Patent Assignment
Reel/Frame 008260/0564
Assignment of Assignor's Interest
Recorded: 1996-10-10
Pages: 2
Assignor
CLARKE, ANDREW P.
Executed: 1996-10-02
Assignee
SPUTTERED FILMS, INC., A CALIFORNIA CORP.
314 EDISON AVENUE, SANTA, CALIFORNIA, 93103
Covered Property
(1)
Method of Depositing Materials on a Wafer to Eliminate the Effect of Cracks in the Deposition
Patent:
6,086,947 →
Application:
08/729,015 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 3, 1997
From: SPUTTERED FILMS, INC.
To: FINOVA CAPITAL CORPORATION
Reel/Frame 008766/0855 →
Merger
Nov 18, 2005
From: SPUTTERED FILMS, INC.
To: TEGAL CORPORATION
Reel/Frame 017034/0567 →
Assignment of Assignor's Interest
Jun 17, 2010
From: TEGAL CORPORATION
To: OEG-TEG, LLC
Reel/Frame 024547/0285 →
Assignment of Assignor's Interest
Jun 17, 2010
From: OEG-TEG, LLC
To: OEM GROUP INC.
Reel/Frame 024547/0404 →
Security Agreement
Oct 8, 2010
From: OEM GROUP, INC.
To: COMERICA BANK, A TEXAS BANKING ASSOCIATION
Reel/Frame 025105/0799 →
Security Agreement
Oct 15, 2010
From: OEM GROUP, INC.
To: THL CORPORATE FINANCE, INC.
Reel/Frame 025137/0859 →
Release of Security Interest
Nov 21, 2014
From: COMERICA BANK
To: OEM GROUP, INC.
Reel/Frame 034233/0481 →