Patent Assignment
Reel/Frame 012950/0446
Merger and Change of Name
Recorded: 2002-06-04
Pages: 7
Assignors
ANAM INDUSTRIAL CO., LTD.
Executed: 1998-03-20
AMKOR ELECTRONICS, INC.
Executed: 1998-04-14
Assignees
ANAM SEMICONDUCTOR INC.
280-8, 2GA, SUNGSU-DONG SUNGDONG-KU, SEOUL, KOREA, REPUBLIC OF
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Property
(1)
Bump Chip Scale Semiconductor Package
Patent:
6,091,141 →
Application:
09/222,226 →
Related Assignments
(10)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Apr 16, 2001
From: AMKOR TECHNOLOGY, INC.
To: CITICORP USA, INC.
Reel/Frame 011712/0623 →
Assignment of Assignor's Interest
Aug 14, 2002
From: ANAM SEMICONDUCTOR, INC.
To: AMKOR TECHNOLOGY KOREA, INC.
Reel/Frame 013193/0683 →
Assignment of Assignor's Interest
Sep 26, 2002
From: AMKOR TECHNOLOGY KOREA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 013323/0853 →
Security Agreement
Jul 6, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 014885/0691 →
Release of Lien on Patents
Jul 16, 2004
From: CITICORP USA, INC. AS COLLATERAL AGENT
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 015603/0572 →
Security Agreement
Nov 2, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS "AGENT"
Reel/Frame 015942/0521 →
Termination & Release of Patent Security Agreement
Jan 3, 2006
From: CITICORP NORTH AMERICA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 017388/0868 →
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054036/0599 →