IP Library › Assignment 013193/0683
Patent Assignment
Reel/Frame 013193/0683

Assignment of Assignor's Interest

Recorded: 2002-08-14 Pages: 10
Assignor
ANAM SEMICONDUCTOR, INC.
Executed: 2000-05-02
Assignee
AMKOR TECHNOLOGY KOREA, INC.
280-8, 2-GA SUNGSU-DONG, SUNGDONG-GU, SEOUL 133-120, KOREA, REPUBLIC OF
Covered Properties (55)
Mold Runner Removal from a Substrate-Based Packaged Electronic Device
Patent: 5,635,671 →
Application: 08/214,339 →
Heat Spreader Suitable for Use in Semiconductor Packages Having Different Pad Sizes
Patent: 5,641,987 →
Application: 08/479,885 →
Copper Oxide-Filled Polymer Die Attach Adhesive Composition for Semiconductor Package
Patent: 5,582,772 →
Application: 08/485,936 →
Semiconductor Lead Frame Having Connection Bar and Guide Rings
Patent: 5,723,899 →
Application: 08/520,429 →
Method for Checking a Wire Bond of a Semiconductor Package
Patent: 5,712,570 →
Application: 08/530,558 →
Semiconductor Package with Integral Heat Dissipator
Patent: 5,629,561 →
Application: 08/570,794 →
Bonding Method for Semiconductor Chips
Patent: 5,740,956 →
Application: 08/570,849 →
Chip Mounting Plate Construction of Lead Frame for Semiconductor Package
Patent: 5,661,338 →
Application: 08/571,316 →
Ball Grid Array Semiconductor Package with Improved Heat Dissipation and Dehumidification Effect
Patent: 5,729,432 →
Application: 08/588,172 →
Method and Circuit Board Structure for Leveling Solder Balls in Ball Grid Array Semiconductor Packages
Patent: 5,641,946 →
Application: 08/588,482 →
Unit Printed Circuit Board Carrier Frame for Ball Grid Array Semiconductor Packages and Method for Fabricating Ball Grid Array Semiconductor Packages Using the Same
Patent: 5,854,741 →
Application: 08/651,200 →
Wafer Map Conversion Method
Patent: 5,838,951 →
Application: 08/704,477 →
Method for Fabricating a Heat Sink-Integrated Semiconductor Package
Patent: 5,807,768 →
Application: 08/707,381 →
Method for Molding of Integrated Circuit Package
Patent: 5,637,273 →
Application: 08/729,540 →
Printed Circuit Board Having Epoxy Barrier Around a Throughout Slot and Ball Grid Array Semiconductor Package
Patent: 5,767,446 →
Application: 08/736,107 →
Ball Grid Array Semiconductor Package with Ring-Type Heat Sink
Patent: 5,708,567 →
Application: 08/748,937 →
Semiconductor Package Including Heat Sink with Layered Conductive Plate and Non-Conductive Tape Bonding to Leads
Patent: 5,854,511 →
Application: 08/749,450 →
Process for Bonding Semiconductor Chip
Patent: 5,858,149 →
Application: 08/749,578 →
Semiconductor Package and Method for Fabricating the Same
Patent: 5,858,815 →
Application: 08/763,605 →
Ball Gird Array Semiconductor Package Using a Metal Carrier Ring as a Heat Spreader
Patent: 5,905,633 →
Application: 08/775,212 →
Grid Array Type Lead Frame and Lead End Grid Array Semiconductor Package Employing the Same
Patent: 5,866,939 →
Application: 08/775,839 →
Semiconductor Chip Scale Package and Method of Producing Such
Patent: 5,915,169 →
Application: 08/777,927 →
Method of Forming Chip Bumps of Bump Chip Scale Semiconductor Package
Patent: 5,908,317 →
Application: 08/813,725 →
Solder Ball Land Metal Structure of Ball Grid Semiconductor Package
Patent: 5,872,399 →
Application: 08/825,945 →
Printed Circuit Board for Ball Grid Array Semiconductor Package
Patent: 5,981,873 →
Application: 08/882,248 →
Marking Bad Printed Circuit Boards for Semiconductor Packages
Patent: 6,021,563 →
Application: 08/882,687 →
Flexible Circuit Board for Ball Grid Array Semiconductor Package
Patent: 5,864,470 →
Application: 08/883,541 →
Ball Grid Array Semiconductor Package with Solder Balls Fused on Printed Circuit Board and Method for Fabricating the Same
Patent: 5,953,589 →
Application: 08/915,077 →
Mold for Ball Grid Array Semiconductor Package
Patent: 5,971,734 →
Application: 08/934,315 →
Semiconductor Package Having Light, Thin, Simple and Compact Structure
Patent: 5,986,334 →
Application: 08/942,784 →
Method for Reproducing Printed Circuit Boards for Semiconductor Packages Including Poor Quality Printed Circuit Board Units and Method for Fabricating Semiconductor Packages Using the Reproduced Printed Circuit Boards
Patent: 5,897,334 →
Application: 08/951,062 →
A Method for Manufacturing an Alumina-Silicon Carbide Nanocomposite
Patent: 5,894,008 →
Application: 08/951,890 →
Semiconductor Package and Method for Fabricating the Same
Patent: 5,977,624 →
Application: 09/008,552 →
Method of Manufacturing Ball Grid Array Semiconductor Package
Patent: 6,020,218 →
Application: 09/013,330 →
Method of Fabricating Semiconductor Package
Patent: 6,389,689 →
Application: 09/024,940 →
Publication: US 2001/0015009
Programmable and Flexible Power Management Unit
Patent: 6,212,645 →
Application: 09/169,438 →
Plastic Integrated Circuit Device Package and Leadframe Having Partially Undercut Leads and Die Pad
Patent: 6,281,568 →
Application: 09/176,614 →
Grid Array Type Lead Frame Having Lead Ends in Different Planes
Patent: 6,150,709 →
Application: 09/203,720 →
Bump Chip Scale Semiconductor Package
Patent: 6,091,141 →
Application: 09/222,226 →
"Printed Circuit Board for Ball Grid Array Semiconductor Packages"
Patent: 6,246,015 →
Application: 09/240,422 →
Thin, Stackable Semiconductor Packages
Patent: 6,303,997 →
Application: 09/287,711 →
Printed Circuit Board with Oval Solder Ball Lands for Bga Semiconductor Packages
Patent: 6,268,568 →
Application: 09/305,170 →
Method of Making an Electronic Device Package and Leadframe
Patent: 6,258,629 →
Application: 09/370,600 →
Wafer-Scale Production of Chip-Scale Semiconductor Packages Using Wafer Mapping Techniques
Patent: 6,589,801 →
Application: 09/385,694 →
Method for Laminating Circuit Pattern Tape on Semiconductor Wafer
Patent: 6,428,641 →
Application: 09/385,695 →
Circuit Pattern Tape for Wafer-Scale Production of Chip Size Semiconductor Packages
Patent: 6,479,887 →
Application: 09/387,377 →
Lead Frame Used for the Fabrication of Semiconductor Packages and Semiconductor Package Fabricated Using the Same
Patent: 6,437,427 →
Application: 09/391,792 →
Method for Molding a Leadframe in Plastic Integrated Circuit Devices
Patent: 6,455,356 →
Application: 09/395,875 →
Chip-Scale Semiconductor Package of the Fan-Out Type and Method of Manufacturing Such Packages
Patent: 6,462,274 →
Application: 09/422,027 →
Semiconductor Device and Method of Manufacturing Such Device
Patent: 6,489,667 →
Application: 09/422,115 →
Semiconductor Package and Method of Making Using Leadframe Having Lead Locks to Secure Leads to Encapsulant
Patent: 6,448,633 →
Application: 09/444,035 →
Semiconductor Package and Method for Fabricating the Same
Patent: 6,369,454 →
Application: 09/461,523 →
Package for Stacked Integrated Circuits
Patent: 6,414,396 →
Application: 09/490,317 →
Nonexposed Heat Sink for Semiconductor Package
Patent: 7,009,283 →
Application: 09/513,067 →
Leadframe for Molded Semiconductor Package and Semiconductor Package Made Using the Leadframe
Patent: 6,424,023 →
Application: 09/513,232 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 9, 1994
From: FREYMAN, BRUCE J.; BRIAR, JOHN; HEO, YOUNG WOOK; SHIM, IL KWON
To: AMKOR ELECTRONICS, INC.
Reel/Frame 006983/0372 →
Assignment of Assignor's Interest Sep 1, 1995
From: LEE, MYUNG JUN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007628/0172 →
Assignment of Assignor's Interest Sep 1, 1995
From: KWAK, CHEOL WOO
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007628/0169 →
Assignment of Assignor's Interest Sep 19, 1995
From: HEO, YOUNG WOK; YOUM, DONG SIN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007702/0642 →
Assignment of Assignor's Interest Dec 12, 1995
From: SEO, SEONG MIN; JANG, SUCK JU
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007810/0249 →
Assignment of Assignor's Interest Dec 12, 1995
From: YOO, YOUN CHEOL; YOO, HEE YEOUL; LEE, JEONG; PARK, DOO HYUN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007826/0113 →
Assignment of Assignor's Interest Dec 12, 1995
From: SHIN, WON SUN; DO, BYUNG TAE
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007799/0056 →
Assignment of Assignor's Interest Apr 22, 1996
From: SHIM, II KWON
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 007909/0419 →
Assignment of Assignor's Interest May 17, 1996
From: SHIM, II KWON; HEO, YOUNG WOOK
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008021/0392 →
Assignment of Assignor's Interest Jun 20, 1996
From: SHIM,IL KWON; HEO, YOUNG WOOK
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS,INC.
Reel/Frame 008002/0623 →
Assignment of Assignor's Interest Sep 3, 1996
From: SHIN, WON SUN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008229/0484 →
Assignment of Assignor's Interest Nov 6, 1996
From: SONG, CHEE JUNG
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008212/0685 →
Assignment of Assignor's Interest Nov 13, 1996
From: SHIM, IL KWON; HEO, YOUNG WOOK
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008315/0307 →
Assignment of an Undivided One-Half Interest Dec 2, 1996
From: AMKOR ELECTRONICS, INC.
To: ANAM INDUSTRIAL CO., LTD.
Reel/Frame 008249/0551 →
Assignment of Assignor's Interest Dec 9, 1996
From: SHIN, WON SUN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008284/0876 →
Assignment of Assignor's Interest Dec 31, 1996
From: SHIM, WON SUN; HAN, BYUNG JOON; YOON, JON HOON; KWAK, SUNG BUM
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS,INC.
Reel/Frame 008611/0126 →
Assignment of Assignor's Interest Jan 23, 1997
From: SEO, SEONG MIN; SONG, JAE HWAN
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008309/0564 →
Assignment of Assignor's Interest Feb 18, 1997
From: GOO, LEE
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008358/0659 →
Assignment of Assignor's Interest Feb 21, 1997
From: HA, SUN HO; HEO, YOUNG WOOK
To: ANAM INDUSTRIAL CO. LTD.
Reel/Frame 008372/0087 →
Assignment of Assignor's Interest Mar 7, 1997
From: HEO, YOUNG WOOK
To: ANAM INDUSTRIAL CO., LTD.
Reel/Frame 008448/0515 →
Assignment of Assignor's Interest Mar 28, 1997
From: HEO, YOUNG WOOK; HAN, BYUNG JOON
To: ANAM INDUSTRIAL CO. LTD.,
Reel/Frame 008441/0419 →
Assignment of Assignor's Interest Mar 31, 1997
From: SHIN, WON SUN; LEE, WON KYUN
To: ANAM INDUSTRIAL CO., LTD.
Reel/Frame 008433/0702 →
Assignment of Assignor's Interest May 12, 1997
From: HEO, YOUNG WOOK
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008499/0387 →
Assignment of Assignor's Interest Jun 25, 1997
From: HEO, YOUNG WOOK
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008779/0486 →
Assignment of Assignor's Interest Sep 23, 1997
From: EUNG, LEE MOO
To: ANAM INDUSTRIAL CO., LTD.; AMKOR ELECTRONICS, INC.
Reel/Frame 008716/0236 →