IP Library Granted Patent US 12,464,299
Granted Patent B2
US 12,464,299 · App. 18/472,442 · Granted Nov 4, 2025

Systems and methods for suppressing sound leakage

Inventors: Xin Qi (Shenzhen, CN); Fengyun Liao (Shenzhen, CN); Jinbo Zheng (Shenzhen, CN); Qian Chen (Shenzhen, CN); Hao Chen (Shenzhen, CN); Lei Zhang (Shenzhen, CN); Peigeng Tong (Shenzhen, CN); Guolin Xie (Shenzhen, CN); Yongjian Li (Shenzhen, CN); Jiang Xu (Shenzhen, CN); Tao Zhao (Shenzhen, CN); Duoduo Wu (Shenzhen, CN); Ao Ji (Shenzhen, CN)
Assignee: SHENZHEN SHOKZ CO., LTD.
H04R25/505G10K9/13G10K9/22G10K11/175G10K11/178G10K11/26H04R1/2811H04R9/066G10K2210/3216H04R1/2876H04R17/00H04R2460/13
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,464,299
App. No.
18/472,442
Granted
Nov 4, 2025
Kind
B2
Abstract

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

Claims (24)

1 . An earphone, comprising:

a sound production component including a housing and a transducer, the transducer residing inside the housing and being configured to generate vibrations, the vibrations producing a sound wave inside the housing; and

an ear hook, in a wearing state, the ear hook being used to place the sound production component at a position near an ear canal but not blocking the ear canal, wherein

the housing is provided with a first sound guiding hole on an inner side surface towards the auricle for guiding the sound wave inside the housing through the first sound guiding hole to the ear canal and to surrounding environment, and a distance between a center of the first sound guiding hole and an upper vertex of the ear hook is in range of 17.5 mm to 27.0 mm.

2 . The earphone of claim 1 , wherein in the wearing state, the housing is at least partially located at an antihelix and a distance from the center of the first sound guiding hole to a lower side surface of the sound production component is in a range of 2.3 mm to 3.6 mm.

3 . The earphone of claim 2 , wherein a distance from the center of the first sound guiding hole to a rear side surface of the sound production component is in a range of 9.5 mm to 15.0 mm.

4 . The earphone of claim 1 , wherein in the wearing state, a ratio of the distance between the center of the first sound guiding hole and the upper vertex of the ear hook to a distance between an upper boundary and a lower boundary of the inner side surface is in a range of 0.95 to 1.55.

5 . The earphone of claim 4 , wherein in the wearing state, a ratio of the distance between the center of the first sound guiding hole and the upper vertex of the ear hook to a distance from the center of the first sound guiding hole to an upper side surface of the sound production component is in a range of 1.19 to 2.50.

6 . The earphone of claim 1 , wherein a distance from the center of the first sound guiding hole to a plane in which the ear hook is located is in a range of 3 mm to 6 mm.

7 . The earphone of claim 1 , wherein a ratio of an area of the first sound guiding hole to an area of the inner side surface is in a range of 0.015 to 0.25.

8 . The earphone of claim 7 , wherein the area of the first sound guiding hole is in a range of 2.87 mm 2 to 46.10 mm 2 .

9 . The earphone of claim 7 , wherein the area of the inner side surface is in a range of 160 mm 2 to 240 mm 2 .

10 . The earphone of claim 1 , wherein a ratio of a long-axis dimension of the first sound guiding hole to a short-axis dimension of the first sound guiding hole is in a range of 1 to 10.

11 . The earphone of claim 10 , wherein a ratio of a long-axis dimension of the first sound guiding hole to a short-axis dimension of the first sound guiding hole is in a range of 2 to 4.

12 . The earphone of claim 1 , wherein the sound wave transmitted to the surrounding environment forms a leaked sound wave in a target region, the housing is further provided with a second sound guiding hole for guiding a sound wave in the target region, the first sound guiding hole and the second sound guiding hole are located on different side walls of the housing, and the guided sound wave of the second sound guiding hole and the leaked sound wave of the first sound guiding hole have different phases.

13 . The earphone of claim 12 , wherein the second sound guiding hole is located on the upper side surface of the housing.

14 . The earphone of claim 12 , wherein the first sound guiding hole or the second sound guiding hole includes a damping layer, the damping layer being configured to adjust the phase of the sound wave of the first sound guiding hole or the second sound guiding hole.

15 . The earphone of claim 14 , wherein the damping layer includes at least one of: a tuning paper, a tuning cotton, a nonwoven fabric, a silk, a cotton, a sponge, or a rubber.

16 . The earphone of claim 12 , wherein a shape of the first sound guiding hole or the second sound guiding hole includes circle, ellipse, quadrangle, rectangle, or linear.

17 . The earphone of claim 12 , wherein the sound production component further includes:

at least one acoustic route coupled to at least one sound guiding hole of the first sound guiding hole or the second sound guiding hole, wherein a guided sound wave of the at least one sound guiding hole is propagated to the at least one sound guiding hole along the acoustic route, and the at least one acoustic route is configured to adjust a frequency of the guided sound wave of the at least one sound guiding hole.

18 . The earphone of claim 17 , wherein the acoustic route is configured to adjust a frequency of the guided sound wave of the at least one sound guiding hole by filtering sound waves in target frequencies.

19 . The earphone of claim 17 , wherein the acoustic route includes one or more lumen structures.

20 . The earphone of claim 17 , wherein the acoustic route includes one or more resonance cavities.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2023
From: QI, XIN; LIAO, FENGYUN; ZHENG, JINBO; CHEN, QIAN; CHEN, HAO; ZHANG, LEI; TONG, PEIGENG; XIE, GUOLIN; LI, YONGJIAN; XU, JIANG; ZHAO, TAO; WU, DUODUO; JI, AO
To: SHENZHEN SHOKZ CO., LTD.
Reel/Frame 065758/0372 →
Priority Claims (4)
CN 201410005804.0 · Jan 6, 2014 · national
CN 202211336918.4 · Oct 28, 2022 · national
CN 202223239628.6 · Dec 1, 2022 · national
WO PCT/CN2022/144339 · Dec 30, 2022 · international
Continuity (14)
Continuation In Part 18308760 · Apr 28, 2023
Continuation 17804611 · May 31, 2022
Continuation 17170874 · Feb 8, 2021
Continuation In Part 17074762 · Oct 20, 2020
Continuation In Part 16813915 · Mar 10, 2020
Continuation 16419049 · May 22, 2019
Continuation 16180020 · Nov 5, 2018
Continuation 15650909 · Jul 16, 2017
Continuation 15109831
Continuation In Part 16833839 · Mar 30, 2020
Continuation 15752452
Continuation In Part 18332747 · Jun 11, 2023
Continuation PCTCN2023079410 · Mar 2, 2023
Related Publication 20240015453A1 · Jan 11, 2024
References Cited (217)
US 2075196A · Hand · 1937 [cited by applicant]
US 2327320A · Shapiro · 1943 [cited by applicant]
US 4791673A · Schreiber · 1988 [cited by applicant]
US 4987597A · Haertl · 1991 [cited by applicant]
US 5280524A · Norris · 1994 [cited by applicant]
US 5282251A · Petersen · 1994 [cited by applicant]
US 5323468A · Bottesch · 1994 [cited by applicant]
US 5430803A · Kimura et al. · 1995 [cited by applicant]
US 5673328A · Wandl et al. · 1997 [cited by applicant]
US 5692059A · Kruger · 1997 [cited by applicant]
US 5757935A · Kang et al. · 1998 [cited by applicant]
US 5790684A · Niino et al. · 1998 [cited by applicant]
US 6377697B1 · Cheng · 2002 [cited by applicant]
US 6456721B1 · Fukuda · 2002 [cited by applicant]
US 6668065B2 · Lee et al. · 2003 [cited by applicant]
US 6850138B1 · Sakai · 2005 [cited by applicant]
US 7400738B2 · Niederdrank et al. · 2008 [cited by applicant]
US 7639825B2 · Fukuda · 2009 [cited by applicant]
US 7822215B2 · Carazo et al. · 2010 [cited by applicant]
US 8141678B2 · Ikeyama et al. · 2012 [cited by applicant]
US 8325964B2 · Weisman · 2012 [cited by applicant]
US 8340334B2 · Suyama · 2012 [cited by applicant]
US 8345915B2 · Shin et al. · 2013 [cited by applicant]
US 8433082B2 · Abolfathi · 2013 [cited by applicant]
US 8447061B2 · Lee · 2013 [cited by applicant]
US 8520867B2 · Koike et al. · 2013 [cited by applicant]
US 8526641B2 · Parker et al. · 2013 [cited by applicant]
US 8553910B1 · Dong et al. · 2013 [cited by applicant]
US 8660278B2 · Abolfathi et al. · 2014 [cited by applicant]
US 8699742B2 · Heiman et al. · 2014 [cited by applicant]
US 8737649B2 · Parker et al. · 2014 [cited by applicant]
US 8908891B2 · Mersky · 2014 [cited by applicant]
US 9226075B2 · Lee · 2015 [cited by applicant]
US 9253563B2 · Fukuda · 2016 [cited by applicant]
US 9729978B2 · Qi et al. · 2017 [cited by applicant]
US 10149071B2 · Qi et al. · 2018 [cited by applicant]
US 10334372B2 · Qi et al. · 2019 [cited by applicant]
US 10506362B1 · Gomes · 2019 [cited by applicant]
US 10616696B2 · Qi et al. · 2020 [cited by applicant]
US 10631075B1 · Patil et al. · 2020 [cited by applicant]
US 10897677B2 · Walraevens et al. · 2021 [cited by applicant]
US 11140497B2 · Liao et al. · 2021 [cited by applicant]
US 11197106B2 · Qi et al. · 2021 [cited by applicant]
US 11323830B2 · Liao et al. · 2022 [cited by applicant]
US 11323832B2 · Liao et al. · 2022 [cited by applicant]
US 11343623B2 · Liao et al. · 2022 [cited by applicant]
US 11343624B2 · Liao et al. · 2022 [cited by applicant]
US 11343625B2 · Liao et al. · 2022 [cited by applicant]
US 11368800B2 · Qi et al. · 2022 [cited by applicant]
US 11399245B2 · Liao et al. · 2022 [cited by applicant]
US 11438717B2 · Liao et al. · 2022 [cited by applicant]
US 11570560B2 · Liao et al. · 2023 [cited by applicant]
US 11582563B2 · Qi et al. · 2023 [cited by applicant]
US 11611837B2 · Liao et al. · 2023 [cited by applicant]
US 20030012395A1 · Fukuda · 2003 [cited by applicant]
US 20030048913A1 · Lee et al. · 2003 [cited by applicant]
US 20040105566A1 · Matsunaga et al. · 2004 [cited by applicant]
US 20040131219A1 · Polk, Jr. · 2004 [cited by applicant]
US 20050251952A1 · Johnson · 2005 [cited by applicant]
US 20050254672A1 · Kobayashi · 2005 [cited by applicant]
US 20060098829A1 · Kobayashi · 2006 [cited by applicant]
US 20060140435A1 · Sheehy et al. · 2006 [cited by applicant]
US 20060165246A1 · Lee et al. · 2006 [cited by applicant]
US 20060262954A1 · Lee et al. · 2006 [cited by applicant]
US 20070009133A1 · Gerkinsmeyer · 2007 [cited by applicant]
US 20070034493A1 · Kawasaki et al. · 2007 [cited by applicant]
US 20070041595A1 · Carazo et al. · 2007 [cited by applicant]
US 20070053536A1 · Westerkull · 2007 [cited by applicant]
US 20070053542A1 · Lee · 2007 [cited by applicant]
US 20070237341A1 · Laroche · 2007 [cited by applicant]
US 20080107300A1 · Chen · 2008 [cited by applicant]
US 20080144874A1 · Wu et al. · 2008 [cited by applicant]
US 20090095613A1 · Lin · 2009 [cited by applicant]
US 20090103768A1 · Lin · 2009 [cited by applicant]
US 20090147981A1 · Blanchard et al. · 2009 [cited by applicant]
US 20090208031A1 · Abolfathi · 2009 [cited by applicant]
US 20090209806A1 · Hakansson · 2009 [cited by applicant]
US 20090245553A1 · Parker · 2009 [cited by applicant]
US 20090285417A1 · Shin et al. · 2009 [cited by applicant]
US 20090290730A1 · Fukuda et al. · 2009 [cited by applicant]
US 20100054492A1 · Eaton et al. · 2010 [cited by applicant]
US 20100322454A1 · Ambrose et al. · 2010 [cited by applicant]
US 20100329485A1 · Fukuda · 2010 [cited by applicant]
US 20110150262A1 · Nakama et al. · 2011 [cited by applicant]
US 20120020501A1 · Lee · 2012 [cited by applicant]
US 20120070022A1 · Saiki · 2012 [cited by applicant]
US 20120177206A1 · Yamagishi et al. · 2012 [cited by applicant]
US 20120201406A1 · Yamaguchi · 2012 [cited by applicant]
US 20130163791A1 · Qi et al. · 2013 [cited by applicant]
US 20130259271A1 · Miyoshi et al. · 2013 [cited by applicant]
US 20130329919A1 · He · 2013 [cited by applicant]
US 20140009008A1 · Li et al. · 2014 [cited by applicant]
US 20140064533A1 · Kasic, II · 2014 [cited by applicant]
US 20140185822A1 · Kunimoto et al. · 2014 [cited by applicant]
US 20140185837A1 · Kunimoto et al. · 2014 [cited by applicant]
US 20140274229A1 · Fukuda · 2014 [cited by applicant]
US 20140315605A1 · Cho et al. · 2014 [cited by applicant]
US 20140355777A1 · Nabata et al. · 2014 [cited by applicant]
US 20150030189A1 · Nabata et al. · 2015 [cited by applicant]
US 20150195664A1 · Lin et al. · 2015 [cited by applicant]
US 20150208183A1 · Bern · 2015 [cited by applicant]
US 20150256656A1 · Horii · 2015 [cited by applicant]
US 20150264473A1 · Fukuda · 2015 [cited by applicant]
US 20150268673A1 · Farzbod et al. · 2015 [cited by applicant]
US 20150326967A1 · Otani · 2015 [cited by applicant]
US 20160037243A1 · Lippert et al. · 2016 [cited by applicant]
US 20160127841A1 · Horii · 2016 [cited by applicant]
US 20160150337A1 · Nandy · 2016 [cited by applicant]
US 20160165357A1 · Morishita et al. · 2016 [cited by applicant]
US 20160295328A1 · Park · 2016 [cited by applicant]
US 20160329041A1 · Qi et al. · 2016 [cited by applicant]
US 20170201823A1 · Shetye et al. · 2017 [cited by applicant]
US 20170223445A1 · Bullen et al. · 2017 [cited by applicant]
US 20180167710A1 · Silver et al. · 2018 [cited by applicant]
US 20180182370A1 · Hyde et al. · 2018 [cited by applicant]
US 20190014425A1 · Liao et al. · 2019 [cited by applicant]
US 20190052954A1 · Rusconi Clerici Beltrami et al. · 2019 [cited by applicant]
US 20190238971A1 · Wakeland et al. · 2019 [cited by applicant]
US 20190320258A1 · Ohura · 2019 [cited by applicant]
US 20200196062A1 · Zhang · 2020 [cited by applicant]
US 20200228904A1 · Liao et al. · 2020 [cited by applicant]
US 20200367008A1 · Walsh et al. · 2020 [cited by applicant]
US 20210067857A1 · Struzik · 2021 [cited by applicant]
US 20210099027A1 · Larsson et al. · 2021 [cited by applicant]
US 20210219059A1 · Qi et al. · 2021 [cited by applicant]
US 20210258696A1 · Qi et al. · 2021 [cited by applicant]
US 20220124428A1 · Zheng et al. · 2022 [cited by applicant]
US 20220240029A1 · Liao et al. · 2022 [cited by applicant]
US 20220312108A1 · Zhang et al. · 2022 [cited by applicant]
US 20230130211A1 · Li et al. · 2023 [cited by applicant]
US 20230179907A1 · Zhang et al. · 2023 [cited by applicant]
US 20240276155A1 · Li et al. · 2024 [cited by applicant]
CN 201616895U · 2010 [cited by applicant]
CN 201690580U · 2010 [cited by applicant]
CN 102014328A · 2011 [cited by applicant]
CN 102421043A · 2012 [cited by applicant]
CN 202435600U · 2012 [cited by applicant]
CN 103167390A · 2013 [cited by applicant]
CN 103347235A · 2013 [cited by applicant]
CN 204206450U · 2015 [cited by applicant]
CN 105007551A · 2015 [cited by applicant]
CN 105101019A · 2015 [cited by applicant]
CN 105101020A · 2015 [cited by applicant]
CN 105142077A · 2015 [cited by applicant]
CN 204887455U · 2015 [cited by applicant]
CN 205142506U · 2016 [cited by applicant]
CN 109547888A · 2019 [cited by applicant]
CN 212909891U · 2021 [cited by applicant]
CN 214014497U · 2021 [cited by applicant]
CN 113573215A · 2021 [cited by applicant]
CN 114286228A · 2022 [cited by applicant]
CN 216357224U · 2022 [cited by applicant]
CN 115175069A · 2022 [cited by applicant]
EP 1261232A1 · 2002 [cited by applicant]
EP 1404146A1 · 2004 [cited by applicant]
EP 1603362A1 · 2005 [cited by applicant]
EP 2779684A1 · 2014 [cited by applicant]
EP 2011367B1 · 2014 [cited by applicant]
JP S5574290A · 1980 [cited by applicant]
JP S5977795A · 1984 [cited by applicant]
JP 07007797A · 1995 [cited by applicant]
JP 2001326986A · 2001 [cited by applicant]
JP 2003264882A · 2003 [cited by applicant]
JP 2004064457A · 2004 [cited by applicant]
JP 2004158961A · 2004 [cited by applicant]
JP 2005151183A · 2005 [cited by applicant]
JP 2006025333A · 2006 [cited by applicant]
JP 2006332715A · 2006 [cited by applicant]
JP 2007129384A · 2007 [cited by applicant]
JP 2007251358A · 2007 [cited by applicant]
JP 2008017398A · 2008 [cited by applicant]
JP 2011160175A · 2011 [cited by applicant]
JP 2013055571A · 2013 [cited by applicant]
JP 2013243564A · 2013 [cited by applicant]
JP 2014072555A · 2014 [cited by applicant]
KR 20010111653A · 2001 [cited by applicant]
KR 20050030183A · 2005 [cited by applicant]
KR 20070122104A · 2007 [cited by applicant]
KR 20090082999A · 2009 [cited by applicant]
KR 20110037483A · 2011 [cited by applicant]
KR 200476572Y1 · 2015 [cited by applicant]
WO 2004095878A2 · 2004 [cited by applicant]
WO 2006088410A1 · 2006 [cited by applicant]
WO 2007034739A1 · 2007 [cited by applicant]
WO WO2021133679A1 · 2021 [cited by examiner]
Decision of Patent Grant in Korean Application No. 10-2016-7017110 mailed on Jun. 14, 2018, 3 pages. [cited by applicant]
International Search Report in PCT/CN2014/094065 mailed on Mar. 17, 2015, 5 pages. [cited by applicant]
First Office Action in Chinese application No. 201410005804.0 mailed on Dec. 17, 2015, 10 pages. [cited by applicant]
Communication Pursuant to Article 94(3) EPC in European Application No. 14877111.6 mailed on Apr. 23, 2018, 6 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2016-545828 mailed on Oct. 10, 2017, 6 pages. [cited by applicant]
Decision to Grant a Patent in Japanese Application No. 2016-545828 mailed on Jan. 16, 2018, 5 pages. [cited by applicant]
The Extended European Search Report in European Application No. 14877111.6 mailed on Mar. 17, 2017, 6 pages. [cited by applicant]
First Examination Report in Indian Application No. 201617026062 mailed on Nov. 13, 2020, 6 pages. [cited by applicant]
Written Opinion in PCT/CN2014/094065 mailed on Mar. 17, 2015, 10 pages. [cited by applicant]
International Search Report in PCT/CN2015/086907 mailed on May 6, 2016, 12 pages. [cited by applicant]
The Extended European Search Report in European Application No. 15900793.9 mailed on May 17, 2018, 9 pages. [cited by applicant]
Communication Pursuant to Article 94(3) EPC in European Application No. 15900793.9 mailed on Apr. 10, 2019, 6 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2018146019 mailed on Jul. 23, 2019, 10 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2018146021 mailed on Jul. 30, 2019, 11 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2018-506985 mailed on Sep. 3, 2019, 10 pages. [cited by applicant]
Decision of Final Rejection in Japanese Application No. 2018-146019 mailed on Jan. 21, 2020, 9 pages. [cited by applicant]
Communication Pursuant to Article 94(3) EPC in European Application No. 15900793,9 mailed on Apr. 28, 2020, 9 pages. [cited by applicant]
Decision to Grant a Patent in Japanese Application No. 2018-146021 mailed on Jul. 21, 2020, 6 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2020-088413 mailed on Aug. 3, 2021, 7 pages. [cited by applicant]
M. Gripper et al., Using the Callsign Acquisition Test (CAT) to Compare the Speech Intelligibility of Air Versus Bone Conduction, International Journal of Industrial Ergonomics, 37(7): 631-641, 2007. [cited by applicant]
Martin L. Lenhardt et al., Measurement of Bone Conduction Levels for High Frequencies, International Tinnitus Journal, 8(1): 9-12, 2002. [cited by applicant]
The Extended European Search Report in European Application No. 21186537.3 mailed on Nov. 9, 2021, 9 pages. [cited by applicant]
Notice of Preliminary Rejection in Korean Application No. 10-2022-7003237 mailed on Apr. 13, 2022, 14 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2020-088413 mailed on Sep. 6, 2022, 11 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2021-179711 mailed on Oct. 18, 2022, 9 pages. [cited by applicant]
Notice of Preliminary Rejection in Korean Application No. 10-2022-7003237 mailed on Oct. 11, 2022, 14 pages. [cited by applicant]
Office Action in Brazilian Application No. 112018002854-1 mailed on Feb. 24, 2023, 8 pages. [cited by applicant]
Paula Henry et al., Bone Conduction: Anatomy, Physiology, and Communication, Army Research Laboratory, 2007, 206 pages. [cited by applicant]
Notice of Reasons for Rejection in Japanese Application No. 2020088413 mailed on Apr. 4, 2023, 8 pages. [cited by applicant]
The Extended European Search Report in European Application No. 24223173.6 mailed on Apr. 30, 2025, 10 pages. [cited by applicant]
Notice of Rejection in Japanese Application No. 2024-550245 mailed on Sep. 2, 2025, 9 pages. [cited by applicant]
Notice of Preliminary Rejection in Korean Application No. 10-2024-7028850 mailed on Aug. 25, 2025, 8 pages. [cited by applicant]