Patent Assignment
Reel/Frame 007098/0741
Assignment of Assignor's Interest
Recorded: 1994-07-18
Pages: 5
Assignor
MASLAKOW, WILLIAM H.
Executed: 1994-06-02
Assignee
AK TECHNOLOGY, INC.
2425 GATEWAY DRIVE, SUITE 200, IRVING, TEXAS, TEXAS, 75063
Covered Property
(1)
Homogeneous Thermoplastic Semi-Conductor Chip Carrier Package
Patent:
5,471,011 →
Application:
08/250,153 →
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tune Assignment
Jan 16, 1996
From: AK TECHNOLOGY, INC., A TEXAS CORPORATION
To: AMKOR ELECTRONICS, INC.
Reel/Frame 007757/0680 →
Security Interest
Apr 16, 2001
From: AMKOR TECHNOLOGY, INC.
To: CITICORP USA, INC.
Reel/Frame 011712/0623 →
Security Agreement
Jul 6, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 014885/0691 →
Release of Lien on Patents
Jul 16, 2004
From: CITICORP USA, INC. AS COLLATERAL AGENT
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 015603/0572 →
Security Agreement
Nov 2, 2004
From: AMKOR TECHNOLOGY, INC.; GUARDIAN ASSETS, INC.
To: CITICORP NORTH AMERICA, INC. AS "AGENT"
Reel/Frame 015942/0521 →
Termination & Release of Patent Security Agreement
Jan 3, 2006
From: CITICORP NORTH AMERICA, INC.
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 017388/0868 →
Security Agreement
Jan 3, 2006
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 017379/0630 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054036/0599 →