IP Library › Assignment 032387/0342
Patent Assignment
Reel/Frame 032387/0342

Merger

Recorded: 2014-03-09 Pages: 7
Assignor
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
136-1, AMI-RI SAN, BUBAL-EUP, GYEONGGI-DO, ICHEON-SI, KOREA, REPUBLIC OF
Covered Properties (10)
Method for Forming Rugged Tungsten Film and Method for Fabricating Semiconductor Device Utilizing the Same
Patent: 5,563,090 →
Application: 08/419,264 →
Method for Forming Rugged Tungsten Film and Method for Fabricating Semiconductor Device Utilizing the Same
Patent: 6,348,708 →
Application: 08/675,692 →
Semiconductor Device with Diagonal Capacitor Bit Line and Fabrication Method Thereof
Patent: 6,133,598 →
Application: 09/084,982 →
Tddb Test Pattern and Method for Testing Tddb of Mos Capacitor Dielectric
Patent: 6,351,135 →
Application: 09/342,514 →
Capacitor of Semiconductor Device and Method of Fabricating the Same
Patent: 6,358,794 →
Application: 09/383,232 →
Fabrication Method of Semiconductor Device with Diagonal Capacitor Bit Line
Patent: 6,344,391 →
Application: 09/660,337 →
Tddb Test Pattern and Method for Testing Tddb of Mos Capacitor Dielectric
Patent: 6,781,401 →
Application: 09/995,680 →
Publication: US 2002/0033710
Capacitor of Semiconductor Device and Method of Fabricating the Same
Patent: 6,753,564 →
Application: 10/078,706 →
Publication: US 2002/0081813
Tddb Test Pattern and Method for Testing Tddb of Mos Capacitor Dielectric
Patent: 7,170,309 →
Application: 10/895,285 →
Publication: US 2004/0257107
Tddb Test Pattern and Method for Testing Tddb of Mos Capacitor Dielectric
Patent: 7,479,797 →
Application: 11/643,656 →
Publication: US 2007/0103184
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 24, 1996
From: LEE, YOUNG JONG; CHO, BOK WON
To: LG SEMICON CO., LTD.
Reel/Frame 008004/0797 →
Assignment of Assignor's Interest May 28, 1998
From: LEE, CHANG-JAE; PARK, NAE-HAK
To: LG SEMICON CO., LTD.
Reel/Frame 009209/0858 →
Assignment of Assignor's Interest Jun 29, 1999
From: KIM, HA ZOONG
To: L G SEMICON CO., LTD.
Reel/Frame 010096/0168 →
Assignment of Assignor's Interest Aug 26, 1999
From: OH, KI-YOUNG
To: HYUNDAI MICROELECTRONICS, CO., LTD.
Reel/Frame 010203/0879 →
Corrective Assignment of Assignee's Name to "Lg Semicon Co., Ltd." Thereby Corresponding to the Name on the Executed Assignment Previously Recorded on Reel 10096, Frame 0168. Jan 4, 2000
From: KIM, HA ZOONG
To: LG SEMICON CO., LTD.
Reel/Frame 010502/0792 →
Change of Name Mar 9, 2014
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 032421/0637 →
Assignment of Assignor's Interest Mar 9, 2014
From: SK HYNIX INC
To: INTELLECTUAL DISCOVERY CO., LTD.
Reel/Frame 032421/0488 →
Change of Name Mar 9, 2014
From: LG SEMICON CO., LTD.
To: HYUNDAI MICROELECTRONICS, CO., LTD.
Reel/Frame 032421/0536 →
Change of Name Mar 9, 2014
From: HYNIX SEMICONDUCTOR, INC.
To: SK HYNIX INC
Reel/Frame 032421/0496 →