Patent Assignment
Reel/Frame 006518/0933
Assignment of Assignors Interest.
Recorded: 1993-05-10
Pages: 4
Assignee
AMKOR ELECTRONICS, INC.
6-7 MINAMIHOMMACHI 1-CHOME CHUO-KU, OSAKA-SHI OSAKA, JAPAN
Covered Property
(1)
Integrated Circuit Package with via Interconnections Formed in a Substrate
Patent:
5,483,100 →
Application:
07/893,518 →
Related Assignments
(11)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 16, 1998
From: AMKOR ELECTRONICS, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009586/0635 →
Security Interest
Oct 10, 2000
From: AMKOR TECHNOLOGY, INC.
To: GUARDIAN ASSETS, INC.
Reel/Frame 011122/0773 →
Re-Record to Correct Receiving Party Name on a Document Previously Recorded on Reel 011122, Frame 0773.
Jan 18, 2001
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: SOCIETE GENERALE
Reel/Frame 011457/0702 →
Security Interest
Apr 16, 2001
From: SOCIETE GENERALE; GUARDIAN ASSETS, INC.
To: CITICORP USA, INC.
Reel/Frame 011682/0416 →
Security Agreement
Jul 6, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 014885/0691 →
Release of Lien on Patents
Jul 16, 2004
From: CITICORP USA, INC. AS COLLATERAL AGENT
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 015603/0572 →
Security Agreement
Nov 2, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS "AGENT"
Reel/Frame 015942/0521 →
Termination & Release of Patent Security Agreement
Jan 3, 2006
From: CITICORP NORTH AMERICA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 017388/0868 →
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054036/0599 →