Patent Assignment
Reel/Frame 011712/0623
Security Interest
Recorded: 2001-04-16
Pages: 10
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2001-03-30
Assignee
CITICORP USA, INC.
390 GREENWICH STREET, NEW YORK, NEW YORK, 10013
Covered Properties
(22)
Thermoplastic Semiconductor Package
Patent:
5,194,695 →
Application:
07/609,163 →
Lead Frame Workholder and Transport Apparatus and Method
Patent:
5,173,338 →
Application:
07/680,340 →
Thermoplastic Semiconductor Package and Method of Producing It
Patent:
5,239,806 →
Application:
07/977,523 →
Homogeneous Thermoplastic Semi-Conductor Chip Carrier Package
Patent:
5,471,011 →
Application:
08/250,153 →
Method of Making Homogeneous Thermoplastic Semi-Conductor Chip Carrier Package
Patent:
5,483,740 →
Application:
08/345,573 →
Method of Making Integrated Circuit Package Having Adhesive Bead Supporting Planar Lid Above Planar Substrate
Patent:
6,117,705 →
Application:
09/050,666 →
Integrated Circuit Chip to Substrate Interconnection
Patent:
6,163,463 →
Application:
09/078,377 →
Rf Shielded Device
Patent:
6,150,193 →
Application:
09/083,524 →
Plastic Integrated Circuit Package and Method and Leadframe for Making the Package
Patent:
6,143,981 →
Application:
09/103,760 →
Electromagnetic Interference Shield Driver and Method
Patent:
6,092,281 →
Application:
09/141,936 →
Carrier Strip and Molded Flex Circuit Ball Grid Array
Patent:
6,124,637 →
Application:
09/161,189 →
A Method of Making an Integrated Circuit Package Employing a Transparent Encapsulant
Patent:
6,143,588 →
Application:
09/176,048 →
Method for Forming Isolation Trenches on a Semiconductor Substrate
Patent:
6,114,217 →
Application:
09/199,706 →
Grid Array Type Lead Frame Having Lead Ends in Different Planes
Patent:
6,150,709 →
Application:
09/203,720 →
Method for Calibrating Optical Sensor Used to Measure the Temperature of a Substrate During Rapid Thermal Process
Patent:
6,132,081 →
Application:
09/220,987 →
Bump Chip Scale Semiconductor Package
Patent:
6,091,141 →
Application:
09/222,226 →
Mos Transistor That Inhibits Punchthrough and Method for Fabricating the Same
Patent:
6,200,841 →
Application:
09/223,236 →
Masking Process for Forming Self-Aligned Dual Wells or Self-Aligned Field-Doping Regions
Patent:
6,090,715 →
Application:
09/223,458 →
Trench Structure for Isolating Semiconductor Elements and Method for Forming the Same
Patent:
6,204,131 →
Application:
09/223,471 →
Thin Leadframe-Type Semiconductor Package Having Heat Sink with Recess and Exposed Surface
Patent:
6,198,163 →
Application:
09/420,065 →
Optical Sensor Array Mounting and Alignmemt
Patent:
6,117,193 →
Application:
09/422,008 →
Making solder ball mounting pads on substrates
Patent:
6,201,305 →
Application:
09/591,705 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Nov 2, 1990
From: MASLAKOW, WILLIAM H.
To: AK TECHNOLOGY, INC.
Reel/Frame 005506/0699 →
Assignment of Assignors Interest.
Apr 4, 1991
From: SHARP, JAMES B.; BOOTH, ROY; HAVENHILL, MAX
To: AK TECHNOLOGY, INC., A CORP. OF TEXAS
Reel/Frame 005661/0048 →
Assignment of Assignor's Interest
Jul 18, 1994
From: MASLAKOW, WILLIAM H.
To: AK TECHNOLOGY, INC.
Reel/Frame 007098/0741 →
Nunc Pro Tune Assignment
Jan 16, 1996
From: AK TECHNOLOGY, INC., A TEXAS CORPORATION
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007757/0680 →
Assignment of Assignor's Interest
Mar 30, 1998
From: GLENN, THOMAS P.; HOLLAWAY, ROY D.; PANCZAK, ANTHONY E.
To: AMKOR ELECTRONICS, INC.
Reel/Frame 009128/0937 →
Merger
Jun 19, 1998
From: AMKOR ELECTRONICS, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009269/0987 →
Assignment of Assignor's Interest
Jun 24, 1998
From: GLENN, THOMAS P.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009346/0342 →
Assignment of Assignor's Interest
Jun 26, 1998
From: GLENN, THOMAS P.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009284/0558 →
Merger
Jun 30, 1998
From: AMKOR ELECTRONICS, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009298/0132 →
Assignment of Assignor's Interest
Aug 28, 1998
From: GLENN, THOMAS P.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 009429/0666 →
Assignment of Assignor's Interest
Nov 24, 1998
From: PARK, YOUNG-TACK
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009630/0403 →
Assignment of Assignor's Interest
Dec 23, 1998
From: HAN, JAE-WON
To: ANAM SEMICONDUCTOR, INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009677/0420 →
Assignment of Assignor's Interest
Mar 15, 1999
From: SHIN, HYUN-DONG
To: ANAM SEMICONDUCTOR, INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009822/0417 →
Assignment of Assignor's Interest
Mar 15, 1999
From: KIM, SANG YONG
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009850/0395 →
Assignment of Assignor's Interest
Mar 30, 1999
From: KIM, SANG-YONG
To: ANAM SEMICONDUCTOR, INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 009856/0534 →
Assignment of Assignor's Interest
Oct 18, 1999
From: CROWLEY, SEAN T.; BOLAND, BRADLEY D.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 010331/0411 →
Assignment of Assignor's Interest
Oct 20, 1999
From: GLENN, THOMAS P.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 010334/0503 →
Assignment of Assignor's Interest
Jun 9, 2000
From: DARVEAUX, ROBERT F.; MILES, BARRY M.; COPIA, ALEXANDER W.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 010862/0803 →
Security Interest
Nov 15, 2000
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: SOCIETE GENERALE
Reel/Frame 011491/0917 →
Security Interest
Apr 16, 2001
From: SOCIETE GENERALE; GUARDIAN ASSETS, INC.
To: CITICORP USA, INC.
Reel/Frame 011682/0416 →
Merger and Change of Name
May 31, 2002
From: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS INC.
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 012937/0461 →
Merger and Change of Name
Jun 4, 2002
From: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
To: ANAM SEMICONDUCTOR INC.; AMKOR TECHNOLOGY, INC.
Reel/Frame 012950/0446 →
Assignment of Assignor's Interest
Aug 14, 2002
From: ANAM SEMICONDUCTOR, INC.
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 013193/0683 →
Assignment of Assignor's Interest
Sep 26, 2002
From: AMKOR TECHNOLOGY KOREA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 013323/0853 →
Security Agreement
Jul 6, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 014885/0691 →