IP Library › Assignment 011457/0702
Patent Assignment
Reel/Frame 011457/0702

Re-Record to Correct Receiving Party Name on a Document Previously Recorded on Reel 011122, Frame 0773.

Recorded: 2001-01-18 Pages: 15
Assignors
AMKOR TECHNOLOGY, INC.
Executed: 2000-04-28
GUARDIAN ASSETS, INC.
Executed: 2000-04-28
Assignee
SOCIETE GENERALE
1 FINANCIAL SQUARE, 30TH FLOOR, S.G. COWEN SECURITY CORPORATION, NEW YORK, NEW YORK, 10005
Covered Properties (69)
Method of Producing a Strip of Lead Frames for Integrated Circuit Dies in a Continuous System
Patent: 5,183,724 →
Application: 07/629,440 →
Slitter Machine for Use in Manufacturing Semiconductor Devices
Patent: 5,269,210 →
Application: 07/763,806 →
Integrated Circuit Package with via Interconnections Formed in a Substrate
Patent: 5,483,100 →
Application: 07/893,518 →
Method of and Apparatus for Producing a Strip of Lead Frames for Integrated Circuit Dies in a Continuous System
Patent: 5,305,043 →
Application: 07/936,927 →
Method for Forming Plastic Molded Package with Heat Sink for Integratedcircuit Devices
Patent: 5,328,870 →
Application: 07/973,354 →
Integrated Circuit Package with via Interconnection Techniques and Method for Forming Such a Package
Patent: 5,378,869 →
Application: 08/037,209 →
Ball Grid Array with via Interconnection
Patent: 5,355,283 →
Application: 08/047,721 →
Plastic Molded Package with Heat Sink for Integrated Circuit Devices
Patent: 5,455,462 →
Application: 08/152,935 →
Mold Runner Removal from a Substrate-Based Packaged Electronic Device
Patent: 5,635,671 →
Application: 08/214,339 →
Packaged Integrated Circuit Including Heat Slug Having an Exposed Surface
Patent: 5,381,042 →
Application: 08/231,341 →
Packaged Semiconductor Die Including Heat Sink with Locking Feature
Patent: 5,701,034 →
Application: 08/237,709 →
Method for Interconnection of Integrated Circuit Chip and Substrate
Patent: 5,478,007 →
Application: 08/241,427 →
Ball Grid Array Integrated Circuit Package with Thermal Conductor
Patent: 5,583,378 →
Application: 08/245,146 →
Method and Apparatus for Applying Flux to Ball Grid Array Package
Patent: 5,482,736 →
Application: 08/286,153 →
Homogeneous Chip Carrier Package
Patent: 5,827,999 →
Application: 08/339,329 →
Thermally Enhanced Chip Carrier Package
Patent: 5,650,593 →
Application: 08/383,966 →
Plastic Packaged Integrated Circuit with Heat Spreader
Patent: 5,596,485 →
Application: 08/405,462 →
Semiconductor Device Having a Thermal Dissipator and Electromagnetic Shielding
Patent: 5,485,037 →
Application: 08/410,381 →
Method for Forming a Semiconductor Device Having a Thermal Dissipator and Electromagnetic Shielding
Patent: 5,482,898 →
Application: 08/411,010 →
Heat Spreader Suitable for Use in Semiconductor Packages Having Different Pad Sizes
Patent: 5,641,987 →
Application: 08/479,885 →
Copper Oxide-Filled Polymer Die Attach Adhesive Composition for Semiconductor Package
Patent: 5,582,772 →
Application: 08/485,936 →
Semiconductor Lead Frame Having Connection Bar and Guide Rings
Patent: 5,723,899 →
Application: 08/520,429 →
Method for Checking a Wire Bond of a Semiconductor Package
Patent: 5,712,570 →
Application: 08/530,558 →
Semiconductor Package with Integral Heat Dissipator
Patent: 5,629,561 →
Application: 08/570,794 →
Bonding Method for Semiconductor Chips
Patent: 5,740,956 →
Application: 08/570,849 →
Chip Mounting Plate Construction of Lead Frame for Semiconductor Package
Patent: 5,661,338 →
Application: 08/571,316 →
Ball Grid Array Semiconductor Package with Improved Heat Dissipation and Dehumidification Effect
Patent: 5,729,432 →
Application: 08/588,172 →
Method and Circuit Board Structure for Leveling Solder Balls in Ball Grid Array Semiconductor Packages
Patent: 5,641,946 →
Application: 08/588,482 →
Method of Making Grid Array Assembly
Patent: 5,852,870 →
Application: 08/637,877 →
Method of Making a Packaged Semiconductor Die Including Heat Sink with Locking Feature
Patent: 5,722,161 →
Application: 08/641,603 →
Unit Printed Circuit Board Carrier Frame for Ball Grid Array Semiconductor Packages and Method for Fabricating Ball Grid Array Semiconductor Packages Using the Same
Patent: 5,854,741 →
Application: 08/651,200 →
Interdigitated Wirebond Programmable Fixed Voltage Planes
Patent: 5,672,909 →
Application: 08/688,083 →
Power Drawing Circuit for Two-Wire Switching Unit
Patent: 5,760,498 →
Application: 08/693,362 →
Wafer Map Conversion Method
Patent: 5,838,951 →
Application: 08/704,477 →
Method for Fabricating a Heat Sink-Integrated Semiconductor Package
Patent: 5,807,768 →
Application: 08/707,381 →
Method for Molding of Integrated Circuit Package
Patent: 5,637,273 →
Application: 08/729,540 →
Printed Circuit Board Having Epoxy Barrier Around a Throughout Slot and Ball Grid Array Semiconductor Package
Patent: 5,767,446 →
Application: 08/736,107 →
Near Chip Size Integrated Circuit Package
Patent: 5,981,314 →
Application: 08/741,797 →
Socket Assembly for Integrated Circuit Chip Carrier Package
Patent: 5,829,988 →
Application: 08/748,752 →
Ball Grid Array Semiconductor Package with Ring-Type Heat Sink
Patent: 5,708,567 →
Application: 08/748,937 →
Semiconductor Package Including Heat Sink with Layered Conductive Plate and Non-Conductive Tape Bonding to Leads
Patent: 5,854,511 →
Application: 08/749,450 →
Process for Bonding Semiconductor Chip
Patent: 5,858,149 →
Application: 08/749,578 →
Integrated Circuit Chip to Substrate Interconnection and Method
Patent: 5,795,818 →
Application: 08/761,472 →
Semiconductor Package and Method for Fabricating the Same
Patent: 5,858,815 →
Application: 08/763,605 →
Ball Gird Array Semiconductor Package Using a Metal Carrier Ring as a Heat Spreader
Patent: 5,905,633 →
Application: 08/775,212 →
Grid Array Type Lead Frame and Lead End Grid Array Semiconductor Package Employing the Same
Patent: 5,866,939 →
Application: 08/775,839 →
Semiconductor Chip Scale Package and Method of Producing Such
Patent: 5,915,169 →
Application: 08/777,927 →
Method of Forming Chip Bumps of Bump Chip Scale Semiconductor Package
Patent: 5,908,317 →
Application: 08/813,725 →
Solder Ball Land Metal Structure of Ball Grid Semiconductor Package
Patent: 5,872,399 →
Application: 08/825,945 →
Integrated Circuit Package
Patent: 6,034,429 →
Application: 08/844,536 →
Solder Ball Joint
Patent: 5,796,163 →
Application: 08/862,687 →
Printed Circuit Board for Ball Grid Array Semiconductor Package
Patent: 5,981,873 →
Application: 08/882,248 →
Marking Bad Printed Circuit Boards for Semiconductor Packages
Patent: 6,021,563 →
Application: 08/882,687 →
Flexible Circuit Board for Ball Grid Array Semiconductor Package
Patent: 5,864,470 →
Application: 08/883,541 →
Ball Grid Array Semiconductor Package with Solder Balls Fused on Printed Circuit Board and Method for Fabricating the Same
Patent: 5,953,589 →
Application: 08/915,077 →
Shielded Surface Acoustical Wave Package
Patent: 5,939,784 →
Application: 08/925,915 →
Mounting for a Semiconductor Integrated Circuit Device
Patent: 5,867,368 →
Application: 08/926,495 →
Integrated Circuit Package Employing a Transparent Encapsulant
Patent: 5,962,810 →
Application: 08/926,507 →
Mold for Ball Grid Array Semiconductor Package
Patent: 5,971,734 →
Application: 08/934,315 →
Semiconductor Package Having Light, Thin, Simple and Compact Structure
Patent: 5,986,334 →
Application: 08/942,784 →
A Microelectronic Device Package Having a Heat Sink Structure for Increasing the Thermal Conductivity of the Package
Patent: 6,028,354 →
Application: 08/949,585 →
Method for Reproducing Printed Circuit Boards for Semiconductor Packages Including Poor Quality Printed Circuit Board Units and Method for Fabricating Semiconductor Packages Using the Reproduced Printed Circuit Boards
Patent: 5,897,334 →
Application: 08/951,062 →
A Method for Manufacturing an Alumina-Silicon Carbide Nanocomposite
Patent: 5,894,008 →
Application: 08/951,890 →
Semiconductor Package and Method for Fabricating the Same
Patent: 5,977,624 →
Application: 09/008,552 →
Method of Manufacturing Ball Grid Array Semiconductor Package
Patent: 6,020,218 →
Application: 09/013,330 →
Method of Making an Integrated Circuit Package
Patent: 5,950,074 →
Application: 09/085,136 →
Mounting Having an Aperture Cover with Adhesive Locking Feature for Flip Chip Optical Integrated Circuit Device
Patent: 5,949,655 →
Application: 09/118,197 →
Method of Making a Molded Flex Circuit Ball Grid Array
Patent: 5,985,695 →
Application: 09/141,928 →
Method for Fabricating an Ldd Mos Transistor
Patent: 6,013,554 →
Application: 09/223,238 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Mar 15, 1991
From: JOHNSON, FRANK J.
To: AMKOR ELECTRONICS, INC., A CORP. OF PA
Reel/Frame 005630/0598 →
Assignment of Assignors Interest. Mar 15, 1991
From: JOHNSON, FRANK J.
To: ANAM INDUSTRIAL COMPANY, LTD., A CORP. OF KOREA
Reel/Frame 005630/0596 →
Assignment of Assignors Interest. Nov 14, 1991
From: JOHNSON, FRANK J.
To: AMKOR ELECTRONICS, INC.,
Reel/Frame 005907/0299 →
Assignment of Assignors Interest. Feb 14, 1992
From: JOHNSON, FRANK J.
To: AMKOR ELECTRONICS, INC., A CORP. OF PA
Reel/Frame 006012/0772 →
Assignment of Assignors Interest. Feb 14, 1992
From: JOHNSON, FRANK J.
To: AMKOR ELECTRONICS, INC., A CORP. OF PA
Reel/Frame 006012/0774 →
Assignment of Assignors Interest. May 10, 1993
From: MARRS, ROBERT C.; HIRAKAWA, TADASHI
To: AMKOR ELECTRONICS, INC.
Reel/Frame 006518/0933 →
Assignment of Assignor's Interest Jul 26, 1993
From: MARRS, ROBERT C.; HIRAKAWA, TADASHI
To: AMKOR ELECTRONICS, INC.
Reel/Frame 006631/0215 →
Assignment of Assignor's Interest May 3, 1994
From: MARRS, ROBERT C.
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007003/0658 →
Assignment of Assignor's Interest May 9, 1994
From: FREYMAN, BRUCE J.; BRIAR, JOHN; HEO, YOUNG WOOK; SHIM, IL KWON
To: AMKOR ELECTRONICS, INC.
Reel/Frame 006983/0372 →
Assignment of Assignor's Interest Jul 7, 1994
From: MARRS, ROBERT C.; MOLNAR, RONALD J.
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007096/0047 →
Assignment of Assignor's Interest Aug 4, 1994
From: GLENN, THOMAS P.; HOLLAWAY, ROY DALE
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007120/0469 →
Assignment of Assignor's Interest Jan 13, 1995
From: MASLAKOW, WILLIAM H.; MCMILLAN, JOHN R.
To: AK TECHNOLOGY, INC. A CORPORATION OF TEXAS
Reel/Frame 007358/0959 →
Assignment of Assignor's Interest Sep 1, 1995
From: LEE, MYUNG JUN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007628/0172 →
Assignment of Assignor's Interest Sep 1, 1995
From: KWAK, CHEOL WOO
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007628/0169 →
Assignment of Assignor's Interest Sep 19, 1995
From: HEO, YOUNG WOK; YOUM, DONG SIN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007702/0642 →
Assignment of Assignor's Interest Dec 12, 1995
From: SHIN, WON SUN; DO, BYUNG TAE
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007799/0056 →
Assignment of Assignor's Interest Dec 12, 1995
From: SEO, SEONG MIN; JANG, SUCK JU
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007810/0249 →
Assignment of Assignor's Interest Jan 16, 1996
From: MCMILLAN, JOHN R.; MASLAKOW, WILLIAM H.; CASTRO, ABRAM M.
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007762/0066 →
Nunc Pro Tune Assignment Jan 16, 1996
From: AK TECHNOLOGY, INC., A TEXAS CORPORATION
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007757/0680 →
Assignment of Assignor's Interest Sep 3, 1996
From: SHIN, WON SUN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008229/0484 →
Assignment of Assignor's Interest Nov 13, 1996
From: SHIM, IL KWON; HEO, YOUNG WOOK
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008315/0307 →
Assignment of an Undivided One-Half Interest Dec 2, 1996
From: AMKOR ELECTRONICS, INC.
To: ANAM INDUSTRIAL CO., LTD.
Reel/Frame 008249/0551 →
Assignment of Assignor's Interest Nov 16, 1998
From: AMKOR ELECTRONICS, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009586/0635 →
Merger Nov 16, 1998
From: AMKOR ELECTRONICS, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009586/0652 →
Merger Nov 16, 1998
From: AMKOR ELECTRONICS, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009586/0649 →