IP Library › Assignment 005816/0064
Patent Assignment
Reel/Frame 005816/0064

Change of Address Effective 11/28/88.

Recorded: 1991-08-14 Pages: 5
Assignor
Assignee
MITSUBISHI KINZOKU KABUSHIKI KAISHA
6-1, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties (46)
Method of Vertical Continuous Casting
Patent: 4,688,625 →
Application: 06/871,123 →
Twist Drill Bit
Patent: 4,744,705 →
Application: 06/895,177 →
Method of Producing Wafer
Patent: 4,756,796 →
Application: 06/917,726 →
Heat-Transfer Material and Method of Producing Same
Patent: 4,780,373 →
Application: 06/934,652 →
Permanent Magnet Electric Motor
Patent: 4,748,361 →
Application: 06/937,713 →
Surface-Coated Cutting Member
Patent: 4,781,989 →
Application: 07/022,278 →
Wire Member of Cemented Carbide Based on Tungsten Carbide
Application: 07/030,173 →
Insert Cutter
Patent: 4,808,044 →
Application: 07/043,621 →
Roll for Mill
Patent: 4,817,410 →
Application: 07/058,174 →
Insert Rotary Cutting Tool
Patent: 4,844,666 →
Application: 07/087,104 →
Apparatus and Method for Manufacturing Copper-Base Alloy
Patent: 5,062,614 →
Application: 07/090,652 →
Method of Preparing Uranium Dioxide Powder from Uranium Hexafluoride
Patent: 4,963,294 →
Application: 07/139,443 →
Method of Controlling the Crystal Grain Size of Uranium Dioxide Pellet
Patent: 4,873,031 →
Application: 07/139,447 →
Method of and Apparatus for Dressing Cutting Edge of Cut-Off Wheel
Patent: 4,926,836 →
Application: 07/181,202 →
Heat-Transfer Material and Method of Producing Same
Patent: 4,879,185 →
Application: 07/221,990 →
Method of Producing Heat-Transfer Material
Patent: 4,826,578 →
Application: 07/221,999 →
Method of Producing Heat-Transfer Material
Patent: 4,824,530 →
Application: 07/222,142 →
Apparatus for Collecting Wafers
Patent: 4,899,719 →
Application: 07/223,512 →
Slicing Machine for Cutting Semiconductor Material
Patent: 4,903,437 →
Application: 07/223,798 →
Apparatus for Cutting Semiconductor Crystal
Patent: 4,971,021 →
Application: 07/223,802 →
Rare Earth-Iron-Boron Magnet Powder and Process of Producing Same
Patent: 4,981,532 →
Application: 07/234,405 →
A Wire Member of Cemented Carbide
Patent: 5,068,149 →
Application: 07/249,909 →
Coolant Supply Nozzle Apparatus for Slicing Machine
Patent: 4,944,121 →
Application: 07/255,826 →
Slicing Apparatus with Work-Feeding Mechanism in Feedback Control
Patent: 4,932,389 →
Application: 07/260,200 →
Apparatus for Detecting and Centering Wafer
Patent: 4,944,650 →
Application: 07/263,726 →
Manufacturing Method of Extra Fine Wire
Patent: 4,901,550 →
Application: 07/291,009 →
Method and Apparatus for Growing Silicon Crystals
Patent: 4,981,549 →
Application: 07/313,799 →
Method for Manufacturing Copper-Base Alloy
Patent: 4,981,514 →
Application: 07/384,268 →
Roll for Mill and Method of Making a Roll for a Mill
Patent: 4,961,261 →
Application: 07/393,828 →
Cermet and Process of Producing Same
Patent: 4,935,057 →
Application: 07/405,523 →
Blade Member of Tungsten-Carbide-Based Cemented Carbide for Cutting Tools and Process for Producing Same
Patent: 5,106,674 →
Application: 07/429,713 →
Cermet Blade Member for Cutting-Tools and Process for Producing Same
Patent: 5,059,491 →
Application: 07/435,200 →
Diamond-Coated Tool Member, Substrate Thereof and Method for Producing Same
Patent: 5,068,148 →
Application: 07/454,513 →
Microdrill Bit
Patent: 5,009,705 →
Application: 07/458,099 →
Sintered Rare Earth Metal-Boron-Iron Alloy Magnets and a Method for Their Production
Patent: 5,147,447 →
Application: 07/460,079 →
Apparatus for Collecting Wafers
Patent: 4,974,577 →
Application: 07/460,403 →
Cu-Based Sintered Alloy
Patent: 5,114,468 →
Application: 07/474,748 →
Method for Plastic-Working Ingots of Heat-Resistant Alloy Containing Boron
Patent: 5,019,179 →
Application: 07/495,290 →
Surface-Coated Tool Member of Tungsten Carbide Based Cemented Carbide
Patent: 5,066,553 →
Application: 07/507,665 →
Rare Earth-Iron-Boron Magnet Powder and Process of Producing Same
Patent: 5,110,374 →
Application: 07/534,185 →
Method of Manufacturing Golf Club Head
Patent: 5,056,705 →
Application: 07/555,181 →
Rare Earth Permanent Magnet Powder, Method for Producing Same and Bonded Magnet
Patent: 5,228,930 →
Application: 07/560,594 →
Method and Apparatus for Growing Silicon Crystals
Application: 07/574,484 →
Chain Cutter
Application: 07/586,942 →
Cutting Apparatus
Application: 07/586,958 →
Inside Diameter Blade
Application: 07/675,024 →
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Aug 11, 1986
From: IMANAGA, KOUJIROU
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA, A CORP. OF JAPAN
Reel/Frame 004590/0969 →
Assignment of Assignors Interest. Aug 19, 1987
From: TSUJIMURA, OSAMU; ARAI, TATSUO; HIYAMA, NOBUO
To: MITSUBISHI KINZOKU KABUSHIKI, 5-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN; IZUMO INDUSTRIAL CO., LTD., 1846, IMAMIYA 4-CHOME, UTSUNOMIYA-SHI, TOCHIGI-KEN, JAPAN
Reel/Frame 004792/0119 →
Assignment of Assignors Interest. Dec 30, 1987
From: YATO, TADAO; TANAKA, HIROSHI
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA
Reel/Frame 004855/0918 →
Assignment of Assignors Interest. Dec 30, 1987
From: YATO, TADAO; HAGINO, SADAAKI; TANAKA, HIROSHI
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA
Reel/Frame 004855/0922 →
Assignment of Assignors Interest. Apr 13, 1988
From: ABE, SEIICHI
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA
Reel/Frame 004879/0351 →
Assignment of Assignors Interest. Jul 22, 1988
From: SHIRATORI, YOSHITAKA; SAKAMOTO, TOMOYOSHI; ABE, SEIICHI
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA, 5-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Reel/Frame 004924/0443 →
Assignment of Assignors Interest. Jul 25, 1988
From: KUBOTERA, YUTAKA; AKIYAMA, KAZUNARI
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA, 5-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Reel/Frame 004933/0934 →
Assignment of Assignors Interest. Jul 25, 1988
From: KUBOTERA, YUTAKA; AKIYAMA, KAZUNARI
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA, 5-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Reel/Frame 004933/0935 →
Assignment of Assignors Interest. Aug 19, 1988
From: TAKESHITA, TAKUO; NAKAYAMA, RYOJI; OGAWA, TAMOTSU
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA
Reel/Frame 004928/0991 →
Assignment of Assignors Interest. Sep 27, 1988
From: SHIMADA, FUMIO; KAINUMA, TADASHI
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA, 5-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Reel/Frame 004962/0082 →
Assignment of Assignors Interest. Oct 11, 1988
From: YOSHIDA, KAZUHIRO; OHTA, HIDEJI
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA
Reel/Frame 004959/0648 →
Assignment of Assignors Interest. Oct 20, 1988
From: SAEKI, YUKIHIRO; TAGAMI, MASATOSHI
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA
Reel/Frame 004987/0430 →
Assignment of Assignors Interest. Oct 28, 1988
From: MATSUMOTO, TATSUMI
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA
Reel/Frame 005005/0457 →
Assignment of Assignors Interest. Dec 28, 1988
From: KOIDE, MASATO; IWAMURA, TAKURA; KOYA, TSUGIO
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA
Reel/Frame 005011/0042 →
Assignment of Assignors Interest. Oct 30, 1989
From: KIKUCHI, TOSHIAKI; ONOSHITA, TOSHIO; YATO, TADAO; TANAKA, HIROSHI
To: MITSUBISHI KINZOKU KABUSHIKI KAISHA
Reel/Frame 005173/0770 →
Change of Name Effective on 12/01/1990 Aug 14, 1991
From: MITSUBISHI KINSOKU KABUSHIKI KAISHA (CHANGED TO)
To: MITSUBISHI MATERIALS CORPORATION
Reel/Frame 005816/0053 →
Assignment of Assignors Interest. Dec 11, 1991
From: JAPAN SILICON CO., LTD.
To: MITSUBISHI MATERIALS SILICON CORPORATION
Reel/Frame 005939/0772 →
Corporate Succession May 11, 2006
From: MITSUBISHI MATERIALS CORPORATION
To: MITSUBISHI MATERIALS PMG CORPORATION
Reel/Frame 017606/0248 →