IP Library › Assignment 011491/0917
Patent Assignment
Reel/Frame 011491/0917

Security Interest

Recorded: 2000-11-15 Pages: 21
Assignors
AMKOR TECHNOLOGY, INC.
Executed: 2000-04-28
GUARDIAN ASSETS, INC.
Executed: 2000-04-28
Assignee
SOCIETE GENERALE
1 FINANCIAL SQUARE, 30TH FLOOR, S.G. COWEN SECURITY CORPORATION, NEW YORK, NEW YORK, 10005
Covered Properties (109)
Exhaust Control for Watercraft Engine
Patent: 5,983,631 →
Application: 08/844,543 →
Method of Fabricating Semiconductor Package
Patent: 6,389,689 →
Application: 09/024,940 →
Publication: US 2001/0015009
Integrated Circuit Chip to Substrate Interconnection
Patent: 6,163,463 →
Application: 09/078,377 →
Rf Shielded Device
Patent: 6,150,193 →
Application: 09/083,524 →
Plastic Integrated Circuit Package and Method and Leadframe for Making the Package
Patent: 6,143,981 →
Application: 09/103,760 →
Carrier Strip and Molded Flex Circuit Ball Grid Array
Patent: 6,124,637 →
Application: 09/161,189 →
A Method of Making an Integrated Circuit Package Employing a Transparent Encapsulant
Patent: 6,143,588 →
Application: 09/176,048 →
Plastic Integrated Circuit Device Package and Leadframe Having Partially Undercut Leads and Die Pad
Patent: 6,281,568 →
Application: 09/176,614 →
Method of Forming Titanium Silicide
Patent: 6,207,562 →
Application: 09/199,041 →
Method for Forming Isolation Trenches on a Semiconductor Substrate
Patent: 6,114,217 →
Application: 09/199,706 →
Grid Array Type Lead Frame Having Lead Ends in Different Planes
Patent: 6,150,709 →
Application: 09/203,720 →
Grid Array Assembly of Circuit Boards with Singulation Grooves
Patent: 6,329,606 →
Application: 09/203,826 →
Method for Calibrating Optical Sensor Used to Measure the Temperature of a Substrate During Rapid Thermal Process
Patent: 6,132,081 →
Application: 09/220,987 →
Mos Transistor That Inhibits Punchthrough and Method for Fabricating the Same
Patent: 6,200,841 →
Application: 09/223,236 →
Trench Structure for Isolating Semiconductor Elements and Method for Forming the Same
Patent: 6,204,131 →
Application: 09/223,471 →
Microcircuit Die-Sawing Protector and Method
Patent: 6,465,329 →
Application: 09/233,980 →
"Printed Circuit Board for Ball Grid Array Semiconductor Packages"
Patent: 6,246,015 →
Application: 09/240,422 →
Method of Molding Ball Grid Array Semiconductor Packages
Patent: 6,214,645 →
Application: 09/240,423 →
Electrostatic Discharge Protection Package and Method
Patent: 6,246,566 →
Application: 09/246,574 →
Test Pattern for Measuring Variations of Critical Dimensions of Wiring Patterns Formed in the Fabrication of Semiconductor Devices
Patent: 6,403,978 →
Application: 09/261,280 →
Method for Forming a Mental Wiring Pattern on a Semiconductor Device
Patent: 6,296,988 →
Application: 09/262,789 →
Thin, Stackable Semiconductor Packages
Patent: 6,303,997 →
Application: 09/287,711 →
Printed Circuit Board with Oval Solder Ball Lands for Bga Semiconductor Packages
Patent: 6,268,568 →
Application: 09/305,170 →
Low-Cost Printed Circuit Board with Integral Heat Sink for Semiconductor Package
Patent: 6,337,228 →
Application: 09/310,660 →
Plastic Package for an Optical Integrated Circuit Device and Method of Making
Patent: 6,274,927 →
Application: 09/324,710 →
Near Chip Size Integrated Circuit Package
Patent: 6,228,676 →
Application: 09/348,772 →
Mold Locking Ground Ring
Application: 09/365,596 →
Method of Making an Electronic Device Package and Leadframe
Patent: 6,258,629 →
Application: 09/370,600 →
Chip-Sized Optical Sensor Package
Application: 09/378,358 →
Method of Forming an Integrated Circuit Device Package Using a Plastic Tape as a Base
Patent: 6,247,229 →
Application: 09/383,022 →
Wafer-Scale Production of Chip-Scale Semiconductor Packages Using Wafer Mapping Techniques
Patent: 6,589,801 →
Application: 09/385,694 →
Method for Laminating Circuit Pattern Tape on Semiconductor Wafer
Patent: 6,428,641 →
Application: 09/385,695 →
Surface Acoustical Wave Flip Chip
Patent: 6,448,635 →
Application: 09/385,696 →
Circuit Pattern Tape for Wafer-Scale Production of Chip Size Semiconductor Packages
Patent: 6,479,887 →
Application: 09/387,377 →
Lead Frame Used for the Fabrication of Semiconductor Packages and Semiconductor Package Fabricated Using the Same
Patent: 6,437,427 →
Application: 09/391,792 →
Method of Making an Integrated Circuit Package and Leadframe
Application: 09/393,016 →
Method for Molding a Leadframe in Plastic Integrated Circuit Devices
Patent: 6,455,356 →
Application: 09/395,875 →
Method of Making an Integrated Circuit Package Using a Batch Step for Curing a Die Attachment Film and a Tool System for Performing the Method
Patent: 6,517,656 →
Application: 09/412,889 →
Thin Leadframe-Type Semiconductor Package Having Heat Sink with Recess and Exposed Surface
Patent: 6,198,163 →
Application: 09/420,065 →
Methods and a Device for Heat Treatment a Semiconductor Wafer Having Different Kinds of Impurities
Patent: 6,426,277 →
Application: 09/421,454 →
Chip-Scale Semiconductor Package of the Fan-Out Type and Method of Manufacturing Such Packages
Patent: 6,462,274 →
Application: 09/422,027 →
Semiconductor Device and Method of Manufacturing Such Device
Patent: 6,489,667 →
Application: 09/422,115 →
Methods of Making Thin Integrated Circuit Device Packages with Improved Thermal Performance and Substrates for Making the Packages
Patent: 6,331,451 →
Application: 09/434,546 →
Integrated Circuit Device Packages and Substrates for Making the Packages
Patent: 6,580,159 →
Application: 09/434,589 →
Semiconductor Package with Exposed Die Pad and Body-Locking Leadframe
Patent: 6,847,103 →
Application: 09/436,158 →
Chip-Size Semiconductor Packages
Patent: 6,291,884 →
Application: 09/437,013 →
Integrated Circuit Package Having Adhesive Bead Supporting Planar Lid Above Planar Substrate
Patent: 6,268,654 →
Application: 09/437,574 →
Cavity Semiconductor Package with Exposed Leads and Die Pad and Method for Making the Same
Patent: 6,476,478 →
Application: 09/439,917 →
Micromachine Package Fabrication Method
Patent: 6,415,505 →
Application: 09/440,808 →
Method of Molding Plastic Semiconductor Packages
Patent: 6,309,916 →
Application: 09/441,115 →
Semiconductor Package and Method of Making Using Leadframe Having Lead Locks to Secure Leads to Encapsulant
Patent: 6,448,633 →
Application: 09/444,035 →
Thin Image Sensor Package Having Transparent Substrate
Patent: 6,627,864 →
Application: 09/447,202 →
Thin Image Sensor Package Fabrication Method
Patent: 6,396,043 →
Application: 09/448,538 →
Method of Attaching a Sheet of an Adhesive Film to a Substrate in the Course of Making Integrated Circuit Packages
Application: 09/449,070 →
Publication: US 2002/0096253
Soft Toy Structure Containing Therein a Fluid Material and a Method for Manufacturing the Soft Toy
Patent: 6,139,395 →
Application: 09/452,454 →
Molded Image Sensor Package
Patent: 6,455,774 →
Application: 09/457,505 →
Molded Image Sensor Package Having Lens Holder
Patent: 6,483,101 →
Application: 09/457,513 →
Method of Assembling a Snap Lid Image Sensor Package
Patent: 6,526,653 →
Application: 09/457,515 →
Snap Lid Image Sensor Package
Patent: 6,483,030 →
Application: 09/457,516 →
Method of Fabricating Image Sensor Packages in an Array
Patent: 6,389,687 →
Application: 09/457,517 →
Molded Window Array for Image Sensor Packages
Patent: 6,266,197 →
Application: 09/458,033 →
A Microelectronic Device Package Having a Heat Sink Structure for Increasing the Thermal Conductivity of the Package
Patent: 6,423,576 →
Application: 09/460,175 →
Semiconductor Package and Method for Fabricating the Same
Patent: 6,369,454 →
Application: 09/461,523 →
Package for multiple integrated circuits and method of making
Application: 09/483,212 →
Publication: US 2003/0082845
Stackable package for an integrated circuit
Patent: 6,320,251 →
Application: 09/484,192 →
Package for Stacked Integrated Circuits
Patent: 6,414,396 →
Application: 09/490,317 →
Protected Image Sensor Package
Patent: 6,515,269 →
Application: 09/490,717 →
Protected Image Sensor Package Fabrication Method
Patent: 6,512,219 →
Application: 09/491,112 →
Fabricating Very Thin Chip Size Semiconductor Packages
Patent: 6,656,765 →
Application: 09/496,991 →
Module of Stacked Integrated Circuit Packages Including an Interposer
Patent: 6,404,046 →
Application: 09/497,377 →
Making chip size semiconductor packages
Patent: 6,338,985 →
Application: 09/498,144 →
Method of forming an integrated circuit device package using a temporary substrate
Application: 09/504,007 →
Publication: US 2002/0100165
Printed Circuit Board with Heat Spreader and Method of Making
Patent: 6,448,509 →
Application: 09/505,395 →
Nonexposed Heat Sink for Semiconductor Package
Patent: 7,009,283 →
Application: 09/513,067 →
Leadframe for Molded Semiconductor Package and Semiconductor Package Made Using the Leadframe
Patent: 6,424,023 →
Application: 09/513,232 →
Attaching Semiconductor Dies to Substrates with Conductive Straps
Patent: 6,459,147 →
Application: 09/536,236 →
Flip Chip Image Sensor Package Fabrication Methpd
Patent: 6,571,466 →
Application: 09/536,830 →
Method for Fabricating a Snapable Multi-Package Array Substrate, Snapable Multi-Package Array and Snapable Packaged Electronic Components
Patent: 6,444,499 →
Application: 09/539,314 →
Electromagnetic Interference Shield Device and Method
Patent: 6,472,598 →
Application: 09/548,702 →
Matrix Type Printed Circuit Board for Semiconductor Packages
Patent: 6,580,620 →
Application: 09/548,705 →
Method of Making an Electromagnetic Interference Shield Device
Patent: 6,601,293 →
Application: 09/551,416 →
Precision marking and singulation method
Patent: 6,309,943 →
Application: 09/558,392 →
Moisture-resistant integrated circuit chip package and method
Patent: 6,372,540 →
Application: 09/561,180 →
Moisture-Resistant Integrated Circuit Chip Package
Patent: 6,407,458 →
Application: 09/565,586 →
Long Wire Ic Package
Patent: 6,429,515 →
Application: 09/565,881 →
Semiconductor Package and Method for Fabricating the Same
Patent: 6,515,356 →
Application: 09/566,069 →
Stackable Package Having a Cavity and a Lid for an Electronic Device
Patent: 6,518,659 →
Application: 09/566,658 →
Stackable Package with Heat Sink
Patent: 6,424,031 →
Application: 09/566,680 →
Lowwire ic package fabrication method
Patent: 6,326,235 →
Application: 09/566,849 →
Apparatus for Electrically Mounting an Electronic Device to a Substrate Without Soldering
Patent: 6,441,485 →
Application: 09/569,716 →
Semiconductor Package and Method for Manufacturing the Same
Patent: 6,501,184 →
Application: 09/574,006 →
Image Sensor Package Having Sealed Cavity Over Active Area
Patent: 6,492,699 →
Application: 09/577,692 →
Reinforcing Solder Connections of Electronic Devices
Patent: 6,400,033 →
Application: 09/585,506 →
Reverse contrast marked package
Application: 09/585,704 →
Publication: US 2003/0080440
RF shielded device
Application: 09/585,901 →
Semiconductor Package with Spacer Strips
Patent: 6,531,784 →
Application: 09/585,915 →
Packaging High Power Integrated Circuit Devices
Patent: 6,521,982 →
Application: 09/587,136 →
Making solder ball mounting pads on substrates
Patent: 6,201,305 →
Application: 09/591,705 →
Electronic device package and leadframe
Patent: 6,339,252 →
Application: 09/593,269 →
Material Transport Method
Patent: 6,889,813 →
Application: 09/602,162 →
Assembly for Transporting Material
Patent: 6,695,120 →
Application: 09/602,195 →
Gripper Assembly
Patent: 6,530,735 →
Application: 09/602,196 →
Low Profile Package for Plural Semiconductor Dies
Patent: 6,452,278 →
Application: 09/608,197 →
Flip Chip Integrated Circuit and Passive Chip Component Package Fabrication Method
Patent: 6,546,620 →
Application: 09/608,357 →
Stackable Package Having Clips for Fastening Package and Tool for Opening Clips
Patent: 6,667,544 →
Application: 09/608,419 →
Flip-chip micromachine package fabrication method
Patent: 6,214,644 →
Application: 09/608,502 →
Electronic package having flip chip integrated circuit and passive chip component
Patent: 6,356,453 →
Application: 09/608,678 →
Plastic Intergrated Circuit Package and Method and Leadframe for Making the Package
Patent: 6,433,277 →
Application: 09/615,107 →
Microcircuit Die-Sawing Protector
Patent: 6,563,204 →
Application: 09/615,670 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 20, 1997
From: MINEO, SHIGEHARU
To: YAMAHA HATSUDOKI KABUSHIKI KAISHA
Reel/Frame 008762/0031 →
Assignment of Assignor's Interest Feb 17, 1998
From: HEO, YOUNG WOOK
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 009043/0040 →
Merger Jun 19, 1998
From: AMKOR ELECTRONICS, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009269/0987 →
Assignment of Assignor's Interest Jun 24, 1998
From: GLENN, THOMAS P.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009346/0342 →
Assignment of Assignor's Interest Jun 26, 1998
From: GLENN, THOMAS P.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009284/0558 →
Merger and Change of Name Aug 24, 1998
From: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009411/0215 →
Assignment of Assignor's Interest Oct 21, 1998
From: GLENN, THOMAS P.; JEWLER, SCOTT J.; ROMAN, DAVID; YEE, J.H.
To: AMKOR TECHNOLOGY, INC.; ANAM SEMICONDUCTOR INC.
Reel/Frame 009535/0868 →
Assignment of Assignor's Interest Nov 24, 1998
From: PARK, YOUNG-TACK
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009630/0403 →
Assignment of Assignor's Interest Nov 24, 1998
From: HAN, JAE-WON
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009610/0947 →
Assignment of Assignor's Interest Dec 23, 1998
From: HAN, JAE-WON
To: ANAM SEMICONDUCTOR, INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009677/0420 →
Assignment of Assignor's Interest Jan 20, 1999
From: GLENN, THOMAS P.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009716/0904 →
Assignment of Assignor's Interest Jan 29, 1999
From: KIM, SUNG JIN
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009743/0073 →
Assignment of Assignor's Interest Jan 29, 1999
From: KIM, SUNG JIN
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009746/0235 →
Assignment of Assignor's Interest Feb 8, 1999
From: GLENN, THOMAS P.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009754/0889 →
Assignment of Assignor's Interest Mar 2, 1999
From: KIM, JONG-CHEOL
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009799/0440 →
Assignment of Assignor's Interest Mar 15, 1999
From: SHIN, HYUN-DONG
To: ANAM SEMICONDUCTOR, INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009822/0417 →
Assignment of Assignor's Interest Mar 30, 1999
From: KIM, SANG-YONG
To: ANAM SEMICONDUCTOR, INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009856/0534 →
Assignment of Assignor's Interest May 4, 1999
From: KIM, SUNG JIN
To: ANAM SEMICONDUCTOR,INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009939/0285 →
Assignment of Assignor's Interest May 12, 1999
From: JUSKEY, FRANK J.; MCMILLAN, JOHN R.; HUEMOELLER, RONALD P.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009961/0622 →
Assignment of Assignor's Interest May 24, 1999
From: LEE, BOK-HYUNG
To: ANAM SEMICONDUCTOR, INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009983/0543 →
Assignment of Assignor's Interest May 27, 1999
From: LEE, SEON GOO
To: ANAM SEMICONDUCTOR, INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009982/0759 →
Assignment of Assignor's Interest Jun 3, 1999
From: GLENN, THOMAS P.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 010016/0885 →
Security Interest Apr 16, 2001
From: SOCIETE GENERALE; GUARDIAN ASSETS, INC.
To: CITICORP USA, INC.
Reel/Frame 011682/0416 →
Security Interest Apr 16, 2001
From: AMKOR TECHNOLOGY, INC.
To: CITICORP USA, INC.
Reel/Frame 011712/0623 →
Merger and Change of Name May 31, 2002
From: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS INC.
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 012937/0461 →