Patent Assignment
Reel/Frame 016700/0252
Assignment of Assignor's Interest
Recorded: 2005-07-01
Pages: 7
Assignor
APPLIED SCIENCE AND TECHNOLOGY, INC.
Executed: 2005-06-08
Assignee
MKS INSTRUMENTS, INC.
90 INDUSTRIAL WAY, WILMINGTON, MASSACHUSETTS, 01887
Covered Properties
(53)
Microwave Plasma Generator
Patent:
4,866,346 →
Application:
07/065,281 →
Microwave Reactive Gas Generator
Patent:
4,851,630 →
Application:
07/210,563 →
Microwave Reactive Gas Discharge Device
Patent:
5,142,198 →
Application:
07/454,522 →
Microwave Activated Gas Generator
Patent:
5,206,471 →
Application:
07/813,978 →
Process for Depositing Wear-Resistant Coatings
Patent:
5,279,866 →
Application:
08/075,148 →
Ozone and Other Reactive Gas Generator Cell and System
Patent:
5,637,279 →
Application:
08/298,653 →
Microwave Plasma Applicator with a Helical Fluid Cooling Channel Surrounding a Microwave Transparent Discharge Tube
Patent:
5,625,259 →
Application:
08/389,243 →
Fluid-Cooled Dielectric Window for a Plasma System
Patent:
5,568,015 →
Application:
08/389,250 →
Automatic Impedance Matching Apparatus and Method
Patent:
5,621,331 →
Application:
08/500,411 →
Microwave Plasma Deposition Source and Method of Filling High Aspect-Ratio Features on a Substrate
Patent:
5,688,382 →
Application:
08/521,958 →
System for and Method of Providing a Controlled Deposition on Wafers
Patent:
5,830,272 →
Application:
08/554,459 →
Apparatus for, and Method of, Providing a Deposition on a Substrate
Patent:
5,865,969 →
Application:
08/736,232 →
Plasma Producing Structure
Patent:
5,869,802 →
Application:
08/770,316 →
System for and Method of Providing a Controlled Deposition of Wafers
Patent:
6,176,987 →
Application:
08/788,408 →
System for Providing a Controlled Deposition on Wafers
Patent:
5,881,668 →
Application:
08/790,732 →
System for Providing a Controlled Deposition of Wafers
Patent:
5,858,101 →
Application:
08/790,735 →
System for Providing a Controlled Deposition on Wafers
Patent:
5,879,460 →
Application:
08/790,736 →
System for of Providing a Controlled Deposition on Wafers
Patent:
5,759,268 →
Application:
08/791,449 →
System for Providing a Controlled Deposition on Wafers
Patent:
5,882,403 →
Application:
08/791,502 →
System for and Method of Providing a Controlled Deposition on Wafers
Patent:
6,083,357 →
Application:
08/791,503 →
Ozone and Other Reactive Gas Generator Cell and System
Patent:
5,932,180 →
Application:
08/871,088 →
Toroidal Low-Field Reactive Gas Source
Patent:
6,150,628 →
Application:
08/883,281 →
End Effector Assembly for Inclusion in a System for Producing Uniform Deposits on a Wafer
Patent:
6,149,367 →
Application:
08/999,936 →
End Effector Assembly for Inclusion in a System for Producing Uniform Deposits on a Wafer
Patent:
6,059,517 →
Application:
08/999,937 →
End Effector Assembly for Inclusion in a System for Producing Uniform Deposits on a Wafer
Patent:
6,135,051 →
Application:
08/999,939 →
Permanent Magnet Ecr Plasma Source with Magnetic Field Optimization
Patent:
6,163,006 →
Application:
09/019,573 →
End Effector Assembly for Inclusion in a System for Producing Uniform Deposits on a Wafer
Patent:
6,051,066 →
Application:
09/059,883 →
Method and Apparatus for Launching Microwave Energy into a Plasma Processing Chamber
Patent:
6,225,592 →
Application:
09/153,193 →
Apparatus for, and Method of, Providing Controlled Depositions on Substrates
Patent:
6,159,290 →
Application:
09/165,689 →
System for and Method of Providing a Controlled Deposition on Wafers
Patent:
6,235,172 →
Application:
09/387,370 →
Toroidal low-field reactive gas source
Patent:
6,388,226 →
Application:
09/502,087 →
Toroidal Low-Field Reactive Gas Source
Patent:
6,486,431 →
Application:
09/659,881 →
Method and System for Cleaning Semiconductor Elements
Patent:
6,786,976 →
Application:
09/701,854 →
Integrated Plasma Chamber and Inductively-Coupled Toroidal Plasma Source
Patent:
6,924,455 →
Application:
09/774,165 →
Inductively-Coupled Toroidal Plasma Source
Patent:
6,815,633 →
Application:
09/804,650 →
Toroidal Low-Field Reactive Gas Source
Rf Power Supply with Integrated Matching Network
Patent:
6,887,339 →
Application:
09/960,227 →
Ozonated Water Flow and Concentration Control Apparatus and Method
Toroidal Low-Field Reactive Gas Source
Toroidal Low-Field Reactive Gas Source
Methods and Apparatus for Calibration and Metrology for an Integrated Rf Generator System
Patent:
6,781,317 →
Application:
10/373,163 →
Toroidal Low-Field Reactive Gas and Plasma Source Having a Dielectric Vacuum Vessel
Methods and Systems for Stabilizing an Amplifier
Toroidal Low-Field Reactive Gas Source
Ozone Concentration Sensor
Inductively-Coupled Torodial Plasma Source
Patent:
7,166,816 →
Application:
10/837,912 →
Method and System for Cleaning Semiconductor Elements
Methods and Apparatus for Calibration and Metrology for an Integrated Rf Generator System
Ozonated Water Flow and Concentration Control Method
Method and Apparatus for Preventing Instabilities in Radio-Frequency Plasma Processing
Stabilization of electronegative plasmas with feedback control of RF generator systems
Application:
11/020,376 →
Publication:
US 2005/0103439
Toroidal Low-Field Reactive Gas and Plasma Source Having a Dielectric Vacuum Vessel
Multivariate control of semiconductor processes
Application:
60/611,136 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Dec 12, 1981
From: PUBLIC,JOHN Q.
To: CONCEPTS IMPLEMENTATION GROUP, MAIN STREET, U.S.A.
Reel/Frame 006402/0339 →
Assignment of Assignors Interest.
Dec 12, 1981
From: PUBLIC, JOHN Q.
To: CONCEPTS IMPLEMENTATION GROUP, MAIN ST., U.S.A.
Reel/Frame 006402/0337 →
Assignment of Assignors Interest.
Dec 12, 1981
From: PUBLIC, JOHN Q.
To: CONCEPTS IMPLEMENTATION GROUP, MAIN ST., U.S.A.
Reel/Frame 006402/0336 →
Assignment of Assignors Interest.
Sep 30, 1987
From: SMITH, DONALD K.
To: TECHNOLOGY, INC., 37 CEDAR STREET, NEWTON, MASSACHUSETTS 02159, A CRP. OF MA
Reel/Frame 004789/0614 →
Assignment of Assignor's Interest
Oct 23, 1996
From: CLARKE, PETER J.
To: SPUTTERED FILMS, INC., A CALIFORNIA CORP.
Reel/Frame 008285/0372 →
Assignment of Assignor's Interest
Sep 2, 1997
From: SMITH, DONALD K.; CHEN, XING; HOLBER, WILLIAM M.; GEORGELIS, ERIC
To: APPLIED SCIENCE AND TECHNOLOGY, INC.
Reel/Frame 008699/0313 →
Assignment of Assignor's Interest
Sep 2, 1997
From: ZHANG, XINYU; BERKMAN, VITALY; SMITH, DONALD
To: APPLIED SCIENCE AND TECHNOLOGY, INC.
Reel/Frame 008699/0339 →
Security Agreement
Nov 3, 1997
From: SPUTTERED FILMS, INC.
To: FINOVA CAPITAL CORPORATION
Reel/Frame 008766/0855 →
Security Interest
Dec 23, 1997
From: INTERNATIONAL E-Z UP, INC.
To: BANK OF AMERICA NATIONAL TRUST AND SAVINGS ASSOCIATION
Reel/Frame 008876/0529 →
Assignment of Assignor's Interest
Sep 24, 1998
From: WESTMORELAND, ROBERT; SPENCER, JOHN E.
To: PLASMAQUEST, INC.
Reel/Frame 009478/0893 →
Security Interest
Mar 12, 1999
From: SPUTTERED FILMS, INC.
To: FINOVA CAPITAL CORPORATION
Reel/Frame 009808/0010 →
Assignment of Assignor's Interest
Sep 1, 1999
From: SPUTTERED FILMS, INC.
To: SHAMROCK TECHNOLOGY CORP.
Reel/Frame 010206/0041 →
Assignment of Assignor's Interest
Sep 1, 1999
From: SPUTTERED FILMS, INC.
To: SHAMROCK TECHNOLOGY CORP.
Reel/Frame 010206/0037 →
Termination of Security Interest
Oct 27, 1999
From: BANK OF AMERICA, N.A.
To: CARTER, MARK C.
Reel/Frame 010340/0703 →
Assignment of Assignor's Interest
Jul 24, 2000
From: SPUTTERED FILMS, INC.
To: SHAMROCK TECHNOLOGY CORP
Reel/Frame 010991/0389 →
Corrective Assignment to Correct the State of Incorporation for the Assignee, Previously Recorded on Reel 7356 Frame 0045, Assignor Confirms the Assignment of the Entire Interest.
Sep 10, 2001
From: HOLBER, WILLIAM M.; SMITH, DONALD K.; BESEN, MATTHEW M.; FITZNER, MATTHEW R.
To: APPLIED SCIENCE AND TECHNOLOGY, INC.
Reel/Frame 012134/0915 →
Assignment of Assignor's Interest
Sep 10, 2001
From: SMITH, DONALDS K.; MCVEY, BRIAN D.; RAMERIZ, RICHARD A.
To: APPLIED SCIENCE AND TECHNOLOGY, INC.
Reel/Frame 012145/0122 →
Corrective Assignment to Correct the State of Incorporation of the Assignee, Previously Recorded on Reel 7550 Frame 0670, Assignor Confirms the Assignment of the Entire Interest.
Sep 10, 2001
From: HOLBER, WILLIAM M.; SMITH, DONALD K.; BESEN, MATTHEW M.; FITZNER, MATTHEW P.
To: APPLIED SCIENCE AND TECHNOLOGY, INC.
Reel/Frame 012145/0104 →
Corrective Assignment to Correct the State of Incorporation of the Assignee, Previously Recorded on Reel 7164 Frame 0516.
Sep 10, 2001
From: BESEN, MATTHEW MARK; SMITH, DONALD K.
To: APPLIED SCIENCE AND TECHNOLOGY, INC.
Reel/Frame 012333/0418 →
Corrective Assignment to Correct Document from Commonwealth of Massachusetts to Show as the State of Delaware Previously Recorded on Reel 8699, Frame 0339.
Sep 10, 2001
From: ZHANG, XINYU; BERKMAN, VITALY; SMITH, DONALD
To: APPLIED SCIENCE AND TECHNOLOGY, INC.
Reel/Frame 012145/0357 →
Assignment of Assignor's Interest
Jan 13, 2003
From: SHAMROCK TECHNOLOGY CORP.
To: APPLIED SCIENCE & TECHNOLOGY, INC.
Reel/Frame 013645/0778 →
Assignment of Assignor's Interest
Feb 21, 2003
From: ASTEX PLASMAQUEST, INC. (F/K/A PLASMAQUEST, INC.)
To: APPLIED SCIENCE & TECHNOLOGY, INC.
Reel/Frame 013774/0080 →
Security Agreement
May 4, 2016
From: MKS INSTRUMENTS, INC.; NEWPORT CORPORATION
To: BARCLAYS BANK PLC; BARCLAYS BANK PLC
Reel/Frame 038663/0139 →
Security Agreement
May 4, 2016
From: MKS INSTRUMENTS, INC.; NEWPORT CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038663/0265 →
Release of Security Interest
Feb 1, 2019
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: MKS INSTRUMENTS, INC.; NEWPORT CORPORATION
Reel/Frame 048226/0095 →