IP Library Assignment 011704/0041
Patent Assignment
Reel/Frame 011704/0041

Assignment of Assignor's Interest

Recorded: 2001-04-09 Pages: 2
Assignor
LAPTEV, PAVEL N.
Executed: 2001-04-02
Assignee
SPUTTERED FILMS, INC.
320 NOPAL STREET, SANTA BARBARA, CALIFORNIA, 93103
Covered Property (1)
System for, and Method of, Etching a Surface on a Wafer
Patent: 7,467,598 →
Application: 09/829,587 →
Publication: US 2003/0017709
Related Assignments (8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 21, 2005
From: SPUTTERED FILMS, INC.
To: TEGAL CORPORATION
Reel/Frame 017136/0098 →
Assignment of Assignor's Interest Jun 17, 2010
From: OEG-TEG, LLC
To: OEM GROUP INC.
Reel/Frame 024547/0404 →
Assignment of Assignor's Interest Jun 17, 2010
From: TEGAL CORPORATION
To: OEG-TEG, LLC
Reel/Frame 024547/0285 →
Security Agreement Oct 8, 2010
From: OEM GROUP, INC.
To: COMERICA BANK, A TEXAS BANKING ASSOCIATION
Reel/Frame 025105/0799 →
Security Agreement Oct 15, 2010
From: OEM GROUP, INC.
To: THL CORPORATE FINANCE, INC.
Reel/Frame 025137/0859 →
Release of Security Interest Nov 21, 2014
From: COMERICA BANK
To: OEM GROUP, INC.
Reel/Frame 034233/0481 →
Change of Name Mar 14, 2016
From: OEM GROUP, INC.
To: OEM GROUP, LLC
Reel/Frame 038083/0231 →
Security Interest Apr 5, 2016
From: OEM GROUP, LLC
To: THL CORPORATE FINANCE, INC., AS COLLATERAL AGENT
Reel/Frame 038355/0078 →