Patent Assignment
Reel/Frame 010383/0723
Assignment of Assignor's Interest
Recorded: 1999-11-09
Pages: 3
Assignee
AMKOR TECHNOLOGY, INC.
1900 S. PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Semiconductor Package with Exposed Die Pad and Body-Locking Leadframe
Patent:
6,847,103 →
Application:
09/436,158 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 15, 2000
From: PEREZ, ERASMO; ROMAN, DAVID T.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 010646/0844 →
Security Interest
Nov 15, 2000
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: SOCIETE GENERALE
Reel/Frame 011491/0917 →
Security Interest
Apr 16, 2001
From: SOCIETE GENERALE; GUARDIAN ASSETS, INC.
To: CITICORP USA, INC.
Reel/Frame 011682/0416 →
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →