Patent Assignment
Reel/Frame 009298/0132
Merger
Recorded: 1998-06-30
Pages: 3
Assignor
AMKOR ELECTRONICS, INC.
Executed: 1998-04-14
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Method of Making Integrated Circuit Package Having Adhesive Bead Supporting Planar Lid Above Planar Substrate
Patent:
6,117,705 →
Application:
09/050,666 →
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 30, 1998
From: GLENN, THOMAS P.; HOLLAWAY, ROY D.; PANCZAK, ANTHONY E.
To: AMKOR ELECTRONICS, INC.
Reel/Frame 009128/0937 →
Security Interest
Apr 16, 2001
From: AMKOR TECHNOLOGY, INC.
To: CITICORP USA, INC.
Reel/Frame 011712/0623 →
Security Agreement
Jul 6, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 014885/0691 →
Release of Lien on Patents
Jul 16, 2004
From: CITICORP USA, INC. AS COLLATERAL AGENT
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 015603/0572 →
Security Agreement
Nov 2, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS "AGENT"
Reel/Frame 015942/0521 →
Termination & Release of Patent Security Agreement
Jan 3, 2006
From: CITICORP NORTH AMERICA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 017388/0868 →
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054036/0599 →