IP Library Granted Patent US 12,483,842
Granted Patent B2
US 12,483,842 · App. 18/472,180 · Granted Nov 25, 2025

Systems and methods for suppressing sound leakage

Inventors: Xin Qi (Shenzhen, CN); Fengyun Liao (Shenzhen, CN); Jinbo Zheng (Shenzhen, CN); Qian Chen (Shenzhen, CN); Hao Chen (Shenzhen, CN); Lei Zhang (Shenzhen, CN); Peigeng Tong (Shenzhen, CN); Guolin Xie (Shenzhen, CN); Yongjian Li (Shenzhen, CN); Jiang Xu (Shenzhen, CN); Tao Zhao (Shenzhen, CN); Duoduo Wu (Shenzhen, CN); Ao Ji (Shenzhen, CN)
Assignee: SHENZHEN SHOKZ CO., LTD.
H04R25/505G10K9/13G10K9/22G10K11/175G10K11/178G10K11/26H04R1/2811H04R9/066G10K2210/3216H04R1/2876H04R17/00H04R2460/13
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,483,842
App. No.
18/472,180
Granted
Nov 25, 2025
Kind
B2
Abstract

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

Claims (30)

1 . An earphone, comprising: a sound production component and a suspension structure, wherein

in a wearing state, the suspension structure is used to place the sound production component at a position near but not blocking an ear canal; and

the sound production component includes:

a housing;

a transducer residing inside a cavity formed by the housing and configured to generate vibrations, the vibrations producing a sound wave inside the housing, and the transducer including a diaphragm; and

at least two sound guiding holes located on the housing and configured to guide the sound wave inside the housing through the at least two sound guiding holes to an outside of the housing, the guided sound wave including at least two guided sound waves having different phases, wherein

the at least two sound guiding holes include a sound outlet, a first pressure relief hole, and a second pressure relief hole,

the sound outlet is disposed on an inner side surface of the housing facing an auricle and is configured to transmit a sound generated at a front side of the diaphragm to the ear canal,

the first pressure relief hole and the second pressure relief hole are disposed respectively on at least another side surface of the housing and are configured to guide sounds generated at a rear side of the diaphragm out of the housing, and

a distance from a center of the sound outlet to a perpendicular bisection-plane of a line segment connecting a center of the first pressure relief hole and a center of the second pressure relief hole is in a range of 0 mm-2 mm.

2 . The earphone of claim 1 , wherein an area of the first pressure relief hole is larger than an area of the second pressure relief hole.

3 . The earphone of claim 2 , wherein the first pressure relief hole is provided on an upper side surface of the housing and the second pressure relief hole is provided on a lower side surface of the housing.

4 . The earphone of claim 1 , wherein, in the wearing state, a ratio of a distance between a projection point of a center of the sound outlet on a sagittal plane and a projection point of a ⅓ point of an lower boundary of the inner side surface on the sagittal plane to a distance between a projection point of a center of the second pressure relief hole on the sagittal plane and the projection point of the ⅓ point of the lower boundary of the inner side surface on the sagittal plane is in a range of 0.65-1.05.

5 . The earphone of claim 1 , wherein an angle between a line connecting a center of the sound outlet to a center of the first pressure relief hole and a line connecting the center of the sound outlet to a center of the second pressure relief hole is in a range of 46.40° to 114.04°.

6 . The earphone of claim 1 , wherein a ratio of a distance between a center of the sound outlet and a center of the first pressure relief hole to a distance between the center of the sound outlet and a center of the second pressure relief hole is in a range of 0.9 to 1.1.

7 . The earphone of claim 1 , wherein a ratio of an area of the sound outlet to a total area of the first pressure relief hole and the second pressure relief hole is in a range of 0.1 to 0.99.

8 . The earphone of claim 7 , wherein the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front side and the rear side of the diaphragm, respectively, wherein a ratio of a volume of the rear cavity to a volume of the front cavity is in a range of 0.1 to 10.

9 . The earphone of claim 7 , wherein the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front side and the rear side of the diaphragm, respectively, wherein a ratio of a resonance frequency of the front cavity to a resonance frequency of the rear cavity is in a range of 0.1 to 5.

10 . The earphone of claim 1 , wherein a ratio of an area of the sound outlet to a total area of the first pressure relief hole and the second pressure relief hole is in a range of 1 to 10.

11 . The earphone of claim 10 , wherein the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front side and the rear side of the diaphragm, respectively, wherein a ratio of a volume of the rear cavity to a volume of the front cavity is in a range of 0.1 to 10.

12 . The earphone of claim 10 , wherein the diaphragm divides the cavity into a front cavity and a rear cavity corresponding to the front side and the rear side of the diaphragm, respectively, wherein a ratio of a resonance frequency of the front cavity to a resonance frequency of the rear cavity is in a range of 0.5 to 10.

13 . The earphone of claim 1 , wherein a ratio of a sound pressure at the sound outlet to a total sound pressure at the first pressure relief hole and at the second pressure relief hole is in a range of 0.4 to 0.6.

14 . The earphone of claim 1 , wherein a ratio of a difference between the area of the first pressure relief hole and the area of the second pressure relief hole to an area of the sound outlet is in a range of 2.5 to 3.9.

15 . The earphone of claim 1 , wherein an acoustic resistance net is provided at a position of at least one of the sound outlet, the first pressure relief hole, and the second pressure relief hole, and a thickness of the acoustic resistance net is in a range of 40 μm to 150 μm.

16 . The earphone of claim 15 , wherein the acoustic resistance net at the sound outlet includes a steel mesh, and a mesh number of the steel mesh is in a range of 60-100.

17 . The earphone of claim 15 , wherein the acoustic resistance net at the sound outlet includes a steel mesh, and a mesh number of the steel mesh is in a range of 70-90.

18 . The earphone of claim 1 , further comprising:

at least one acoustic route coupled to at least one sound guiding hole of the at least two sound guiding holes, wherein a guided sound wave of the at least one sound guiding hole is propagated to the at least one sound guiding hole along the acoustic route, and the at least one acoustic route is configured to adjust a frequency of the guided sound wave.

19 . The earphone of claim 18 , wherein the acoustic route is configured to adjust a frequency of the guided sound wave by filtering sound waves in target frequencies.

20 . The earphone of claim 18 , wherein the acoustic route includes one or more lumen structures.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2023
From: QI, XIN; LIAO, FENGYUN; ZHENG, JINBO; CHEN, QIAN; CHEN, HAO; ZHANG, LEI; TONG, PEIGENG; XIE, GUOLIN; LI, YONGJIAN; XU, JIANG; ZHAO, TAO; WU, DUODUO; JI, AO
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 065504/0094 →
Priority Claims (7)
CN 201410005804.0 · Jan 6, 2014 · national
CN 202211336918.4 · Oct 28, 2022 · national
CN 202223239628.6 · Dec 1, 2022 · national
WO PCT/CN2022/144339 · Dec 30, 2022 · international
WO PCT/CN2023/079404 · Mar 2, 2023 · international
WO PCT/CN2023/079410 · Mar 2, 2023 · international
WO PCT/CN2023/079411 · Mar 2, 2023 · international
Continuity (14)
Continuation In Part 18308760 · Apr 28, 2023
Continuation 17804611 · May 31, 2022
Continuation 17170874 · Feb 8, 2021
Continuation In Part 17074762 · Oct 20, 2020
Continuation In Part 16813915 · Mar 10, 2020
Continuation 16419049 · May 22, 2019
Continuation 16180020 · Nov 5, 2018
Continuation 15650909 · Jul 16, 2017
Continuation 15109831
Continuation In Part 16833839 · Mar 30, 2020
Continuation 15752452
Continuation In Part 18334401 · Jun 14, 2023
Continuation PCTCN2023083546 · Mar 24, 2023
Related Publication 20240015452A1 · Jan 11, 2024
References Cited (158)
US 2075196A · Hand · 1937 [cited by applicant]
US 2327320A · Shapiro · 1943 [cited by applicant]
US 4791673A · Schreiber · 1988 [cited by applicant]
US 4987597A · Haertl · 1991 [cited by applicant]
US 5280524A · Norris · 1994 [cited by applicant]
US 5282251A · Petersen · 1994 [cited by applicant]
US 5323468A · Bottesch · 1994 [cited by applicant]
US 5430803A · Kimura et al. · 1995 [cited by applicant]
US 5673328A · Wandl et al. · 1997 [cited by applicant]
US 5692059A · Kruger · 1997 [cited by applicant]
US 5757935A · Kang et al. · 1998 [cited by applicant]
US 5790684A · Niino et al. · 1998 [cited by applicant]
US 6377697B1 · Cheng · 2002 [cited by applicant]
US 6456721B1 · Fukuda · 2002 [cited by applicant]
US 6478108B1 · Linhard et al. · 2002 [cited by applicant]
US 6668065B2 · Lee et al. · 2003 [cited by applicant]
US 6850138B1 · Sakai · 2005 [cited by applicant]
US 7400738B2 · Niederdränk et al. · 2008 [cited by applicant]
US 7639825B2 · Fukuda · 2009 [cited by applicant]
US 7822215B2 · Carazo et al. · 2010 [cited by applicant]
US 8141678B2 · Ikeyama et al. · 2012 [cited by applicant]
US 8325964B2 · Weisman · 2012 [cited by applicant]
US 8340334B2 · Suyama · 2012 [cited by applicant]
US 8345915B2 · Shin et al. · 2013 [cited by applicant]
US 8433082B2 · Abolfathi · 2013 [cited by applicant]
US 8447061B2 · Lee · 2013 [cited by applicant]
US 8520867B2 · Koike et al. · 2013 [cited by applicant]
US 8526641B2 · Parker et al. · 2013 [cited by applicant]
US 8553910B1 · Dong et al. · 2013 [cited by applicant]
US 8660278B2 · Abolfathi et al. · 2014 [cited by applicant]
US 8699742B2 · Heiman et al. · 2014 [cited by applicant]
US 8737649B2 · Parker et al. · 2014 [cited by applicant]
US 8908891B2 · Mersky · 2014 [cited by applicant]
US 9226075B2 · Lee · 2015 [cited by applicant]
US 9253563B2 · Fukuda · 2016 [cited by applicant]
US 9729978B2 · Qi et al. · 2017 [cited by applicant]
US 10149071B2 · Qi et al. · 2018 [cited by applicant]
US 10334372B2 · Qi et al. · 2019 [cited by applicant]
US 10506362B1 · Gomes · 2019 [cited by applicant]
US 10616696B2 · Qi et al. · 2020 [cited by applicant]
US 10631075B1 · Patil et al. · 2020 [cited by applicant]
US 10897677B2 · Walraevens et al. · 2021 [cited by applicant]
US 11140497B2 · Liao et al. · 2021 [cited by applicant]
US 11197106B2 · Qi et al. · 2021 [cited by applicant]
US 11323830B2 · Liao et al. · 2022 [cited by applicant]
US 11323832B2 · Liao et al. · 2022 [cited by applicant]
US 11343623B2 · Liao et al. · 2022 [cited by applicant]
US 11343624B2 · Liao et al. · 2022 [cited by applicant]
US 11343625B2 · Liao et al. · 2022 [cited by applicant]
US 11368800B2 · Qi et al. · 2022 [cited by applicant]
US 11399245B2 · Liao et al. · 2022 [cited by applicant]
US 11438717B2 · Liao et al. · 2022 [cited by applicant]
US 11570560B2 · Liao et al. · 2023 [cited by applicant]
US 11582563B2 · Qi et al. · 2023 [cited by applicant]
US 11611837B2 · Liao et al. · 2023 [cited by applicant]
US 20030012395A1 · Fukuda · 2003 [cited by applicant]
US 20030048913A1 · Lee et al. · 2003 [cited by applicant]
US 20030235321A1 · Lu · 2003 [cited by applicant]
US 20040105566A1 · Matsunaga et al. · 2004 [cited by applicant]
US 20050251952A1 · Johnson · 2005 [cited by applicant]
US 20050254672A1 · Kobayashi · 2005 [cited by applicant]
US 20060098829A1 · Kobayashi · 2006 [cited by applicant]
US 20060140435A1 · Sheehy et al. · 2006 [cited by applicant]
US 20060165246A1 · Lee et al. · 2006 [cited by applicant]
US 20060262954A1 · Lee et al. · 2006 [cited by applicant]
US 20070009133A1 · Gerkinsmeyer · 2007 [cited by applicant]
US 20070034493A1 · Kawasaki et al. · 2007 [cited by applicant]
US 20070041595A1 · Carazo et al. · 2007 [cited by applicant]
US 20070053536A1 · Westerkull · 2007 [cited by applicant]
US 20070053542A1 · Lee · 2007 [cited by applicant]
US 20070237341A1 · Laroche · 2007 [cited by applicant]
US 20080107300A1 · Chen · 2008 [cited by applicant]
US 20080144874A1 · Wu et al. · 2008 [cited by applicant]
US 20090095613A1 · Lin · 2009 [cited by applicant]
US 20090103768A1 · Lin · 2009 [cited by applicant]
US 20090127020A1 · Connor · 2009 [cited by applicant]
US 20090147981A1 · Blanchard et al. · 2009 [cited by applicant]
US 20090208031A1 · Abolfathi · 2009 [cited by applicant]
US 20090209806A1 · Hakansson · 2009 [cited by applicant]
US 20090245553A1 · Parker · 2009 [cited by applicant]
US 20090285417A1 · Shin et al. · 2009 [cited by applicant]
US 20090290730A1 · Fukuda et al. · 2009 [cited by applicant]
US 20100054492A1 · Eaton et al. · 2010 [cited by applicant]
US 20100322454A1 · Ambrose et al. · 2010 [cited by applicant]
US 20100329485A1 · Fukuda · 2010 [cited by applicant]
US 20110150262A1 · Nakama et al. · 2011 [cited by applicant]
US 20120020501A1 · Lee · 2012 [cited by applicant]
US 20120070022A1 · Saiki · 2012 [cited by applicant]
US 20120177206A1 · Yamagishi et al. · 2012 [cited by applicant]
US 20120201406A1 · Yamaguchi · 2012 [cited by applicant]
US 20130163791A1 · Qi et al. · 2013 [cited by applicant]
US 20130188803A1 · Shaanan et al. · 2013 [cited by applicant]
US 20130259271A1 · Miyoshi et al. · 2013 [cited by applicant]
US 20130329919A1 · He · 2013 [cited by applicant]
US 20140009008A1 · Li et al. · 2014 [cited by applicant]
US 20140064533A1 · Kasic, II · 2014 [cited by applicant]
US 20140185822A1 · Kunimoto et al. · 2014 [cited by applicant]
US 20140185837A1 · Kunimoto et al. · 2014 [cited by applicant]
US 20140274229A1 · Fukuda · 2014 [cited by applicant]
US 20140315605A1 · Cho et al. · 2014 [cited by applicant]
US 20140355777A1 · Nabata et al. · 2014 [cited by applicant]
US 20150030189A1 · Nabata et al. · 2015 [cited by applicant]
US 20150195664A1 · Lin et al. · 2015 [cited by applicant]
US 20150208183A1 · Bern · 2015 [cited by applicant]
US 20150256656A1 · Horii · 2015 [cited by applicant]
US 20150264473A1 · Fukuda · 2015 [cited by applicant]
US 20150268673A1 · Farzbod et al. · 2015 [cited by applicant]
US 20150326967A1 · Otani · 2015 [cited by applicant]
US 20160037243A1 · Lippert et al. · 2016 [cited by applicant]
US 20160127841A1 · Horii · 2016 [cited by applicant]
US 20160150337A1 · Nandy · 2016 [cited by applicant]
US 20160165357A1 · Morishita et al. · 2016 [cited by applicant]
US 20160295328A1 · Park · 2016 [cited by applicant]
US 20160329041A1 · Qi et al. · 2016 [cited by applicant]
US 20170201823A1 · Shetye et al. · 2017 [cited by applicant]
US 20170223445A1 · Bullen et al. · 2017 [cited by applicant]
US 20170289667A1 · Okita · 2017 [cited by applicant]
US 20180054670A1 · Struzik et al. · 2018 [cited by applicant]
US 20180167710A1 · Silver et al. · 2018 [cited by applicant]
US 20180182370A1 · Hyde et al. · 2018 [cited by applicant]
US 20190014425A1 · Liao et al. · 2019 [cited by applicant]
US 20190052954A1 · Rusconi Clerici Beltrami et al. · 2019 [cited by applicant]
US 20190238971A1 · Wakeland et al. · 2019 [cited by applicant]
US 20190320258A1 · Ohura · 2019 [cited by applicant]
US 20200196062A1 · Zhang · 2020 [cited by applicant]
US 20200228904A1 · Liao et al. · 2020 [cited by applicant]
US 20200367008A1 · Walsh et al. · 2020 [cited by applicant]
US 20210067857A1 · Struzik · 2021 [cited by applicant]
US 20210099027A1 · Larsson et al. · 2021 [cited by applicant]
US 20210219059A1 · Qi et al. · 2021 [cited by applicant]
US 20210258696A1 · Qi et al. · 2021 [cited by applicant]
US 20210392430A1 · Peeters · 2021 [cited by applicant]
US 20220095029A1 · Zheng et al. · 2022 [cited by applicant]
US 20220124428A1 · Zheng et al. · 2022 [cited by applicant]
US 20220240029A1 · Liao et al. · 2022 [cited by applicant]
US 20220312108A1 · Zhang et al. · 2022 [cited by applicant]
US 20230130211A1 · Li et al. · 2023 [cited by applicant]
US 20230179907A1 · Zhang et al. · 2023 [cited by applicant]
US 20240107219A1 · He · 2024 [cited by applicant]
US 20240276155A1 · Li et al. · 2024 [cited by applicant]
CN 109547888A · 2019 [cited by applicant]
CN 209330353U · 2019 [cited by applicant]
CN 212909891U · 2021 [cited by applicant]
CN 113573215A · 2021 [cited by applicant]
CN 113905304A · 2022 [cited by applicant]
CN 114286228A · 2022 [cited by applicant]
CN 114286237A · 2022 [cited by applicant]
CN 216357224U · 2022 [cited by applicant]
CN 115175069A · 2022 [cited by applicant]
CN 115209267A · 2022 [cited by applicant]
CN 115209268A · 2022 [cited by applicant]
CN 115209285A · 2022 [cited by applicant]
JP 2001326986A · 2001 [cited by applicant]
WO 2021133679A1 · 2021 [cited by applicant]
The Extended European Search Report in European Application No. 24223173.6 mailed on Apr. 30, 2025, 10 pages. [cited by applicant]
Notice of Preliminary Rejection in Korean Application No. 10-2024-7027447 mailed on Aug. 13, 2025, 10 pages. [cited by applicant]
The Extended European Search Report in European Application No. 23881092.3 mailed on Jun. 30, 2025, 9 pages. [cited by applicant]
Notice of Allowance in Japanese Application No. 2024-550246 mailed on Sep. 2, 2025, 6 pages. [cited by applicant]