurality of TE elements in response to heat generated in the corresponding ones of the IC chips and further configured to use the plurality of voltages to provide electrical power to the electrical fan; and
wherein the electrical fan is configured to generate an airflow that removes heat from the device case.