IP Library › Assignment 011682/0416
Patent Assignment
Reel/Frame 011682/0416

Security Interest

Recorded: 2001-04-16 Pages: 17
Assignors
SOCIETE GENERALE
Executed: 2001-03-30
GUARDIAN ASSETS, INC.
Executed: 2001-03-30
Assignee
CITICORP USA, INC.
390 GREENWICH STREET, NEW YORK, NEW YORK, 10013
Covered Properties (178)
Method of Producing a Strip of Lead Frames for Integrated Circuit Dies in a Continuous System
Patent: 5,183,724 →
Application: 07/629,440 →
Slitter Machine for Use in Manufacturing Semiconductor Devices
Patent: 5,269,210 →
Application: 07/763,806 →
Integrated Circuit Package with via Interconnections Formed in a Substrate
Patent: 5,483,100 →
Application: 07/893,518 →
Method of and Apparatus for Producing a Strip of Lead Frames for Integrated Circuit Dies in a Continuous System
Patent: 5,305,043 →
Application: 07/936,927 →
Method for Forming Plastic Molded Package with Heat Sink for Integratedcircuit Devices
Patent: 5,328,870 →
Application: 07/973,354 →
Integrated Circuit Package with via Interconnection Techniques and Method for Forming Such a Package
Patent: 5,378,869 →
Application: 08/037,209 →
Ball Grid Array with via Interconnection
Patent: 5,355,283 →
Application: 08/047,721 →
Plastic Molded Package with Heat Sink for Integrated Circuit Devices
Patent: 5,455,462 →
Application: 08/152,935 →
Mold Runner Removal from a Substrate-Based Packaged Electronic Device
Patent: 5,635,671 →
Application: 08/214,339 →
Packaged Integrated Circuit Including Heat Slug Having an Exposed Surface
Patent: 5,381,042 →
Application: 08/231,341 →
Packaged Semiconductor Die Including Heat Sink with Locking Feature
Patent: 5,701,034 →
Application: 08/237,709 →
Method for Interconnection of Integrated Circuit Chip and Substrate
Patent: 5,478,007 →
Application: 08/241,427 →
Ball Grid Array Integrated Circuit Package with Thermal Conductor
Patent: 5,583,378 →
Application: 08/245,146 →
Method and Apparatus for Applying Flux to Ball Grid Array Package
Patent: 5,482,736 →
Application: 08/286,153 →
Homogeneous Chip Carrier Package
Patent: 5,827,999 →
Application: 08/339,329 →
Continuous Self-Cleaning Filtration Unit
Patent: 5,582,722 →
Application: 08/357,284 →
Thermally Enhanced Chip Carrier Package
Patent: 5,650,593 →
Application: 08/383,966 →
Plastic Packaged Integrated Circuit with Heat Spreader
Patent: 5,596,485 →
Application: 08/405,462 →
Semiconductor Device Having a Thermal Dissipator and Electromagnetic Shielding
Patent: 5,485,037 →
Application: 08/410,381 →
Method for Forming a Semiconductor Device Having a Thermal Dissipator and Electromagnetic Shielding
Patent: 5,482,898 →
Application: 08/411,010 →
Semiconductor Lead Frame Having Connection Bar and Guide Rings
Patent: 5,723,899 →
Application: 08/520,429 →
Method for Checking a Wire Bond of a Semiconductor Package
Patent: 5,712,570 →
Application: 08/530,558 →
Semiconductor Package with Integral Heat Dissipator
Patent: 5,629,561 →
Application: 08/570,794 →
Bonding Method for Semiconductor Chips
Patent: 5,740,956 →
Application: 08/570,849 →
Chip Mounting Plate Construction of Lead Frame for Semiconductor Package
Patent: 5,661,338 →
Application: 08/571,316 →
Ball Grid Array Semiconductor Package with Improved Heat Dissipation and Dehumidification Effect
Patent: 5,729,432 →
Application: 08/588,172 →
Method and Circuit Board Structure for Leveling Solder Balls in Ball Grid Array Semiconductor Packages
Patent: 5,641,946 →
Application: 08/588,482 →
Carrier Strip and Molded Flex Circuit Ball Grid Array
Patent: 5,859,475 →
Application: 08/637,578 →
Method of Making Grid Array Assembly
Patent: 5,852,870 →
Application: 08/637,877 →
Method of Making a Packaged Semiconductor Die Including Heat Sink with Locking Feature
Patent: 5,722,161 →
Application: 08/641,603 →
Unit Printed Circuit Board Carrier Frame for Ball Grid Array Semiconductor Packages and Method for Fabricating Ball Grid Array Semiconductor Packages Using the Same
Patent: 5,854,741 →
Application: 08/651,200 →
Interdigitated Wirebond Programmable Fixed Voltage Planes
Patent: 5,672,909 →
Application: 08/688,083 →
Power Drawing Circuit for Two-Wire Switching Unit
Patent: 5,760,498 →
Application: 08/693,362 →
Wafer Map Conversion Method
Patent: 5,838,951 →
Application: 08/704,477 →
Method for Fabricating a Heat Sink-Integrated Semiconductor Package
Patent: 5,807,768 →
Application: 08/707,381 →
Method for Molding of Integrated Circuit Package
Patent: 5,637,273 →
Application: 08/729,540 →
Printed Circuit Board Having Epoxy Barrier Around a Throughout Slot and Ball Grid Array Semiconductor Package
Patent: 5,767,446 →
Application: 08/736,107 →
Near Chip Size Integrated Circuit Package
Patent: 5,981,314 →
Application: 08/741,797 →
Socket Assembly for Integrated Circuit Chip Carrier Package
Patent: 5,829,988 →
Application: 08/748,752 →
Ball Grid Array Semiconductor Package with Ring-Type Heat Sink
Patent: 5,708,567 →
Application: 08/748,937 →
Semiconductor Package Including Heat Sink with Layered Conductive Plate and Non-Conductive Tape Bonding to Leads
Patent: 5,854,511 →
Application: 08/749,450 →
Process for Bonding Semiconductor Chip
Patent: 5,858,149 →
Application: 08/749,578 →
Integrated Circuit Chip to Substrate Interconnection and Method
Patent: 5,795,818 →
Application: 08/761,472 →
Semiconductor Package and Method for Fabricating the Same
Patent: 5,858,815 →
Application: 08/763,605 →
Ball Gird Array Semiconductor Package Using a Metal Carrier Ring as a Heat Spreader
Patent: 5,905,633 →
Application: 08/775,212 →
Grid Array Type Lead Frame and Lead End Grid Array Semiconductor Package Employing the Same
Patent: 5,866,939 →
Application: 08/775,839 →
Semiconductor Chip Scale Package and Method of Producing Such
Patent: 5,915,169 →
Application: 08/777,927 →
Method of Forming Chip Bumps of Bump Chip Scale Semiconductor Package
Patent: 5,908,317 →
Application: 08/813,725 →
Solder Ball Land Metal Structure of Ball Grid Semiconductor Package
Patent: 5,872,399 →
Application: 08/825,945 →
Integrated Circuit Package
Patent: 6,034,429 →
Application: 08/844,536 →
Exhaust Control for Watercraft Engine
Patent: 5,983,631 →
Application: 08/844,543 →
Solder Ball Joint
Patent: 5,796,163 →
Application: 08/862,687 →
Printed Circuit Board for Ball Grid Array Semiconductor Package
Patent: 5,981,873 →
Application: 08/882,248 →
Marking Bad Printed Circuit Boards for Semiconductor Packages
Patent: 6,021,563 →
Application: 08/882,687 →
Flexible Circuit Board for Ball Grid Array Semiconductor Package
Patent: 5,864,470 →
Application: 08/883,541 →
Ball Grid Array Semiconductor Package with Solder Balls Fused on Printed Circuit Board and Method for Fabricating the Same
Patent: 5,953,589 →
Application: 08/915,077 →
Shielded Surface Acoustical Wave Package
Patent: 5,939,784 →
Application: 08/925,915 →
Mounting for a Semiconductor Integrated Circuit Device
Patent: 5,867,368 →
Application: 08/926,495 →
Integrated Circuit Package Employing a Transparent Encapsulant
Patent: 5,962,810 →
Application: 08/926,507 →
Mold for Ball Grid Array Semiconductor Package
Patent: 5,971,734 →
Application: 08/934,315 →
Semiconductor Package Having Light, Thin, Simple and Compact Structure
Patent: 5,986,334 →
Application: 08/942,784 →
A Microelectronic Device Package Having a Heat Sink Structure for Increasing the Thermal Conductivity of the Package
Patent: 6,028,354 →
Application: 08/949,585 →
Method for Reproducing Printed Circuit Boards for Semiconductor Packages Including Poor Quality Printed Circuit Board Units and Method for Fabricating Semiconductor Packages Using the Reproduced Printed Circuit Boards
Patent: 5,897,334 →
Application: 08/951,062 →
A Method for Manufacturing an Alumina-Silicon Carbide Nanocomposite
Patent: 5,894,008 →
Application: 08/951,890 →
Semiconductor Package and Method for Fabricating the Same
Patent: 5,977,624 →
Application: 09/008,552 →
Method of Manufacturing Ball Grid Array Semiconductor Package
Patent: 6,020,218 →
Application: 09/013,330 →
Method of Fabricating Semiconductor Package
Patent: 6,389,689 →
Application: 09/024,940 →
Publication: US 2001/0015009
Integrated Circuit Chip to Substrate Interconnection
Patent: 6,163,463 →
Application: 09/078,377 →
Rf Shielded Device
Patent: 6,150,193 →
Application: 09/083,524 →
Method of Making an Integrated Circuit Package
Patent: 5,950,074 →
Application: 09/085,136 →
Plastic Integrated Circuit Package and Method and Leadframe for Making the Package
Patent: 6,143,981 →
Application: 09/103,760 →
Mounting Having an Aperture Cover with Adhesive Locking Feature for Flip Chip Optical Integrated Circuit Device
Patent: 5,949,655 →
Application: 09/118,197 →
Method of Making a Molded Flex Circuit Ball Grid Array
Patent: 5,985,695 →
Application: 09/141,928 →
Carrier Strip and Molded Flex Circuit Ball Grid Array
Patent: 6,124,637 →
Application: 09/161,189 →
A Method of Making an Integrated Circuit Package Employing a Transparent Encapsulant
Patent: 6,143,588 →
Application: 09/176,048 →
Plastic Integrated Circuit Device Package and Leadframe Having Partially Undercut Leads and Die Pad
Patent: 6,281,568 →
Application: 09/176,614 →
Method of Forming Titanium Silicide
Patent: 6,207,562 →
Application: 09/199,041 →
Method for Forming Isolation Trenches on a Semiconductor Substrate
Patent: 6,114,217 →
Application: 09/199,706 →
Grid Array Type Lead Frame Having Lead Ends in Different Planes
Patent: 6,150,709 →
Application: 09/203,720 →
Grid Array Assembly of Circuit Boards with Singulation Grooves
Patent: 6,329,606 →
Application: 09/203,826 →
Method for Calibrating Optical Sensor Used to Measure the Temperature of a Substrate During Rapid Thermal Process
Patent: 6,132,081 →
Application: 09/220,987 →
Mos Transistor That Inhibits Punchthrough and Method for Fabricating the Same
Patent: 6,200,841 →
Application: 09/223,236 →
Method for Fabricating an Ldd Mos Transistor
Patent: 6,013,554 →
Application: 09/223,238 →
Trench Structure for Isolating Semiconductor Elements and Method for Forming the Same
Patent: 6,204,131 →
Application: 09/223,471 →
Microcircuit Die-Sawing Protector and Method
Patent: 6,465,329 →
Application: 09/233,980 →
"Printed Circuit Board for Ball Grid Array Semiconductor Packages"
Patent: 6,246,015 →
Application: 09/240,422 →
Method of Molding Ball Grid Array Semiconductor Packages
Patent: 6,214,645 →
Application: 09/240,423 →
Electrostatic Discharge Protection Package and Method
Patent: 6,246,566 →
Application: 09/246,574 →
Test Pattern for Measuring Variations of Critical Dimensions of Wiring Patterns Formed in the Fabrication of Semiconductor Devices
Patent: 6,403,978 →
Application: 09/261,280 →
Method for Forming a Mental Wiring Pattern on a Semiconductor Device
Patent: 6,296,988 →
Application: 09/262,789 →
Thin, Stackable Semiconductor Packages
Patent: 6,303,997 →
Application: 09/287,711 →
Printed Circuit Board with Oval Solder Ball Lands for Bga Semiconductor Packages
Patent: 6,268,568 →
Application: 09/305,170 →
Low-Cost Printed Circuit Board with Integral Heat Sink for Semiconductor Package
Patent: 6,337,228 →
Application: 09/310,660 →
Plastic Package for an Optical Integrated Circuit Device and Method of Making
Patent: 6,274,927 →
Application: 09/324,710 →
Near Chip Size Integrated Circuit Package
Patent: 6,228,676 →
Application: 09/348,772 →
Mold Locking Ground Ring
Application: 09/365,596 →
Method of Making an Electronic Device Package and Leadframe
Patent: 6,258,629 →
Application: 09/370,600 →
Chip-Sized Optical Sensor Package
Application: 09/378,358 →
Method of Forming an Integrated Circuit Device Package Using a Plastic Tape as a Base
Patent: 6,247,229 →
Application: 09/383,022 →
Wafer-Scale Production of Chip-Scale Semiconductor Packages Using Wafer Mapping Techniques
Patent: 6,589,801 →
Application: 09/385,694 →
Surface Acoustical Wave Flip Chip
Patent: 6,448,635 →
Application: 09/385,696 →
Energy Transfer Hybridization Assay Composition
Patent: 6,239,271 →
Application: 09/386,695 →
Circuit Pattern Tape for Wafer-Scale Production of Chip Size Semiconductor Packages
Patent: 6,479,887 →
Application: 09/387,377 →
Lead Frame Used for the Fabrication of Semiconductor Packages and Semiconductor Package Fabricated Using the Same
Patent: 6,437,427 →
Application: 09/391,792 →
Method of Making an Integrated Circuit Package and Leadframe
Application: 09/393,016 →
Method for Molding a Leadframe in Plastic Integrated Circuit Devices
Patent: 6,455,356 →
Application: 09/395,875 →
Method of Making an Integrated Circuit Package Using a Batch Step for Curing a Die Attachment Film and a Tool System for Performing the Method
Patent: 6,517,656 →
Application: 09/412,889 →
Thin Leadframe-Type Semiconductor Package Having Heat Sink with Recess and Exposed Surface
Patent: 6,198,163 →
Application: 09/420,065 →
Methods and a Device for Heat Treatment a Semiconductor Wafer Having Different Kinds of Impurities
Patent: 6,426,277 →
Application: 09/421,454 →
Chip-Scale Semiconductor Package of the Fan-Out Type and Method of Manufacturing Such Packages
Patent: 6,462,274 →
Application: 09/422,027 →
Semiconductor Device and Method of Manufacturing Such Device
Patent: 6,489,667 →
Application: 09/422,115 →
Methods of Making Thin Integrated Circuit Device Packages with Improved Thermal Performance and Substrates for Making the Packages
Patent: 6,331,451 →
Application: 09/434,546 →
Integrated Circuit Device Packages and Substrates for Making the Packages
Patent: 6,580,159 →
Application: 09/434,589 →
Semiconductor Package with Exposed Die Pad and Body-Locking Leadframe
Patent: 6,847,103 →
Application: 09/436,158 →
Chip-Size Semiconductor Packages
Patent: 6,291,884 →
Application: 09/437,013 →
Integrated Circuit Package Having Adhesive Bead Supporting Planar Lid Above Planar Substrate
Patent: 6,268,654 →
Application: 09/437,574 →
Cavity Semiconductor Package with Exposed Leads and Die Pad and Method for Making the Same
Patent: 6,476,478 →
Application: 09/439,917 →
Micromachine Package Fabrication Method
Patent: 6,415,505 →
Application: 09/440,808 →
Method of Molding Plastic Semiconductor Packages
Patent: 6,309,916 →
Application: 09/441,115 →
Semiconductor Package and Method of Making Using Leadframe Having Lead Locks to Secure Leads to Encapsulant
Patent: 6,448,633 →
Application: 09/444,035 →
Thin Image Sensor Package Having Transparent Substrate
Patent: 6,627,864 →
Application: 09/447,202 →
Thin Image Sensor Package Fabrication Method
Patent: 6,396,043 →
Application: 09/448,538 →
Method of Attaching a Sheet of an Adhesive Film to a Substrate in the Course of Making Integrated Circuit Packages
Application: 09/449,070 →
Publication: US 2002/0096253
Soft Toy Structure Containing Therein a Fluid Material and a Method for Manufacturing the Soft Toy
Patent: 6,139,395 →
Application: 09/452,454 →
Molded Image Sensor Package
Patent: 6,455,774 →
Application: 09/457,505 →
Molded Image Sensor Package Having Lens Holder
Patent: 6,483,101 →
Application: 09/457,513 →
Method of Assembling a Snap Lid Image Sensor Package
Patent: 6,526,653 →
Application: 09/457,515 →
Snap Lid Image Sensor Package
Patent: 6,483,030 →
Application: 09/457,516 →
Method of Fabricating Image Sensor Packages in an Array
Patent: 6,389,687 →
Application: 09/457,517 →
Molded Window Array for Image Sensor Packages
Patent: 6,266,197 →
Application: 09/458,033 →
A Microelectronic Device Package Having a Heat Sink Structure for Increasing the Thermal Conductivity of the Package
Patent: 6,423,576 →
Application: 09/460,175 →
Semiconductor Package and Method for Fabricating the Same
Patent: 6,369,454 →
Application: 09/461,523 →
Package for multiple integrated circuits and method of making
Application: 09/483,212 →
Publication: US 2003/0082845
Stackable package for an integrated circuit
Patent: 6,320,251 →
Application: 09/484,192 →
Package for Stacked Integrated Circuits
Patent: 6,414,396 →
Application: 09/490,317 →
Protected Image Sensor Package
Patent: 6,515,269 →
Application: 09/490,717 →
Protected Image Sensor Package Fabrication Method
Patent: 6,512,219 →
Application: 09/491,112 →
Fabricating Very Thin Chip Size Semiconductor Packages
Patent: 6,656,765 →
Application: 09/496,991 →
Module of Stacked Integrated Circuit Packages Including an Interposer
Patent: 6,404,046 →
Application: 09/497,377 →
Making chip size semiconductor packages
Patent: 6,338,985 →
Application: 09/498,144 →
Method of forming an integrated circuit device package using a temporary substrate
Application: 09/504,007 →
Publication: US 2002/0100165
Printed Circuit Board with Heat Spreader and Method of Making
Patent: 6,448,509 →
Application: 09/505,395 →
Nonexposed Heat Sink for Semiconductor Package
Patent: 7,009,283 →
Application: 09/513,067 →
Leadframe for Molded Semiconductor Package and Semiconductor Package Made Using the Leadframe
Patent: 6,424,023 →
Application: 09/513,232 →
Attaching Semiconductor Dies to Substrates with Conductive Straps
Patent: 6,459,147 →
Application: 09/536,236 →
Flip Chip Image Sensor Package Fabrication Methpd
Patent: 6,571,466 →
Application: 09/536,830 →
Method for Fabricating a Snapable Multi-Package Array Substrate, Snapable Multi-Package Array and Snapable Packaged Electronic Components
Patent: 6,444,499 →
Application: 09/539,314 →
Electromagnetic Interference Shield Device and Method
Patent: 6,472,598 →
Application: 09/548,702 →
Matrix Type Printed Circuit Board for Semiconductor Packages
Patent: 6,580,620 →
Application: 09/548,705 →
Method of Making an Electromagnetic Interference Shield Device
Patent: 6,601,293 →
Application: 09/551,416 →
Precision marking and singulation method
Patent: 6,309,943 →
Application: 09/558,392 →
Moisture-resistant integrated circuit chip package and method
Patent: 6,372,540 →
Application: 09/561,180 →
Moisture-Resistant Integrated Circuit Chip Package
Patent: 6,407,458 →
Application: 09/565,586 →
Long Wire Ic Package
Patent: 6,429,515 →
Application: 09/565,881 →
Semiconductor Package and Method for Fabricating the Same
Patent: 6,515,356 →
Application: 09/566,069 →
Stackable Package Having a Cavity and a Lid for an Electronic Device
Patent: 6,518,659 →
Application: 09/566,658 →
Stackable Package with Heat Sink
Patent: 6,424,031 →
Application: 09/566,680 →
Lowwire ic package fabrication method
Patent: 6,326,235 →
Application: 09/566,849 →
Apparatus for Electrically Mounting an Electronic Device to a Substrate Without Soldering
Patent: 6,441,485 →
Application: 09/569,716 →
Semiconductor Package and Method for Manufacturing the Same
Patent: 6,501,184 →
Application: 09/574,006 →
Image Sensor Package Having Sealed Cavity Over Active Area
Patent: 6,492,699 →
Application: 09/577,692 →
Reinforcing Solder Connections of Electronic Devices
Patent: 6,400,033 →
Application: 09/585,506 →
Reverse contrast marked package
Application: 09/585,704 →
Publication: US 2003/0080440
RF shielded device
Application: 09/585,901 →
Semiconductor Package with Spacer Strips
Patent: 6,531,784 →
Application: 09/585,915 →
Packaging High Power Integrated Circuit Devices
Patent: 6,521,982 →
Application: 09/587,136 →
Making solder ball mounting pads on substrates
Patent: 6,201,305 →
Application: 09/591,705 →
Electronic device package and leadframe
Patent: 6,339,252 →
Application: 09/593,269 →
Material Transport Method
Patent: 6,889,813 →
Application: 09/602,162 →
Assembly for Transporting Material
Patent: 6,695,120 →
Application: 09/602,195 →
Gripper Assembly
Patent: 6,530,735 →
Application: 09/602,196 →
Low Profile Package for Plural Semiconductor Dies
Patent: 6,452,278 →
Application: 09/608,197 →
Flip Chip Integrated Circuit and Passive Chip Component Package Fabrication Method
Patent: 6,546,620 →
Application: 09/608,357 →
Stackable Package Having Clips for Fastening Package and Tool for Opening Clips
Patent: 6,667,544 →
Application: 09/608,419 →
Flip-chip micromachine package fabrication method
Patent: 6,214,644 →
Application: 09/608,502 →
Electronic package having flip chip integrated circuit and passive chip component
Patent: 6,356,453 →
Application: 09/608,678 →
Plastic Intergrated Circuit Package and Method and Leadframe for Making the Package
Patent: 6,433,277 →
Application: 09/615,107 →
Microcircuit Die-Sawing Protector
Patent: 6,563,204 →
Application: 09/615,670 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Mar 15, 1991
From: JOHNSON, FRANK J.
To: ANAM INDUSTRIAL COMPANY, LTD., A CORP. OF KOREA
Reel/Frame 005630/0596 →
Assignment of Assignors Interest. Mar 15, 1991
From: JOHNSON, FRANK J.
To: AMKOR ELECTRONICS, INC., A CORP. OF PA
Reel/Frame 005630/0598 →
Assignment of Assignors Interest. Nov 14, 1991
From: JOHNSON, FRANK J.
To: AMKOR ELECTRONICS, INC.,
Reel/Frame 005907/0299 →
Assignment of Assignors Interest. Feb 14, 1992
From: JOHNSON, FRANK J.
To: AMKOR ELECTRONICS, INC., A CORP. OF PA
Reel/Frame 006012/0772 →
Assignment of Assignors Interest. Feb 14, 1992
From: JOHNSON, FRANK J.
To: AMKOR ELECTRONICS, INC., A CORP. OF PA
Reel/Frame 006012/0774 →
Assignment of Assignors Interest. May 10, 1993
From: MARRS, ROBERT C.; HIRAKAWA, TADASHI
To: AMKOR ELECTRONICS, INC.
Reel/Frame 006518/0933 →
Assignment of Assignor's Interest Jul 26, 1993
From: MARRS, ROBERT C.; HIRAKAWA, TADASHI
To: AMKOR ELECTRONICS, INC.
Reel/Frame 006631/0215 →
Assignment of Assignor's Interest May 3, 1994
From: MARRS, ROBERT C.
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007003/0658 →
Assignment of Assignor's Interest May 9, 1994
From: FREYMAN, BRUCE J.; BRIAR, JOHN; HEO, YOUNG WOOK; SHIM, IL KWON
To: AMKOR ELECTRONICS, INC.
Reel/Frame 006983/0372 →
Assignment of Assignor's Interest Jul 7, 1994
From: MARRS, ROBERT C.; MOLNAR, RONALD J.
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007096/0047 →
Assignment of Assignor's Interest Aug 4, 1994
From: GLENN, THOMAS P.; HOLLAWAY, ROY DALE
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007120/0469 →
Assignment of Assignor's Interest Jan 13, 1995
From: MASLAKOW, WILLIAM H.; MCMILLAN, JOHN R.
To: AK TECHNOLOGY, INC. A CORPORATION OF TEXAS
Reel/Frame 007358/0959 →
Assignment of Assignor's Interest Feb 9, 1995
From: WACHINSKI, ANTHONY M.; XIA, YONGMING; BENGOECHEA, JAIME
To: ASHBROOK-SIMON-HARTLEY CORPORATION
Reel/Frame 007337/0554 →
Assignment of Assignor's Interest Sep 19, 1995
From: HEO, YOUNG WOK; YOUM, DONG SIN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007702/0642 →
Assignment of Assignor's Interest Dec 12, 1995
From: YOO, YOUN CHEOL; YOO, HEE YEOUL; LEE, JEONG; PARK, DOO HYUN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007826/0113 →
Assignment of Assignor's Interest Dec 12, 1995
From: SHIN, WON SUN; DO, BYUNG TAE
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007799/0056 →
Assignment of Assignor's Interest Dec 12, 1995
From: SEO, SEONG MIN; JANG, SUCK JU
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007810/0249 →
Nunc Pro Tune Assignment Jan 16, 1996
From: AK TECHNOLOGY, INC., A TEXAS CORPORATION
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007757/0680 →
Assignment of Assignor's Interest Jan 16, 1996
From: MCMILLAN, JOHN R.; MASLAKOW, WILLIAM H.; CASTRO, ABRAM M.
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007762/0066 →
Assignment of Assignor's Interest Sep 3, 1996
From: SHIN, WON SUN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008229/0484 →
Assignment of an Undivided One-Half Interest Dec 2, 1996
From: AMKOR ELECTRONICS, INC.
To: ANAM INDUSTRIAL CO., LTD.
Reel/Frame 008249/0551 →
Change of Name Jul 20, 1998
From: ASHBROOK-SIMON-HARTLEY CORPORATION
To: ASHBROOK CORPORATION
Reel/Frame 009328/0016 →
Merger Nov 16, 1998
From: AMKOR ELECTRONICS, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009586/0649 →
Merger Nov 16, 1998
From: AMKOR ELECTRONICS, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009586/0655 →
Merger Nov 16, 1998
From: AMKOR ELECTRONICS, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009586/0626 →