Patent Assignment
Reel/Frame 008766/0855
Security Agreement
Recorded: 1997-11-03
Pages: 22
Assignor
SPUTTERED FILMS, INC.
Executed: 1997-10-28
Assignee
FINOVA CAPITAL CORPORATION
355 SOUTH GRAND AVENUE, LOS ANGELES, CALIFORNIA, 90071
Covered Properties
(19)
Apparatus for Depositing a Thin Film of a Sputtered Material on a Member
Patent:
5,061,360 →
Application:
07/470,710 →
Apparatus for Depositing a Thin Layer of Sputtered Atoms on a Member
Patent:
5,135,634 →
Application:
07/655,065 →
Method for Processing Semi-Conductor Wafers in a Multiple Vacuum and Non-Vacuum Chamber Apparatus
Patent:
5,310,410 →
Application:
07/807,162 →
Apparatus for, and Method of, Depositing a Film on a Substrate
Patent:
5,766,426 →
Application:
08/388,475 →
System for and Method of Providing a Controlled Deposition on Wafers
Patent:
5,830,272 →
Application:
08/554,459 →
Apparatus for, and Method of, Depositing a Film on a Substrate
Patent:
6,605,198 →
Application:
08/564,659 →
Apparatus for, and Method of, Removing Hydrocarbons from the Surface of a Substrate
Patent:
5,914,017 →
Application:
08/651,377 →
End Effector Assembly for Inclusion in a System for Producing Uniform Deposits on a Wafer
Patent:
6,117,238 →
Application:
08/714,804 →
Method of Depositing Materials on a Wafer to Eliminate the Effect of Cracks in the Deposition
Patent:
6,086,947 →
Application:
08/729,015 →
Apparatus for, and Method of, Providing a Deposition on a Substrate
Patent:
5,865,969 →
Application:
08/736,232 →
System for and Method of Providing a Controlled Deposition of Wafers
Patent:
6,176,987 →
Application:
08/788,408 →
System for and Method of Providing a Controlled Deposition on Wafers
Application:
08/788,409 →
System for Providing a Controlled Deposition on Wafers
Patent:
5,881,668 →
Application:
08/790,732 →
System for Providing a Controlled Deposition of Wafers
Patent:
5,858,101 →
Application:
08/790,735 →
System for Providing a Controlled Deposition on Wafers
Patent:
5,879,460 →
Application:
08/790,736 →
System for of Providing a Controlled Deposition on Wafers
Patent:
5,759,268 →
Application:
08/791,449 →
System for Providing a Controlled Deposition on Wafers
Patent:
5,882,403 →
Application:
08/791,502 →
System for and Method of Providing a Controlled Deposition on Wafers
Patent:
6,083,357 →
Application:
08/791,503 →
System and Method for Hardware Emulation of a Digital Circuit
Patent:
6,106,565 →
Application:
08/807,162 →
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 14, 1995
From: CLARKE, ANDREW P.
To: SPUTTERED FILMS, INC.
Reel/Frame 007452/0499 →
Assignment of Assignor's Interest
Nov 7, 1995
From: BEGIN, ROBERT GEORGE; CLARKE, PETER J.
To: SPUTTERED FILMS, INC.
Reel/Frame 007742/0193 →
Security Agreement
Jan 11, 1996
From: SPUTTERED FILMS INC.
To: UNION BANK
Reel/Frame 007764/0336 →
Assignment of Assignor's Interest
May 22, 1996
From: CLARKE, PETER J.
To: SPUTTERED FILMS, INC., A CALIFORNIA CORPORATION
Reel/Frame 008020/0438 →
Assignment of Assignor's Interest
Sep 17, 1996
From: BEGIN,ROBERT GEORGE
To: SPUTTERED FILMS,INC. (A CA CORP.)
Reel/Frame 008228/0259 →
Assignment of Assignor's Interest
Oct 10, 1996
From: CLARKE, ANDREW P.
To: SPUTTERED FILMS, INC., A CALIFORNIA CORP.
Reel/Frame 008260/0564 →
Assignment of Assignor's Interest
Oct 23, 1996
From: CLARKE, PETER J.
To: SPUTTERED FILMS, INC., A CALIFORNIA CORP.
Reel/Frame 008285/0372 →
Assignment of Assignor's Interest
Jul 10, 1997
From: STAPLETON, WARREN; SCHAKEL, KEITH R.; JAIR, FRED C.; PENCIS, JENNIFER B.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 008598/0434 →
Security Interest
Mar 12, 1999
From: SPUTTERED FILMS, INC.
To: FINOVA CAPITAL CORPORATION
Reel/Frame 009808/0010 →
Assignment of Assignor's Interest
Sep 1, 1999
From: SPUTTERED FILMS, INC.
To: SHAMROCK TECHNOLOGY CORP.
Reel/Frame 010206/0041 →
Assignment of Assignor's Interest
Sep 1, 1999
From: SPUTTERED FILMS, INC.
To: SHAMROCK TECHNOLOGY CORP.
Reel/Frame 010206/0037 →
Assignment of Assignor's Interest
Jan 13, 2003
From: SHAMROCK TECHNOLOGY CORP.
To: APPLIED SCIENCE & TECHNOLOGY, INC.
Reel/Frame 013645/0778 →
Assignment of Assignor's Interest
Jul 1, 2005
From: APPLIED SCIENCE AND TECHNOLOGY, INC.
To: MKS INSTRUMENTS, INC.
Reel/Frame 016700/0252 →
Merger
Nov 18, 2005
From: SPUTTERED FILMS, INC.
To: TEGAL CORPORATION
Reel/Frame 017034/0567 →
Assignment of Assignor's Interest
Dec 21, 2005
From: SPUTTERED FILMS, INC.
To: TEGAL CORPORATION
Reel/Frame 017136/0098 →
Affirmation of Patent Assignment
Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023119/0083 →
Assignment of Assignor's Interest
Jun 17, 2010
From: TEGAL CORPORATION
To: OEG-TEG, LLC
Reel/Frame 024547/0285 →
Assignment of Assignor's Interest
Jun 17, 2010
From: OEG-TEG, LLC
To: OEM GROUP INC.
Reel/Frame 024547/0404 →
Security Agreement
Oct 8, 2010
From: OEM GROUP, INC.
To: COMERICA BANK, A TEXAS BANKING ASSOCIATION
Reel/Frame 025105/0799 →
Security Agreement
Oct 15, 2010
From: OEM GROUP, INC.
To: THL CORPORATE FINANCE, INC.
Reel/Frame 025137/0859 →
Release of Security Interest
Nov 21, 2014
From: COMERICA BANK
To: OEM GROUP, INC.
Reel/Frame 034233/0481 →
Change of Name
Mar 14, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038083/0231 →
Security Interest
Apr 5, 2016
From: OEM GROUP, LLC
To: THL CORPORATE FINANCE, INC., AS COLLATERAL AGENT
Reel/Frame 038355/0078 →