Patent Assignment
Reel/Frame 008004/0797
Assignment of Assignor's Interest
Recorded: 1996-06-24
Pages: 2
Assignee
LG SEMICON CO., LTD.
1, HYANGIEONG-DONG, HEUNGDUK-KU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming Rugged Tungsten Film and Method for Fabricating Semiconductor Device Utilizing the Same
Patent:
5,563,090 →
Application:
08/419,264 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Mar 9, 2014
From: HYUNDAI MICROELECTRONICS, CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 032387/0342 →
Assignment of Assignor's Interest
Mar 9, 2014
From: SK HYNIX INC
To: INTELLECTUAL DISCOVERY CO., LTD.
Reel/Frame 032421/0488 →
Change of Name
Mar 9, 2014
From: HYNIX SEMICONDUCTOR, INC.
To: SK HYNIX INC
Reel/Frame 032421/0496 →
Change of Name
Mar 9, 2014
From: LG SEMICON CO., LTD.
To: HYUNDAI MICROELECTRONICS, CO., LTD.
Reel/Frame 032421/0536 →
Change of Name
Mar 9, 2014
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 032421/0637 →