Patent Assignment
Reel/Frame 032421/0536
Change of Name
Recorded: 2014-03-09
Pages: 101
Assignor
LG SEMICON CO., LTD.
Executed: 1999-07-29
Assignee
HYUNDAI MICROELECTRONICS, CO., LTD.
HYANGJEONG-DONG, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, KOREA, REPUBLIC OF
Covered Properties
(8)
Method for Forming Rugged Tungsten Film and Method for Fabricating Semiconductor Device Utilizing the Same
Patent:
5,563,090 →
Application:
08/419,264 →
Method for Forming Rugged Tungsten Film and Method for Fabricating Semiconductor Device Utilizing the Same
Patent:
6,348,708 →
Application:
08/675,692 →
Semiconductor Device with Diagonal Capacitor Bit Line and Fabrication Method Thereof
Patent:
6,133,598 →
Application:
09/084,982 →
Tddb Test Pattern and Method for Testing Tddb of Mos Capacitor Dielectric
Patent:
6,351,135 →
Application:
09/342,514 →
Fabrication Method of Semiconductor Device with Diagonal Capacitor Bit Line
Patent:
6,344,391 →
Application:
09/660,337 →
Tddb Test Pattern and Method for Testing Tddb of Mos Capacitor Dielectric
Tddb Test Pattern and Method for Testing Tddb of Mos Capacitor Dielectric
Tddb Test Pattern and Method for Testing Tddb of Mos Capacitor Dielectric
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 24, 1996
From: LEE, YOUNG JONG; CHO, BOK WON
To: LG SEMICON CO., LTD.
Reel/Frame 008004/0797 →
Assignment of Assignor's Interest
May 28, 1998
From: LEE, CHANG-JAE; PARK, NAE-HAK
To: LG SEMICON CO., LTD.
Reel/Frame 009209/0858 →
Assignment of Assignor's Interest
Jun 29, 1999
From: KIM, HA ZOONG
To: L G SEMICON CO., LTD.
Reel/Frame 010096/0168 →
Corrective Assignment of Assignee's Name to "Lg Semicon Co., Ltd." Thereby Corresponding to the Name on the Executed Assignment Previously Recorded on Reel 10096, Frame 0168.
Jan 4, 2000
From: KIM, HA ZOONG
To: LG SEMICON CO., LTD.
Reel/Frame 010502/0792 →
Change of Name
Mar 9, 2014
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR, INC.
Reel/Frame 032421/0637 →
Merger
Mar 9, 2014
From: HYUNDAI MICROELECTRONICS, CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 032387/0342 →
Change of Name
Mar 9, 2014
From: HYNIX SEMICONDUCTOR, INC.
To: SK HYNIX INC
Reel/Frame 032421/0496 →
Assignment of Assignor's Interest
Mar 9, 2014
From: SK HYNIX INC
To: INTELLECTUAL DISCOVERY CO., LTD.
Reel/Frame 032421/0488 →