Patent Assignment
Reel/Frame 009736/0047
Assignment of Assignor's Interest
Recorded: 1999-02-01
Pages: 3
Assignor
SIEMENS MICROELECTRONICS, INC.
Executed: 1999-01-12
Assignee
SIEMENS AKTIENGESELLSCHAFT
MUNICH, GERMANY
Covered Property
(1)
Removal of Post-Rie Polymer on A1/Cu Metal Line
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 3, 1998
From: GUTSCHE, MARTIN
To: SIEMENS MICROELECTRONICS, INC.
Reel/Frame 009622/0960 →
Assignment of Assignor's Interest
Dec 3, 1998
From: NATZLE, WESLEY; AKATSU, HIROYUKI; YU, CHIEN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 009622/0966 →
Assignment of Assignor's Interest
Dec 3, 1998
From: RAMACHANDRAN, RAVIKUMAR
To: SIEMENS MICROELECTRONICS, INC.
Reel/Frame 009622/0975 →
Assignment of Assignor's Interest
Feb 18, 2010
From: SIEMENS AKTIENGESELLSCHAFT
To: INFINEON TECHNOLOGIES AG
Reel/Frame 024114/0059 →
Assignment of Assignor's Interest
Apr 5, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 024218/0001 →
Assignment of Assignor's Interest
May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest
Dec 7, 2015
From: INFINEON TECHNOLOGIES AG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 037221/0885 →